TECHNICAL SESSIONS
AAT1 Package on Package Assembly Optimization
10:30am - 12:30p, Asia 1
DCA1 Solder Bumping and Si-on-Si Assembly
10:30am - 11:30a, Oceanic 8
SMT1 Fine/Ultrafine Pitch Printing
10:30am - 12:30p, Asia 2
MFX1 Conformal Coating
10:30am - 12:30p, Oceanic 3
AAT2 Characterization of Package on Package
2:00pm - 3:30p, Asia 1
DCA2 New Applications and Processes
2:00pm - 3:30p, Oceanic 8
SMT2 Cleaning for Today’s Challenging Designs
2:00pm - 4:00p, Asia 2
MFX2 Alternate Lead-Free Alloys
2:00pm - 3:30p, Oceanic 3
EMS1 Outsourcing Strategies
2:00pm - 3:30p, Europe 1
AAT3 Assembly Challenges With BGA/LGA
4:00pm - 5:30p, Asia 1
SMT3 Cleanliness Measurement and Monitoring Issues
4:00pm - 5:30p, Asia 2
MFX3 High Speed Connector Attachment Technology
4:00pm - 5:30p, Oceanic 3
EMS2 Segment Focus: Aerospace/Defense
4:00pm - 5:30p, Europe 1
BUS1 Managing Indirect Material Cost for High-Reliability Applications
4:00pm - 5:30p, Oceanic 8
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FREE SPECIAL EVENT
Opening Session
Technology Turning Point
8:00am - 9:30am, Atlantic A
FREE SESSIONS
Reducing Manufacturing Variation
10:30am - 11:30am, Exhibit Hall Theater
BGA Inspection Using Dye and Pry
11:30am - 12:30pm, Exhibit Hall Theater
FREE Lunch
Everyone is welcome to join us 12-2pm for a free lunch and poster session on the show floor.
12:00pm - 2:00pm, Show Floor
BGA Reballing Workshop
2:00pm - 3:30p, Exhibit Hall Theater
Prevention and Detection of Counterfeit Electronics
3:30pm - 4:30p, Exhibit Hall Theater
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I really enjoyed the meaningful presentations specific to real world assembly processes.
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