October 24 - 28, 2010   Walt Disney World Swan and Dolphin Resort   Orlando, FL     Conference    Tutorials        Instructors    Tech Sessions    Symposiums    Sponsors At-A-Glance    Sunday    Monday    Tuesday    Wednesday    Thursday Special Events Golf Free Sessions Poster Session Job Center Accommodations Register Now Be A Sponsor! Marketing Ask Your Boss Next Year The three biggest draws for me to SMTAI are its world class electronics manufacturing conference, its excellent industry networking opportunities and its best in class exhibition. -Dan Baldwin, Ph.D., Engent, Inc. Follow the event on Facebook! Official Twitter hashtag #smtai2010 Add to My Outlook Calendar Sessions are 1.5 hour programs in which three technical papers are presented under the direction of a chairman. Each paper is presented by the author on a topic related to the main subject of the session, and is followed by audience questions. The objective of a technical session is to bring new scientific and technical developments to light. Emphasis is placed on original, previously unpublished papers. Organized by track, and by day within each track. The objective of a technical session is to bring new scientific and technical developments to light. Emphasis is placed on original, previously unpublished papers. Monday 8:00 – 9:30am 10:00am – 12:00pm 12:00 – 1:30pm 1:30 – 3:00pm 3:30 – 5:00pm Tuesday 10:30am – 12:30pm 2:00 – 3:30pm 4:00 – 5:30pm Wednesday 8:00 – 9:30am 10:30am – 12:00pm 2:00 - 3:30pm 4:00 - 5:30pm Thursday 8:00 – 9:30am 10:00 – 11:30am 1:00 – 2:30pm 3:00 – 4:30pm Please note that speakers with a icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done. MONDAY, OCTOBER 25 8:00am – 9:30am ET1 MEMS and Image Sensor Assembly Processing and Reliability Chair: Steve Greathouse, Plexus Corporation Co-Chair: Lars Böttcher, Fraunhofer IZM Monday, October 25 8:00am–9:30am, Asia 1 Micro Electrical Mechanical Systems (MEMS) are finding their way into almost all phases of life. As the population grows and matures, society is demanding better and much more cost effective diagnostic products to improve long-term health and well being. For many MEMS technologies to function, the package needs to have access and interact with the environment. This can present numerous challenges in the design and manufacturing process. You will be missing a great MEMS session if you don’t attend! Encapsulation of MEMS/Sensors on Package Level and Wafer Level Ton van Weelden, Boschman Technologies B.V. Reliability Testing of Linear Image Sensor Devices Awni Qasaimeh, Mridula Gosavi, Frank Andros, and Susan Lu, Binghamton University Development and Characterization of a Novel BioMEMS Sensor for Point-of-Care Prognostics Arvind Sai Sarathi Vasan, Yunhan Huang, Ravi Doraiswami, Ph.D., Michael Osterman, Ph.D., and Michael Pecht, Ph.D., Center for Advanced Life Cycle Engineering (CALCE), University of Maryland HE1 Pb-Free Technology Insertion Chair: John Evans, Ph.D., Auburn University Co-Chair: Heather McCormick, Celestica Inc. Monday, October 25 8:00am – 9:30am, Oceanic 7 The Pb-free (Lead-free) in Electronics Risk Mitigation (PERM) Consortium Anthony Rafaneiil, Raytheon Integrated Defense Systems Overview of the New DoD Reliability Revitalization Initiatives James McLeish, CRE, DfR Solutions; Grant R. Schmieder, CRE, Defense Research and Engineering Transition to Lead Free Production for Avionics, Steps Forward Along a Lead Free Control Plan and Further Requirements Michael Jeremias, EADS Deutschland GmbH MONDAY, OCTOBER 25 10:00am – 12:00pm ET2 Advanced Packages and Processes Chair: Andrew Perkins, Ph.D., Aptina Imaging Co-Chair: Brian Roggeman, Universal Instruments Monday, October 25 10:00am – 12:00pm, Asia 1 Advancements in packaging processes are needed for products with exotic semiconductor materials, nanocomposite materials, through silicon vias, and multiple components. This session presents wafer edge protection during TSV formation as well as package considerations for CZT detectors, RF MMIC devices, and microfabricated neural electrode arrays made from a variable-modulus nanocomposite material. Insight will be gained as to how conventional packaging processes like die handling and wirebonding can be modified for new packaging requirements. A Cost Effective Process for Edge Protection of Wafers and Fabrication of Through Silicon Vias Using Wet Etching of Silicon Ramachandran Trichur, Gary J. Brand, Curtis Planje, and Xie Shao, Brewer Science, Inc. Challenges of Packaging Cd-Zn-Te (CZT) Detectors Charles G. Woychik, Ph.D., Brian D. Yanoff, Jay Cao, Ian M. Spinelli, and Vincent S. Smetkowski, GE Global Research; James Adriance, Lawrence Harvilchuck, Brian Roggeman, and George Westby, Universal Instruments Corporation Overcoming Assembly Challenges with RF MMIC Products Steve Greathouse, Richard Garcia, Jennifer Davidson, and Gary Catlin, Plexus Corporation Development of a Packaging System for Clinical Evaluation of a Nanocomposite-Based Neural Electrode Array Fabricated From a Chemoresponsive Polymer Substrate Andrew Barnes and Allison Hess, Case Western Reserve University HE2 Component Packaging Challenges in Harsh Environments Chair: Salvatore Rampaul-Pino, Vision Research Co-Chair: Larry Wang, Lord Corporation Monday, October 25 10:00am – 12:00pm, Oceanic 7 High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Circuits Steve Riches, GE Aviation Systems The Resistance of Common PCB Surface Finishes Against Corrosion in Harsh Environments Mustafa Özkök, Sven Lamprecht, and Mario Gensicke, Atotech Deutschland GmbH, Hugh Roberts and Joe McGurran, Atotech USA How Do Whiskers and Hillocks Grow in Pb-free Sn Coatings? Eric Chason, Nitin Jadhav, Eric Buchovecky, Allan Bower, and Sharvan Kumar, Brown University Harsh Environment Impact on Resistor Reliability Marie Cole, George Hutt, Tibor Kiraly, Steve Nickel, Lenas Hedlund, Tim Tofil, Prabjit Singh, and Levente Klein, IBM Corporation MONDAY, OCTOBER 25 12:00pm – 1:30pm Evolving Technologies Keynote Lunch Reading the Fine Print: Challenges and Outlook for Printed Electronics Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Monday, October 25 12:00pm – 1:30pm, Asia 1 Harsh Environments Keynote Lunch The Tech in Green Tech Irene Sterian, Celestica Inc. Chair: John Evans, Ph.D., Auburn University Co-Chair: Heather McCormick, Celestica Inc. Monday, October 25 12:00pm – 1:30pm, Oceanic 7 MONDAY, OCTOBER 25 1:30pm – 3:00pm ET3 Printed Electronics: Solar, Lighting, Batteries, Etc. Chair: Alexander Zeitler, Soligie, Inc. Co-Chair: Jeff Kennedy, Celestica Inc. Monday, October 25 1:30pm – 3:00pm, Asia 1 Printed electronics is a new and emerging technology which uses conductive, semi-conductive, and dielectric inks printed with a multitude of methods on paper and plastic film substrates to produce mass production of products. This session will discuss the market of printed electronics trends and barriers, OLED construction and production methods, and all processes and materials that make-up the industry. After this session, you will leave with a good understanding of what it is about and a high level understanding of what it takes to build these products. Organic and Printed Electronics-A View From the Traditional Electronic Component Marketplace David Baron and Frank Bruening, Atotech Deutschland GmbH Printed Electronics for Flexible Solid State Lighting Marc Chason, Marc Chason and Associates, Inc. Materials and Process Methods for Printed Electronics Dan Fenner and Brian Toleno, Ph.D., Henkel Corporation HE3 Organic Materials Adapted for Harsh Environments Chair: Larry Wang, Lord Corporation Co-Chair: Salvatore Rampaul-Pino, Vision Research Monday, October 25 1:30pm – 3:00pm, Oceanic 7 Harsh Environments and Volatiles in Sealed Enclosures Robert Lowry, Richard Kullberg, and Dan Rossiter, Electronics Materials Consulting Functional Fillers in Silicone Elastomer Systems Michelle Velderrain and V. Malave, NuSil Technology An Evaluation of Sealants Used in Photovoltaic (PV) Module Jasbir Bath, Mike Moreau, and Martin Gershenson, Christopher Associates Inc.; Cathy He, Yinbai Li, and Miaosheng Zheng, Beijing Tonsan Adhesive Co. Ltd. MONDAY, OCTOBER 25 3:30pm – 5:00pm ET4 Evolving Technology and Current Issues Panel - FREE Beer and Pretzels! Chair: Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory Co-Chair: Jeff Kennedy, Celestica Inc. Monday, October 25 3:30pm – 5:00pm, Asia 1 Come and join the team of industry experts to learn where the technology is heading and the current key issues in packaging, surface mount materials and manufacturing. Experts from industry will first present an overview of current and future technology, current status of solar and the SMT relationship, as well as a special presentation on challenges of embedded capacitors. Bring your challenging issues/questions from work to get answers from experts who provide unique perspectives based on their experience. New Challenges and Developments in Discrete and Embedded Capacitors Alan Rae, Ph.D., TPF Enterprises LLC Panelists will include: Lars Böttcher, Fraunhofer IZM, (Advanced Packaging in Europe) Ken Gilleo, Ph.D., ET-Trends LLC, (The Next Generation) Steve Greathouse, Plexus Corporation, (New/Evolving Technologies) Alan Rae, Ph.D., TPF Enterprises LLC, (Nano Materials and Embedded Technology) Irene Sterian, Celestica Inc., (Solar Energy and SMT) Charles Woychik, Ph.D., Tessera (Advanced Packaging) HE4 Interconnection Reliability Chair: Heather McCormick, Celestica Inc. Co-Chair: John Evans, Ph.D., Auburn University Monday, October 25 3:00pm – 5:00pm, Oceanic 7 Ball Grid Array Component Failure Analysis for High Reliability Electronic Systems J. Scott Nelson, Harris Corporation Solder Joint Reliability Issues With LED Assemblies Alissa Wild and Justin Kolbe, The Bergquist Company High Temperature Reliability Bond Pads Terence Collier, CV, Inc. Interrogation of Damage-State in Lead-Free Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling Pradeep Lall, Ph.D., Rahul Vaisya, and Vikrant More, Auburn University; Kai Goebel, NASA Ames Research Center TUESDAY, OCTOBER 26 10:00am – 12:30pm AAT1 Package on Package Assembly Optimization Chair: Randy Schueller, Ph.D., DfR Solutions Co-Chair: Andrew Mawer, Freescale Semiconductor Tuesday, October 26, 10:30am – 12:30pm, Asia 1 Package on package (PoP) has become a popular packaging strategy for increasing density and performance of electronic assemblies. However, with this new technology comes assembly challenges. The papers in this session will provide results of studies to determine the best solder fluxes and paste materials needed for assembling the packages together (using dip transfer). The final paper goes further and shares the results from a detailed DOE revealing the best oven parameters to use in assembling the final PoP to the board (along with drop and thermal shock test results). If you are involved in PoP assembly these papers will be extremely valuable. An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications Jasbir Bath, Manabu Itoh, Gordon Clark, Masatoshi Fuji, and Hajime Takahashi, Koki Company Limited; Jasbir Bath and Roberto Garcia, Christopher Associates Inc. Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D., Indium Corporation Surface Mount Performance of 0.4mm Pitch Solder Joints With Focus on Stacking Materials and Processes of Package-on-Package Applications Myung Jin Yim, Ph.D., Numonyx, Inc. Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly Rangaraj Dhanasekaran, Harish Gadepalli, and S. Manian Ramkumar, Ph.D., Rochester Institute of Technology SMT1 Advances in Stencil Technologies for Fine/Ultrafine Pitch Printing Chair: Joseph Belmonte, ITM Consulting/Creyr Innovation Co-Chair: Denis Barbini, Ph.D. Tuesday, October 26, 10:30am – 12:30pm, Asia 2 Achieving the appropriate area ratios and wall finishes is very critical in the design and manufacture of stencils for smaller passive devices and fine/ultrafine pitch area array packaging. This session will provide findings from the perspective of a stencil manufacturer, an end user and academia. The session will highlight the stencil materials, manufacturing and aperture coating methods to provide good paste transfer efficiency. Stencil Enabling Processes for Small Area Ratios William E. Coleman, Ph.D., Photo Stencil Stencil Performance Comparison Richard Lieske, DEK Stencil Technologies for Small Aperture Printing Kevin Liticker, Rockwell Automation Characteristics and Potentials of Nano-Coated Stencils for Stencil Printing Optimization Michael Rösch and Jörg Franke, University of Erlangen-Nuremberg; Carmina Läntzsch and Georg Kleemann, LaserJob GmbH MFX1 Conformal Coating for Today's Electronics Industry Chair: Jason Keeping, P.E., Celestica Inc. Co-Chair: Mike Nadreau, Henkel Corporation Tuesday, October 26, 10:30am – 12:30pm, Oceanic 3 Conformal Coating (CC) has been the most prominent surface protection finish within the Electronics Manufacturing Systems (EMS) Industry for many years, including the initial years of pin-through-hole technology. With increased environmental knowledge and legislation in the 20th century to better our well being, Conformal Coating materials were also required to be modified. Thus, new environmental friendly blends of coatings and processes have evolved. How to Deal With Problem Areas During Selective Conformal Coating Arjen Koppens, DIMA Group Moisture-Cure Polyurethanes – Latest Developments in VOC-free Conformal Coatings Jade Bridges, Electrolube Ltd. Ultraviolet Conformal Coating Process Development Corey Peterson, Rockwell Automation Environmental Friendly Vapor Phase Conformal Insulation Options for Reliability Improvement of Electronics Rakesh Kumar, Specialty Coating Systems, Inc. DCA1 New Approach to Solder Bumping and Optimization of Si-on-Si Assembly Chair: Charles Woychik, Ph.D., Tessera, Inc. Co-Chair: Anurag Bansal, Ph.D., Cisco Systems, Inc. Tuesday, October 26, 10:30am – 11:30am, Oceanic 8 A Polyimide over UBM, also known as POU, is a new bump structure where the polyimide sits on top of the UBM. This design can be used to reduce the mechanical stress in the solder bump. A new process has been developed to do a plated POU bump. A Design of Experiment (DOE) methodology was used to optimize a Pb-free flip chip assembly process for 3D chip stacking. Reliability test data will be presented to support the optimized process conditions. Polyimide Over UBM Process, The Challenges and Solutions on Plating Bump Process Roden Topacio, AMD Pb Free Reflow Profile Process Study for High Yield, High Reliability Flip Chip on Silicon Substrate Assembly Sangil Lee and Daniel Baldwin, Ph.D., Georgia Institute of Technology; Brian Lewis and Paul Houston, Engent Inc.; Gene Stout and Ted Tessier, FlipChip International LLC; Zhaozhi Li and John Evans, Ph.D. and Auburn University Free Lunch! Everyone is welcome to join us 12-2pm on Tuesday (October 26) for a free lunch on the show floor. TUESDAY, OCTOBER 26 2:00pm – 3:30pm AAT2 Mechanical and Electrical Characterization of Package on Package Systems Chair: Sheldon Schwandt, Research In Motion Co-Chair: Heather McCormick, Celestica Inc. Tuesday, October 26, 2:00pm – 3:30pm, Asia 1 The proliferation of PoP systems in electronics has continued to grow dramatically in 2010 and the wealth of data collected for discrete systems needs to be collected for Package on Package systems. The impact of material selection, such as solder alloys, plays a large role in the overall system reliability and the collection of critical data is needed to help optimize solutions for future use in everything from consumer electronics to military. Reliability Testing of Package-on-Package Assemblies That Use Underfill and Pb-Free and Mixed Solder Interconnections P. Vianco, Ph.D., J. Rejent, J. Grazier, A. Kilgo, and M. Neilsen, Sandia National Laboratories; F. Verdi and C. Meola, American Competitiveness Institute Characterization of Thermal-electrical and Mechanical Behavior of PoP Kirsten Weide-Zaage, Ph.D., Leibniz University and L. Meinshausen, University Bordeaux Thermal Cycling Reliability of Package on Packages Assembled by One-Pass and Two-Pass Techniques Vikram Srinivas, Nicholas Williard, Preeti Chauhan, Michael Osterman, Ph.D., and Michael Pecht, Ph.D., Center for Advanced Life Cycle Engineering (CALCE), University of Maryland; Robert Farrell, Benchmark Electronics, Inc. SMT2 Cleaning for Today's Challenging Designs Sexton: pls remove yellow… Chair: Linda Woody, Lockheed Martin Co-Chair: Laura Turbini, Ph.D., Research In Motion Tuesday, October 26 2:00pm – 4:00pm, Asia 2 Emerging package technology is driving electronics to smaller more dense circuit cards. This trend to very high density low standoff parts is causing great concern for those required to remove all flux residues. This session will explore the compatibility of the new flux chemistries with the available cleaning chemistries, investigate the requirements for the new low standoff packages, and finally compare the different cleaning equipment technologies available today. Historic Benchmark Study: pH-Neutral vs. Alkaline Cleaning Agents Harald Wack, Ph.D. and Umut Tosun, ZESTRON America; John Neidermann, Speedline Technologies Issues and Concerns in Cleaning Under Low Profile Components Richard Brooks, Kyzen Corporation Big Cleaning Job vs. Small Cleaners: The Advantages and Pitfalls of Going Small Eric Camden, Foresite Clean "No-Clean" or Use a Water Wash Solder Paste? Gerjan Diepstraten, and Tim Lawrence, Ph.D., Cobar Europe B.V. Balver Zinn MFX2 Alternate Lead-Free Alloys: Materials and Processes Chair: Ron Lasky, Ph.D., P.E., Indium Corporation Co-Chair: Phil Zarrow, ITM Consulting Tuesday, October 26, 2:00pm – 3:30pm, Oceanic 3 For a few years it appeared that the electronics assembly industry might settle on SAC305 as the alloy of choice for SMT lead-free assembly. More recent developments have established that SAC105 provides improved drop shock performance. Earlier work had shown that small quantities of dopants dramatically improved the performance of SnCu wave solder alloys. The confluence of these and other findings have resulted in considerable new work on alternate lead-free alloys. In addition, mixed alloy systems (leaded and lead-free solders) still pose many challenges. The papers in this session will address some of these issues. Low-Silver BGA Assembly, Phase 2: Reliability Assessment, Sixth Report, Thermal Cycling Gregory Henshall, Ph.D., and Michael Fehrenbach, Hewlett-Packard Company; Chrys Shea, Shea Engineering Services; Quyen Chu and Girish Wable, Jabil Circuit; Ranjit Ph.D., Cookson Electronics; Ken Hubbard and Gnyaneshwar Ramakrishna, Cisco Systems; Ahmer Syed, Amkor Technology The Development of an Improved Tin-Zinc Solder Keith Sweatman, Takashi Nozu, and Tetsuro Nishimura, Nihon Superior Co. Ltd. The Effect of Silver Content on the Solder Joint Reliability of a Pb-free PBGA Package Richard Coyle, Ph.D., Peter Read, Richard Popowich, Debra Fleming, and John Manock, Alcatel-Lucent; Heather McCormick, Celestica Inc.; John Osenbach, Ph.D., LSI Corporation DCA2 New Applications and Processes Chair: Don Banks, St. Jude Medical Co-Chair: Lars Böttcher, Fraunhofer IZM Tuesday, October 26, 2:00pm – 3:30pm, Oceanic 8 As flip chip devices gain more market acceptance, technology advances continue. The design and assembly challenges of capacitive micro-machined ultrasound transducers (cMUTs) attached to organic carriers are presented. Next is a discussion of embedded actives and passives in which components are moved from the surface into the build-up layers of laminate substrates. New vialess processing is covered. Last is a non-local two-dimensional model to evaluate interfacial thermal stresses and deformation in Pb-free flip chip ball grid array. Packaging High Density Capacitive Micro-Machined Ultrasonic Transducers (cMUT) Sensor Arrays Using HyperBGA Technology – Part II Charles G. Woychik, Robert Wodnicki, and Kai Thomenius, GE Global Research; Glen Thomas, Irv Memis, Ulises Penaherrera, Barry Bonitz, and Todd Davies, Endicott Interconnect Technologies, Inc. Next Generation System in a Package Manufacturing Lars Böttcher and A. Ostmann, Fraunhofer IZM; D. Manessis, and S. Karaszkiewicz, Technical University of Berlin Thermal Warpage and Interfacial Stresses in Micro-level Trilayer Structures: Experiment and Mathematical Modeling H. Lu, Ph.D., Alireza Shirazi, and A. Varvani-Farahani, Ryerson University EMS1 Outsourcing Strategies: Niche Requirements and EMS Best Practices Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine Co-Chair: Sue Mucha, Powell-Mucha Consulting, Inc. Tuesday, October 26, 2:00pm – 3:30pm, Europe 1 Determining whether to outsource is sometimes the simplest part of the decision tree. Deciding where and with whom to outsource is often what determines success or failure. Two of this session's presentations will help shape the OEM buyer's or engineer's approach to choosing the best fit for their product and service requirements. Meanwhile, the final paper looks at the equation from the OEM's perspective, outlining just what makes a best-in-class EMS company for a high-growth market. ODM or EMS: Which Choice is Best for Your Project? Jim Chen, Tailyn Communication Company Ltd. How Efficient Is Your High Mix EMS Supplier? Roy Starks, Libra Industries, and Dave Cesar, The Parkland Group Outsourcing LED PCB Manufacture Scott Maudlin, LEDnovation TUESDAY, OCTOBER 26 4:00pm – 5:30pm AAT3 Assembly Challenges With BGA/LGA Chair: Andrew Mawer, Freescale Semiconductor Co-Chair: Ken Gilleo, Ph.D., ET-Trends LLC Tuesday, October 26, 4:00pm – 5:30pm, Asia 1 This session will cover some common issues being experienced with the surface mount assembly of BGA and LGA components. The first paper outlines some of the unique challenges associated with using LGA components and provides solutions to overcome them. The second presentation goes over many of the factors that can contribute to one of the most common BGA SMT defects being experienced today, Head in Pillow or HiP. The last paper covers the assembly reliability of a large BGA with two different alloys of Pb-free spheres assembled with SnPb solder paste. Land and Solder Grid Array SMT Assembly Challenges Dudi Amir, Intel Corporation Head in Pillow: Alarm Still Ringing... Continuation Study on Known Chemical and Mechanical Factors in BGA Non-Wet Derek Daily and Satoru Akita, Senju Comtek Corporation; Masato Shimamura, SMIC A Reliability Comparison of SAC305 and SAC105 Plastic Ball Grid Arrays Assembled with Backward Compatible Processes Richard Coyle, Ph.D., Peter Read, Richard Popowich, Debra Fleming, and John Manock, Alcatel-Lucent; Heather McCormick, Celestica Inc.; John Osenbach, Ph.D. LSI Corporation SMT3 Cleanliness Measurement and Monitoring Issues Chair: Dale Lee, Plexus Corporation Technology Group Co-Chair: Mumtaz Bora, Peregrine Semiconductor Tuesday, October 26, 4:00pm – 5:30pm, Asia 2 The first documented issue of cleanliness in electrical assemblies was in 1947 by Grace Murray with the identification of a moth trapped between points on a relay (#70, Panel F) of the Mark II Aiken Relay Calculator (a primitive computer). This instance not only documents the importance of cleanliness in assemblies but the importance of location. With the advent of through component mass soldering processes in the seventies, the one side of the entire assembly was covered with mostly organic based fluxes in an alcohol based liquid. Cleanliness measurement systems were developed based on these conditions. However, with today's electronic assemblies, flux chemistries are only applied only to localized areas that require solder with fluxes that may be "VOC" free. It is not the lack of cleanliness of the entire board which causes the electrical failure but the lack of cleanliness between two pads of a critical circuit. This session will address cleanliness measurement/ monitoring issues with what should be measured that would impact reliability and methods for measurement of these elements. How Clean is Clean? Graham Naisbitt, Gen3 Systems Limited Electro-Chemical Migration (ECM) Risk Assessment Index - Ionic Contamination Extraction Effectiveness and Correlation of Analysis Methods Pravin Sequeira, Kantesh Doss, Ph.D., and Arnold Hogrefe, Jabil Circuit, Inc. Validation of a New "ROSE" Test Mike Bixenman, DBA, Kyzen Corporation and Steve Stach, Austin American Technologies MFX3 High Speed Connector Attachment Technology Chair: Jim Zanolli, TEKA Interconnection Systems Co-Chair: Heather McCormick, Celestica Inc. Tuesday, October 26, 4:00pm – 5:30pm, Oceanic 3 Increasing customer requirements for performance, density and reliability are creating challenges for the design and manufacturing of connectors as well as PCB assembly, rework and reflow processing. This session will address these areas with specific emphasis on connector area array and press-fit technologies. Pressfit Interconnection Assembly Challenges and Solutions Alex Chen, Hyman Liang, HM Chan, James Huang, and Wai Mun Lee, Celestica Inc.; Phil Isaacs and Sven Peng, IBM Corporation Long-Term Reliability Assessment of a New Lead Free Area Array Connector System Chrys Shea, Shea Engineering Services; Takashi Kikuchi, Hirose USA; Jean-Paul Clech, Ph.D., EPSI Inc.; Quyen Chu, Jabil Circuit, Inc.; Gnyaneshwar Ramakrishna, Cisco Systems New Solder Attach in Area Array Connector: Assessing the Reliability of Solder Charge SMT Assembly Theeraphong Kanjanupathum and Teng Hoon Ng, Celestica Inc.; Adam Stanczak, Molex EMS2 EMS Segment Focus: Aerospace/Defense Chair: Sue Mucha, Powell-Mucha Consulting, Inc. Co-Chair: Mike Buetow, CIRCUITS ASSEMBLY Magazine Tuesday, October 26, 4:00pm – 5:30pm, Europe 1 This year's Contract Manufacturing Symposium inaugurates a new type of session focused on a specific market segment. The defense and aerospace segment provides both opportunity and challenges. Presentations look at the differences between this segment and consumer EMS program management models, maintaining ITAR compliance, and improving factory material handling efficiency while maintaining required controls and traceability. Maintaining a Balance Between Consumer and Military Program Management Alan Day, IEC/Crane ITAR Compliance – Challenges and Benefits in an Outsourced Relationship Joe O'Neill, Hunter Technology Corporation Practical Issues and Solutions for Handling Plastic Encapsulated Microcircuits (PEMs) Rick Iodice, Raytheon Integrated Defense Systems BUS1 Managing the Escalating Indirect Material Costs for High-Reliability Applications Chair: Gary Tanel, Circuitronics Inc. Co-Chair: Jim Baker, Spectra Sales Corporation Tuesday, October 26, 4:00pm – 5:30pm, Oceanic 8 Parts are becoming obsolete far before the end of the product life. This session will discuss ways to deal with this reality. The aerospace, medical, and military markets are being hit hard by the reduction of SN/Pb solder; forcing them to take extraordinary means to ensure component availability through the life of the product. The supply chain is being driven by the high volume RoHS marketplace and increasing the availability gap for the lower volume products. Managing the Life-Time-Buys and counterfeit parts is forcing the system price upward to the point where it is setting the value of the system being manufactured. This session is directed to fit the needs of the supply chain managers and product designers in the high-reliability marketplace. Bridging Supply Chain Gap for High-Reliability "OEM's" Tin Whisker Mitigation & Counterfeit Detection Hal Rotchadl, Premier Semiconductor Services The End of Obsolescence - Managing End of Life Electronic Components Lee Melatti, Channel One International Electronic Product Assembly in the Global Marketplace: The Material Piece of the Competitive Puzzle Tom Borkes, The Jefferson Project WEDNESDAY, OCTOBER 27 8:00am – 9:30am AAT4 Assembly of Bottom Termination Components Chair: Ahmer Syed, Amkor Technology Co-Chair: Hugh Roberts, Atotech USA Wednesday, October 27, 8:00am – 9:30am, Asia 1 This session covers various issues related to solderability and assembly of bottom termination packages to the board. This includes the effect of lead termination finish on solderability, assembly of QFN packages using process parameters optimized for mixed and high thermal mass components, and room temperature bonding of D-Pack components for LED applications. Quad Flat No Lead (QFN) Package Processing in High Thermal Mass Assembly Jinda Songninluck and Teng Hoon Ng, Celestica Inc. NiPdGold Plating Qualification of RFIC Packages Mumtaz Bora, Peregrine Semiconductor Room Temperature LED and D-Pack Type Component Attach and Reliability Testing Mario Scalzo and Tommy Acchione, Indium Corporation SMT4 Conquering Broadband Stencil Printing Challenges Chair: Jeff Schake, DEK USA Co-Chair: Denis Jean, Plexus Corporation Wednesday, October 27, 8:00am – 9:30am, Asia 2 Following the conventional evolution of stencil printing, stencil aperture dimensions must scale smaller to fit shrinking component dimensions. However, this increases the challenge of satisfying aperture area ratio guidelines using uniform thickness stencils to balance solder volume requirements against a broadening range of component sizes. Progress to expand the solder printing process window via innovations in machine, stencil, and solder paste will be presented. New Developments in Broadband Printing Techniques Mark Whitmore and Clive Ashmore, DEK Printing Machines Ltd. Evaluation of Nano-Coated Stencil for Ultra Fine Pitch Component Assembly Rita Mohanty, Ph.D., Speedline Technologies Effectively Implementing Fine Powder Solder Pastes in Assembling Ultra Fine Pitch Components Ed Briggs, Indium Corporation MFX4 Lead-Free Wave Soldering Process for Today's Challenges Chair: Ursula Marquez de Tino, Ph.D., Plexus Corporation Co-Chair: Chris Nash, Indium Corporation Wednesday, October 27, 8:00am – 9:30am, Oceanic 3 Thick, complex Printed Circuit Boards using lead-free wave soldering processes creates many challenges for the board assembler. Various process, design, and material parameters can be optimized to overcome difficulties during assembly. An optimized assembly will result also on higher reliability of through holes and SMD components. Lead-Free Wave Soldering for Process and Product Design Improvement in SnCu Alloys Juthathip Fangkangwanwong and Teng Hoon Ng, Celestica Inc. Challenges in Lead-Free Wave Soldering Sunil Gopakumar, Francois Billaut, and Eric Fremd, Brocade Communications; Chris Chu, K.Y. Tsai, and Chu Lin, FoxConn; Jasbir Bath, Bath Technical Consultancy iNEMI Pb-Free Wave Soldering Project: An Investigation of Reliability of Through-Hole Electrical Interconnects Denis Barbini, Ph.D., iNEMI; Stu Longgood, Delphi Electronics Group; Quyen Chu, Jabil Circuit, Inc.; Denis Jean, Plexus Corporation; Jian Miremadi, Hewlett-Packard Company; and Keith Howell, Nihon Superior Co. Ltd. PRC1 Using Automated Optical Inspection (AOI) and Automated X-Ray Inspection (AXI) to Reduce Cost Through Process Capability and Control Chair: Tom Borkes, The Jefferson Project Co-Chair: Rod Howell, Libra Industries Wednesday, October 27, 8:00am – 9:30am, Europe 1 Having capable and controllable assembly processes are essential elements that characterize successful electronic manufacturing companies. An assembly infrastructure that takes advantage of today's automated inspection technologies assists in the goal of achieving best-in-class yields, as well as, significantly reducing the labor costs associated with manual inspection. The key to process control is not to use these automated inspection tools reactively, but to use them proactively in real time. What role can AOI and AXI play in achieving these quality assurance objectives? Does one need both? If only one, which one? Comparing the Capabilities of Automated Optical Inspection (AOI) and Automated X-Ray Inspection (AXI) Paul Groome, Machine Vision Products Comparison of Various Metrologies to Measure Voids in X-Ray Images Ife Hsu, Raiyo Apandiar, and Sherstin Mortensen, Intel Corporation; Isabel de Sousa and Scott Moore, IBM Corporation; Keith Newman, Sun Microsystems; Dong Ming, Freescale Semiconductor; Patrick Thompson, Texas Instruments; Christine Blair, ST Micro AOI in an 01005 world Galen Alexander, Cathy Combet and Ming-Ming Chang, Vi Technology SUB1 Environmental Factors Influencing PCB Creep Corrosion and Mitigation Steps to Prevent It Chair: Lenora Toscano, MacDermid, Inc. Co-Chair: Anil Kurella, Ph.D., Intel Corporation Wednesday, October 27, 8:00am – 9:30am, Oceanic 5 Electronics are seeing increasingly harsh environments as a result of environmental pollution. This session investigates the environmental influencing factors of creep corrosion. How to recreate them and mitigation steps to reduce the corrosion found on PCBs exposed to such environments. Mixed Flowing Gas Test Procedures for Creep Corrosion and How To Minimize Its Occurrence Barry Hindin, Battelle Columbus Operations Environmental Influence and Board Design Considerations for Creep Corrosion Yunhua Tu, Huawei Technologies Co., Ltd. Silver Corrosion in High Sulfur Environments James Tonge and Jason Clark, Dow Corning Corporation WEDNESDAY, OCTOBER 27 10:30am – 12:00pm AAT5 Effect of PCB Surface Finish on Lead-Free Solder Joint Reliability Chair: Pradeep Lall, Ph.D., Auburn University Co-Chair: Denis Jean, Plexus Corporation Wednesday, October 27, 10:30am – 12:00pm, Asia 1 The session focuses on the printed circuit board finish interactions with lead free solder interconnects. Transition to lead-free solders has been accompanied with the proliferation of PCB surface finishes including: Electroless Nickel and Immersion Gold (ENIG), Organic Solderability Preservative (OSP), Immerse Silver (ImAg) and Immerse Tin (ImSn). The three papers in this session present findings on the effect of change in surface finish on lead-free solder joint reliability. In the first paper, the failure modes of brittle fracture and black pad have been studied in lead-free solder interconnects. In the second paper, the shear strength and random vibration response of Sn3.0Ag0.5Cu solder joints with four surface finishes, including Electroless Nickel and Immersion Gold (ENIG), Organic Solderability Preservative (OSP), Immerse Silver (ImAg) and Immerse Tin (ImSn) have been studied after 125C isothermal aging. In the third paper, the effect of multiple reflows on the reliability of low-silver lead-free interconnects is been presented. Brittle Fracture with Symptoms of Black Pad Karuna Chinniah, PhD., Flextronics International, Inc. Effect of PCB Surface Finish on Pb-free Solder Joint Reliability Xu Zheng, Hongfeng Ran, Lei Wang, and Yexiang Ning, Shenzhen Kaifa Technology Co., Ltd. Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability Ranjit Pandher, Ph.D., Cookson Electronics-Assembly Materials SMT5 Reflow and Soldering Technologies Chair: Tom Zanatta, Motorola Co-Chair: Derek Daily, Senju Comtek Corporation Wednesday, October 27 10:30am – 12:00pm, Asia 2 Three practical presentations will review current technology and new methods of reflow processes, soldering technologies and development of standardized assembly and test methods for new material evaluations. This session will cover the challenges of moving reflow recipes to new locations without developing new profiles for each assembly. We will also review an innovative approach for minimizing defects during the reflow process by carefully introducing forced oscillation. A Standardized Method to Evaluate Process Material Compatibility With In-Circuit Test in High Complexity Assembly John McMahon, Simin Bagheri, and Lynn Klev, Celestica International Supporting Component Self-Alignment by Forced Oscillation During Reflow Soldering Florian Schüßler, Michael Pfeffer, Stefan Härter, and Jörg Franke; Institute FAPS, University Erlangen-Nuremberg Experience in Transferring Recipes from an Eight Zone Reflow Oven to a Ten Zone Oven Fred Dimock, BTU International MFX5 Head-in-Pillow Component Soldering Defects Chair: Jasbir Bath, Bath Technical Consultancy Co-Chair: Chrys Shea, Shea Engineering Services Wednesday, October 27, 10:30am – 12:00pm, Oceanic 3 Head-in-Pillow component soldering defects are a growing problem in the industry typically related to component and/or board warpage. There are increasing developments of solder paste to help mitigate the effect. The session will discuss test methodologies to create and quantify Head-in-Pillow defects as well as potential material/ process solutions to minimize them. Results will be discussed on the redesign of components to control warpage during reflow. Information on developing iNEMI projects on qualification requirements and primary factors affecting component warpage during reflow will be presented in relation to the JEDEC standard. A Procedure to Determine Head-in-Pillow Defect and Analysis of Contributing Factors Ranjit Pandher, Ph.D., Rahul Raut, and Michael Liberatore, Cookson Electronics Testing and Prevention of Head-In-Pillow Yan Liu, Ph.D., Pamela Fiacco, and Ning-Cheng Lee, Ph.D., Indium Corporation Effects of Component Warpage on Board Assembly Defects and Effective Mitigation Measures Peng Su, Ph.D., and Guhan Subbarayan, Ph.D., Cisco Systems PRC2 Strategies for Optimizing AOI and X-Ray Inspection Chair: Tim Kruse, Plexus Corporation Co-Chair: Peter Biocca, ITW Kester Wednesday, October 27, 10:30am – 12:00pm, Europe 1 With increasing PCBA density and package complexity, reliance on AOI and X-Ray inspection to enable PCBA quality continues to grow. Strategies for optimal AOI and X-Ray application are necessary to ensure defects are detected at the most opportunistic time with the smallest cost impact and defect escape risk. Real world users outline strategies and studies that show how to minimize defect escapes while balancing efficient utilization of inspection equipment. SEXTON: remove yellow…. Real Life X-Ray Inspection for BGAs, QFNs, Counterfeit Components and 3D Packages Evstatin Krastev, Ph.D., and David Bernard, Ph.D., Nordson DAGE Zero-defect Strategies With Combined Optical and X-Ray Inspection (AOI/AXI) Carsten Salewski, Viscom Inc. How to Implement Good Test Coverage and Eliminate Escapes Gaosen Li, An Qi Zhao, Andrew Ho, Wei Wen, Zhen (Jane) Feng Ph. D., Murad Kurwa, Haolee Yang, and Liang Chen, Flextronics International Inc. SUB2 The Reliability of High Density Interconnection (HDI) PCBs for Complex Electronics Chair: John Davignon, Intel Corporation Co-Chair: Matthew Seal, Tektronix Wednesday, October 27, 10:30am – 12:00pm, Oceanic 5 Although HDI has been around for several years now, there are still innovations in materials, chemistries and questions on reliability still abound. Miniaturization requires finer lines/traces while maintaining or improving signal integrity. This session will explore some of the reliability and performance improvements possible with HDI. Sexton: remove yellow. Reliability Issues Caused by Bending HDI Flexible Circuits John Dzarnoski, Ph.D. and Kexia Sun, Starkey Laboratories, Inc. Use of Non-Etching Adhesion Promoters in Advanced PCB Applications New Copper Electrolytes for Blind Microvia Filling Michael Dietterle, Ph.D., Dr.-Ing. Max Schlötter GmbH & Co. KG WEDNESDAY, OCTOBER 27 2:00pm – 3:30pm AAT6 BGA Reliability Issues and Evaluation Techniques Chair: Marie Cole, IBM Corporation Co-Chair: Scott Buttars, Intel Corporation Wednesday, October 27, 2:00pm – 3:30pm, Asia 1 Gain insight from this session into a variety of assembly reliability concerns affecting system field performance. Learn about new models to estimate the failure progression and residual life in drop and vibration testing. Hear recent data showing the significance of void location on interconnect fatigue reliability. Discover a technique for evaluating the thermo-mechanical reliability of the thermal interface material and cooling hardware in a high power application. Residual-Life Estimation of Lead-Free Electronics in Shock and Vibration Using Kalman Filter Models Pradeep Lall, Ph.D., Ryan Lowe, and Kai Goebel, Auburn University The Influence of Solder Void Location on BGA Thermal Fatigue Life Richard Coyle, Ph.D., Peter Read, Richard Popowich, Alcatel-Lucent; Heather McCormick, Celestica Inc.; John Osenbach, Ph.D., LSI Corporation Evaluation of Thermal Interface Material Performance in a Cyclic Strain Environment Jim Bielick, Joe Kuczynski, Tim Tofil, Mike Vaughn, Joe Doman, and Eddie Kobeda, IBM Corporation SMT6 Solving Solder Voiding and Other Solder Problems Chair: Laura Turbini, Ph.D., Research In Motion Co-Chair: Dan Baldwin, Ph.D., Engent, Inc. Wednesday, October 27, 2:00pm – 3:30pm, Asia 2 Solder voiding is a problem that has become increasingly an area of concern for electronic products. Since one function of the solder on a "quad flat no lead package" (QFN) is to transfer heat away from a power device, the presence of a large amount of voiding can be problematic and can lead to early device failure. Many factors can affect solder void formation including solder flux, alloy, reflow profile and board finish. Another solder problem of concern to some is the use of pin-in-paste (PIP) for a single through-hole component on an otherwise total SMT assembly. Often if sufficient solder is present or, if excess solder paste is used, flux residues can inhibit electrical probe testing. This session will address these issue and present some potential solutions. Four Ways to Reduce Voiding in BGA/CSP Package to Substrate Connections Michael Previti and Tom Hunsinger, Cookson Electronics An Investigation Into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/ QFN Type Components Jasbir Bath, Manabu Itoh, Gordon Clark, Noriyoshi Uchida, and Hajime Takahashi, Koki Company Limited; Jasbir Bath and Roberto Garcia, Christopher Associates Inc. Applications of Solder Fortification with Preforms Ronald Lasky, Ph.D., and Carol Gowans, Indium Corporation MFX6 Solar Module Manufacturing Chair: Chrys Shea, Shea Engineering Services Co-Chair: Irene Sterian, Celestica Inc. Wednesday, October 27, 2:00pm – 3:30pm, Oceanic 3 As the manufacturing of solar modules and related electronics expands to meet increasing market demands, the needs to reduce cost, boost throughput and improve reliability become more pronounced. The solar energy market is expected to grow as rapidly as the SMT market did in the 1980's and 1990's. Many of the scientific tools and techniques that brought SMT to its current level of technology can also be applied to the solar manufacturing arena. SMT Challenges in Alternative Energy Alan Rae, Ph.D., TPF Enterprises LLC Fabrication of Low Cost Flexible Solar Cells Using Solution-Based Coating Techniques Joseph Weiss, P. Kariuki, J. Chiguma, J. Gendron, A. Panshikar, S. Hoogar, P. Borgesen, Ph.D., and W. Jones; Binghamton University The Photovoltaic Industry – An Assessment and Comparison of the European and Chinese Business Models Matthew Holzmann, Christopher Associates Inc. SUB3 Latest Developments in Surface Finishes Chair: Jim Kenny, Enthone Inc., A business of Cookson Electronics Co-Chair: Steve Vandervoort, Intel Corporation Wednesday, October 27, 2:00pm – 3:30pm, Oceanic 5 Picking the right Surface Finish for your application can be a challenge. Please join this session to understand the impact of surface finishes on your total assembly cost. Learn about the latest new finishes under development which can improve total cost and reliability. Considerations for Selecting a PCB Surface Finish Randy Schueller, Ph.D., DfR Solutions A New Surface Finish for the Electronics Industry Lenora Toscano and Ernest Long, Ph.D., MacDermid, Inc. Latest Developments in Surface Finishing of PCBs Using Plasma Deposition Tim von Werne, Ph.D., Andy Brooks, and Siobhan Woollard, Semblant Ltd. PRC3 Risk Mitigation for Counterfeit Electronic Components Chair: David Steele, Da-Tech Corporation Co-Chair: Anne Poncheri, Silicon Cert Laboratories Wednesday, October 27, 2:00pm – 3:30pm, Europe 1 Counterfeit components in the electronics industry have become a serious threat to our economy and our safety. Reported instances of counterfeit components have dramatically increased and this trend is expected to continue. Continuing to specify the use of electronic components that are obsolete or "hard to get" are major drivers that make counterfeiting lucrative. Session presentations will provide details of the counterfeiting problem, industry responses, and risk mitigation practices. Equality Counterfeit Avoidance Woody Hewett, Electro-Comp Services Inc. Using X-Ray Video Photography and Leading Edge Techniques to Detect Counterfeit Components Art Ogg, World Micro "The Big Shift" - EEE Parts Counterfeit Mitigation Update and the Horizon Debra N. Eggeman and Mark Pasdon, IDEA WEDNESDAY, OCTOBER 27 4:00pm – 5:30pm AAT7 Interconnection Reliability Under Drop/Shock and Vibration Loading Chair: Richard Coyle, Ph.D., Alcatel-Lucent Co-Chair: Brian Roggeman, Universal Instruments Wednesday, October 27, 4:00pm – 5:30pm, Asia 1 The increasing requirements for product design and functionality, coupled with the transition to Pb-free manufacturing, have presented challenges on product reliability and manufacturing quality that are specific to Pb -ree solders. Among those challenges are the need to assess mechanical test requirements and acceptance criteria for drop/shock and vibration and the ability to develop models for crack propagation specific to Pb free solders in these test environments. Evaluation of Defects in Lead-Free BGA Solder Joints Under Random Vibration Stress Anurag Bansal, Ph.D., Kuo-Chuan Liu, and Jie Xue, Cisco Systems, Inc. Next Generation Board Level Underfill (BLUF) for Fine Pitch BGA Siang Miang Yeo, Cheng Siew Tay, and Ching Ching Chong, Intel Corporation Survivability Assessment of Advanced Interconnects and Lead-Free Electronics Subjected to Shock and Vibration with XFEM and CZM Pradeep Lall, Ph.D., Mandar Kulkarni, and Dhananjay Panchagade, Auburn University SUB4 Palladium Containing Surface Finish Chair: Raiyo Aspandiar, Ph.D., Intel Corporation Co-Chair: Robert Kinyanjui, Ph.D., Sanmina-SCI Corporation Wednesday, October 27, 4:00pm – 5:30pm, Oceanic 5 Palladium containing surface finishes, such as ENEPIG (Electroless Nickel-Electroless Palladium-Immersion Gold) has been gaining in popularity due to their better reliability, lower cost, wider processing windows during plating, and compatibility with wire bonding. Papers in this session will describe new developments in plating processes and metallurgical structures of palladium surface finishes and their evaluations for use in wire bonding and surface mount soldering. Electroless Palladium Over Bare Copper as a Surface Finish James Trainor, OMG Electronic Chemicals The Benefits of ENEPIG with Pure Pd for Gold Wire Bonding Gustavo Ramos, Dieter Metzger, and Mustafa Özkök, Atotech Deutschland GmbH; Hugh Roberts, Atotech USA A Study of the ENEPIG IMC for Eutectic and LF Solders George Milad, Uyemura International Corporation THURSDAY, OCTOBER 28 8:00am – 9:30am LF1 NASA-DoD Lead-Free Electronics Project: Overview as Well as Drop Test and Mechanical Shock Test Data Chair: Paul Vianco, Ph.D., Sandia National Laboratories Co-Chair: Thomas Woodrow, Ph.D., Boeing Company Thursday, October 28, 8:00am – 9:30am, Asia 1 The NASA-DoD Lead Free Electronics Project brings together experts from electronics communities in an intensive test program that is examining the reliability of Pb-free solder interconnections. The study incorporates many of the current technical drivers in a Pb-free conversion, including the solder alloy selection, surface finish, and the impact or repair and rework on the integrity of electronic packaging and interconnections. A brief overview will be presented, which describes the tasks and deliverable of the NASA-DoD project for the attendee. Then, the technical results will be presented from two important assessments: (a) drop test performance and (b) mechanical shock environments. These individual test programs are critical to the implementation of Pb-free technology in both commercial and military electronics. NASA-DoD Lead-Free Electronics Project - Update Kurt Kessel, ITB, Inc. (NASA) Drop Test Assessment of a Medium Complexity Assembly for High Reliability Applications P. Snugovsky, Ph.D., J. Bragg, Z. Bagheri, and M. Romansky, Celestica International Inc.; A. Ganster, Crane Division NSWC; W. Russell, Raytheon; J. P. Tucker and C. A. Handwerker, Ph.D., Purdue University; D. D. Fritz, SAIC NASA/DoD Lead-Free Electronics Project: Mechanical Shock Testing Thomas Woodrow, Ph.D., Boeing Company THURSDAY, OCTOBER 28 10:00am – 11:30am LF2 NASA DoD Lead-Free Report and Update (Part 2) Chair: Matt Kelly, P. Eng., MBA, IBM Corporation Co-Chair: Paul Vianco, Ph.D., Sandia National Laboratories Thursday, October 28, 10:00am – 11:30am, Asia 1 As commercial electronic hardware supply chains continue to migrate towards supporting lead-free printed circuit board assembly, this shift continues to apply supply chain pressure and technical risk to mission critical, high complexity, high reliability systems currently exercising various exemptions. Reliability assessment of hardware systems operating in ruggedized, harsh environment, avionic, and space applications is of critical importance. Part 2 of the NASA DoD lead-free update will report on resulting thermomechanical reliability performance studies of these high reliability systems. This is an excellent opportunity to learn more about NASA's lead-free assembly / test experience and application requirements. NASA-DoD Combined Environments Testing Results Cynthia Garcia and Jeff Bradford, Raytheon Company NASA/DoD Lead-Free Electronics Project: Vibration Testing Thomas Woodrow, Ph.D., Boeing Company NASA DoD -55°C to +125°C Thermal Cycle Test Results David Hillman, Rockwell Collins THURSDAY, OCTOBER 28 1:00pm – 2:30pm LF3 The Impact of Lead-Free Materials and Soldering Processes on Printed Wiring Assemblies Chair: Dave Hillman, Rockwell Collins Co-Chair: Gus Rinella, Research In Motion Thursday, October 28, 1:00pm – 2:30pm, Asia 1 The impact of the European Union's RoHS legislation on the electronics industry's material and process selection processes for printed wiring assembly manufacture has been profound. Maintaining a balance of characterized laminate materials, understood printed wiring board/component surface finishes and capable equipment technologies for the production of large, high complex electronic products is a significant task. The three papers in this session demonstrate the due diligence and document the challenges of manufacturing electronic products in a lead-free solder process environment. Lead-Free HASL: Balancing Benefits and Risks for High Complexity High Reliability Server and Storage Hardware Matthew Kelly, Jeffrey Taylor, Brett Krull, Marie Cole, and Tom Truman, IBM Corporation Mechanical Failures in Pb-Free Processing: Selected Mitigation Techniques for Pad Crater Defects Brian Gray and John McMahon, Celestica Inc. High Complexity Lead-Free Wave and Rework: The Effects of Material, Process and Board Design on Barrel Fill Craig Hamilton, John McMahon, Jose Traya, Wang Yong Kang, and Khoo Kok Wei, Celestica Inc.; Matthew Kelly and Marie Cole, IBM Corporation THURSDAY, OCTOBER 28 3:00pm – 4:30pm LF4 Lead-Free Solder Joint Reliability: Impact of Alloy Composition, Design and Load Parameters Chair: Jean-Paul Clech, Ph.D., EPSI, Inc. Co-Chair: Kola Akinade, Ph.D., Cisco Systems Thursday, October 28, 3:00pm – 4:30pm, Asia 1 Lead-free solder joint reliability is affected by solder alloy composition, process, design parameters and loading conditions. Addressing these requirements is key to the successful implementation of lead-free technology in mainstream as well as high-end product board assemblies. Speakers in this session will share their experiences and fundamental understanding of what helps make lead-free assemblies reliable. Solder Joint Reliability of Pb-free Tin-Silver-Copper Ceramic Ball Grid Array (CBGA) Packages as a Function of Cooling Rate and Silver Content Richard Coyle, Ph.D., Peter Read, Debra Fleming, and Richard Popowich, Alcatel-Lucent; Robert Kinyanjui,Ph.D., Mulugeta Abtew, Jonathon Shirey, and Iulia Muntele, Sanmina-SCI Corporation New Developments in High-Temperature, High-Performance Lead-Free Solder Alloys Anton-Zoran Miric, W.C. Heraeus GmbH Combinatorial Effects of Electromigration and Low Cycle Fatigue Christopher Hunt, Ph.D., Davide Di Maio, Charles Murdock, and Owen Thomas, NPL Home | Top Copyright © 1999-2010 SMTA, All rights reserved. Reproduction in whole or in part without permission is prohibited. SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819