October 24 - 28, 2010  
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Orlando, FL  
 
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SMTAI remains the best-in-class technical conference in the industry, encouraging engineers to engage in noncommercial, technically-driven conversations about current manufacturing and supply chain issues.
-Mike Buetow, CIRCUITS ASSEMBLY Magazine


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  Monday, October 25
MANUFACTURING AND ASSEMBLY

Tutorials

T9 Troubleshooting the Assembly Process
8:00am - 5:00pm, Oceanic 2

T10 Advanced SMT Manufacturing
8:00am - 11:30am, Oceanic 4

T11 Conformal Coating
1:30pm - 5:00pm, Oceanic 6

T12 SMT Manufacturing in the New Decade - Reliability
8:00am - 11:30am, Oceanic 8

T13 SMT Manufacturing in the New Decade - Materials and Processes
1:30pm - 5:00pm, Oceanic 8



SOLDERING

Tutorial

T14 Head and Pillow Failures
8:00am - 11:30am, Europe 1



ADVANCED PACKAGING

Tutorials

T15 3D Assembly, Packaging and Integration
1:30pm - 5:00 pm, Oceanic 4

T16 Package on Package Design, Assembly, Rework, Inspection
8:30am - 11:30am, Oceanic 6



QUALITY AND RELIABILITY

Tutorial

T17 Common Failure Modes
8:00am - 11:30am, Oceanic 3

T18 The Reality of Pb-Free Reliability
1:30pm - 5:00pm, Oceanic 3

T19 Contamination and Cleanliness
1:30pm - 5:00pm, Europe 1



AIMS/HARSH ENVIRONMENTS SYMPOSIUM
HE1 Pb-Free Technology Insertion
8:00am - 9:30a, Oceanic 7

HE2 Component Packaging Challenges in Harsh Environments
10:00am - 12:00p, Oceanic 7

HE Keynote Lunch The Tech in Green Tech
Oceanic 7

HE3 Organic Materials Adapted for Harsh Environments
1:00pm - 2:30p, Oceanic 7

HE4 Interconnection Reliability
3:00pm - 5:00p, Oceanic 7




EVOLVING TECHNOLOGIES SUMMIT
ET1 MEMS and Image Sensors
8:00am - 9:30a, Asia 1

ET2 Advanced Packages and Processes
10:00am - 12:00p, Asia 1

ET Keynote Lunch Challenges/Outlook for Printed Electronics
12:00pm - 1:30p, Asia 1

ET3 Printed Electronics
1:30pm - 3:00p, Asia 1

ET4 Evolving Technologies Panel - FREE!
3:30pm - 5:00p, Asia 1









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