October 24 - 28, 2010   Walt Disney World Swan and Dolphin Resort   Orlando, FL     Conference    Tutorials        Instructors    Tech Sessions    Symposiums    Sponsors At-A-Glance    Sunday    Monday    Tuesday    Wednesday    Thursday Special Events Golf Free Sessions Poster Session Job Center Accommodations Register Now Be A Sponsor! Marketing Ask Your Boss Next Year I like SMTAI because it allows me to connect and learn from a variety of the industry's best technical staff and research groups. It allows me to keep a pulse on the latest technology trends and issues affecting electronics hardware assembly. -Matthew Kelly, P. Eng., IBM Corporation Follow the event on Facebook! Official Twitter hashtag #smtai2010 Add to My Outlook Calendar Free events for attendees each day! The events below are free. See the registration form for complete information. Please note that speakers with a icon are recognized as Speakers of Distinction. Over the past 15 years they have been identified by SMTAI attendees as giving the strongest technical presentations. Congratulations to each of these authors for a job exceptionally well done. Opening Session Technology Turning Point Tuesday, October 26 8:00am – 9:30am, Atlantic A FREE to All Attendees! First we look back as we honor the 2009 BEST PAPER/PRESENTATION AWARD WINNERS who captured the honors. Join us as we celebrate their work and discuss how the industry benefits from it today. Then, we turn to the future and focus on two critical industry specs that will shape the face of global electronics assembly for years to come. “Bottom Terminations Components” (IPC 7093), and “Printed Board Storage and Handling” (IPC 1601) will directly affect many, and influence most, electronics assemblers. Listen as Ray and Michael introduce these powerful specs, then join in a conversation with your peers. Bottom Terminations Components (IPC 7093) Ray Prasad, Ray Prasad Consultancy Group 7093 is a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Printed Board Storage and Handling (IPC 1601) Michael J. Gay, Isola Group A new standard focused on the proper handling, shipping and storage of printed boards and printed board assemblies. The 2009 SMTA International Conference Award Winners will also be recognized: Best of Conference Presentation Paul Vianco, Ph.D.,** Sandia National Laboratories Best of Proceedings Papers Jean-Paul Clech, Ph.D.,** EPSI Inc; Gregory Henshall, Ph.D.,** and Jian Miremadi, Hewlett-Packard Company Best International Paper Heather McCormick** and Jimmy Chow, Celestica Inc.; Lee Smith, Ahmer Syed**, Corey Reichman, and C.J. Berry, Amkor Technology, Inc. Reducing Manufacturing Variation Chair: Rob Rowland, RadiSys Corporation Tuesday, October 26 10:30am – 11:30am, Show Floor Theater, Exhibit Hall FREE to All Attendees! Variation exists everywhere in a manufacturing environment. This session will cover two topics associated with variation reduction. Attendees will gain a better understanding of measurement system analysis and how to economically implement a paperless factory. Applying these techniques will help reduce variation which will result in quality and efficiency improvements. Process Control - Measurement System Analysis Herb Robbins, Robbins International Interactive Paperless Work Instructions Used for Process Management John Stimadorakis, AMT Corporation BGA Joint Inspection Using Dye & Pry Testing – How to Do It Yourself Chair: Heather McCormick, Celestica Inc. Tuesday, October 26 11:30am – 12:30pm, Show Floor Theater, Exhibit Hall FREE to All Attendees! “Practical, entertaining and guaranteed value for any engineer - FREE session - live in the Exhibit Hall Theatre!” Instructor: Bob Willis, ASKbobwillis.com Today the most common methods of inspecting solder joints on Ball Grid Array (BGA), Chip Scale Package (CSP) or Flip Chip is X-ray or side view inspection using a fiber optic system. Each has its advantages and disadvantages but a combination of both is ideal provided you can justify both pieces of process equipment. One area which is still difficult to detect is the subtle open circuit caused by wetting problems on the pad surfaces or flex of the BGA or printed board. Wetting problems are more common than some people think. This is particularly true on nickel/gold finished boards. In this case the gold is dissolved into the solder during reflow as the solder wets across the pad surface but a joint can fail to form between the base nickel. This type of defect is difficult, if not impossible, to detect with either of the traditional inspection techniques. Dye penetrants have been used for many years for a variety of applications, the most common being the testing of welded joints and castings prior to destructive analysis. They have also been used in surface coatings to detect minor imperfections. In the case of BGA, CSP and flip chip it is simple to mechanically break or flex the component from the board and check where the joint may have failed. The dye however provides a much better indicator of where complete or partial fractures may have taken place before the component is removed from the board. The surface of the joints can then be examined for dye penetration. Benefits of destructive examination Why do dye and pry Printed board assembly preparation Selective the correct dye The need for vacuum? Removing area array devices in one piece Correct identification of failure Common examples of failure and cure FREE Lunch Tuesday, October 26 12:00pm - 2:00pm, Show Floor Everyone is welcome to join us 12-2pm for a free lunch and poster session on the show floor. BGA Reballing Workshop Chair: Joe Belmonte, ITM Consulting/ Creyr Innovation Tuesday, October 26 2:00pm – 3:30pm, Show Floor Theater, Exhibit Hall FREE to All Attendees! Instructors: Bob Wetterman, BEST Inc. and Norman Mier, U.S. Marine Corp-Retired The beginning portion of this workshop focuses on the reballing processing basics, the considerations for deballing, cleaning, inspecting, and reballing devices. It concludes with the discussion of the variety of techniques which can be used for reballing, process “gotchas” and reliability issues. During this live demonstration session learn how to reball both plastic and ceramic devices. On a large screen you will learn several “tricks” from a master instructor the proper deballing, reballing, cleaning and inspection techniques. Participants who are interested can practice reballing with the watchful eyes of the instructors. The Prevention and Detection of Counterfeit Electronic Components Chair: Dan Baldwin, Ph.D., Engent Inc. Tuesday, October 26 3:30pm – 4:30pm, Show Floor Theater, Exhibit Hall FREE to All Attendees! Speaker: Rick Stanton, Symetrics Industries LLC This presentation is a small sample of what is happening in the world regarding counterfeit electronic components. The infrastructure of our military and commercial supply chains are becoming compromised daily. We all need to take part in the combat against this fraudulent 10 billion dollar a year business before someone is seriously hurt. Selective Soldering Chair: Bill Barthel, Plexus Corporation Wednesday, October 27 9:30am – 10:30am, Show Floor Theater, Exhibit Hall FREE to All Attendees! Although surface mount devices dominate modern electronic system designs, through hole interconnects are still an important part of many products. This session will explore key selective soldering process parameters and how they are controlled with automated tools. Attendees will learn what factors are significant and how to assess systems based on performance and cost. Selective Soldering Technology Selection Francis Fernanadez, Eddie Tang, and Caiying He, Ph.D., Shenzhen Kaifa Technology Co. Ltd. Process Control – Basis for a Cost-Effective Selective Soldering Process Christian Ott, Heike Schlessmann, and Reiner Zoch, SEHO Systems GmbH Accurate Non-destructive Profiling: Balancing your Board, Forward Capability, and Hybrid Profiles Chair: Paul Vianco, Ph.D., Sandia National Laboratories Wednesday, October 27 10:30am – 11:30am, Show Floor Theater, Exhibit Hall FREE to All Attendees! Speaker: Brian O’Leary, KIC KIC will discuss a recent study conducted by the Rochester Institute of Technology and its practical application for achieving reliable non-destructive methods of profiling sensitive critical components such as BGAs. This study demonstrates the merits of various thermocouple attachment methods and how common tried and true practices are now drawn into question since they are seen to have a negative impact on modern profiling reliability. Based on these new findings, KIC will discuss strategies for profiling complex PCBs that do not require drilling holes and other destructive techniques. Pad Site Dress Methods Chair: Denis Barbini, Ph.D. Wednesday, October 27 12:00pm – 12:30pm, Show Floor Theater, Exhibit Hall FREE to All Attendees! This study compares manual and semi-automated Printed Circuit Board (PCB) Pad Site Dress Methods. Each method is analyzed to understand which method can prevent board damage to the PCB pads such as pad lift, pad cratering and solder mask web damage on various Ball Grid Array (BGA) package types. One socket and two BGA land array patterns where used as well as two PCB suppliers and three socket suppliers when the study was conducted. The site redress experiments were conducted in 3 phases. PCB Pad Site Dress Methods on BGA and Socket Pad Arrays James Wade and Raiyo Aspandiar, Intel Corporation; Don Naugler and Terry Leahy, VJ Technologies RoHS Recast Chair: Marie Cole, IBM Corporation Wednesday, October 27 1:00pm – 2:00pm, Show Floor Theater, Exhibit Hall In December 2008, the EU began a review and revision of the RoHS and WEEE directives. For SMTA members, the RoHS Recast will change significantly - which will impact electronic products and its supply chain. This presentation covers a short history on the EU's RoHS directive. It gives the latest information from the latest readings; as well as an anticipated timeline of the recast becoming law. The bulk of the presentation is focused on implementing a process for meeting the new requirements within the RoHS directive - such as CE marking. The presentation will have the most up-to-date information from sources in the EU on implementing the RoHS recast. FREE to All Attendees! RoHS Recast - What Companies Really Need to Know Krista Botsford, Botsford EcoTech Partners LLC iNEMI Roadmap Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Wednesday, October 27 2:30pm – 3:30pm, Show Floor Theater, Exhibit Hall FREE to All Attendees! Speaker: Chuck Richardson, iNEMI Since the first roadmap in 1994, iNEMI (International Electronics Manufacturing Initiative) has enjoyed increasingly greater support and participation from industry. The effort reaches beyond iNEMI membership to involve a broad range of organizations from the global electronics industry. In the latest roadmap cycle, iNEMI held regional workshops in Europe and Asia (as well as North America) to assure that these regions were well represented in the roadmapping effort. Chuck will present the iNEMI 2010 Roadmap overview (developed during 2008), as well as highlighted issues being addressed by selected chapters from the 2010 Roadmap (released to the industry in April 2010) that will likely help drive the electronics industry for the next several years. Chuck will also share what we know concerning the 2011 iNEMI Roadmap and request your participation as well. Please join with us and see what the future may hold and how you (through your participation) might impact that future! SMTA’s GIFT to YOU! To thank you for 26 years of support for the SMTA, we are offering a FREE half day course for members on Thursday, October 28th. Rob Rowland, SMTA Conference Chair and STAR Instructor, will teach his popular course on Reflow and Wave Soldering Yield Improvement. Full details can be found on the tutorials page. NO COST to you if you are an SMTA MEMBER. We request that you register in advance to ensure adequate handouts. 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