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SMTAI covers the most important topics in the industry. Discover the latest technologies and techniques, stay current with industry trends and learn from the following respected tutorial instructors.
Please note the  preceding some of the instructor biographies listed below. These internationally respected instructors have been recognized by the SMTA International Technical Committee for consistently receiving exceptionally high ratings from attendees for the specific course they are teaching this year at SMTAI.
Dudi Amir is a Senior Process Engineer for Intel Inc. based in Oregon since 1994 supporting new technology development. He has participated in the development of assembly process for motherboards and mobile modules. He has also been a part of folded stacked and PoP packages development. Prior to working for Intel, Dudi was a process engineer for NEC Corporation supporting PBX and microwave board assembly. He received his Bachelor of Science in Mechanical Engineering from State University of New York at Buffalo and a Master of Science at Portland State University in Oregon. He has given many industry papers and has been awarded 9 US patents in package and board technologies.
Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, an international management and engineering consulting firm with offices in Asia, Europe, and North America. Differentiating from other consultancies, TechLead stimulates the growth and success of its clients by emphasizing rigorous analysis and expert judgment resulting in actionable recommendations. TechLead's staff of seasoned professionals combines unique and extensive knowledge with more than 140 years of in-depth industry experience to transform data into INFORMATION and knowledge into UNDERSTANDING yielding substantiated insight into your organization's most demanding business and technology needs.
A graduate of Stanford University, Dr. Bauer focuses in the areas of strategic technology planning, market analysis and international business development. With more than 30 years experience, Dr. Bauer also serves on Advisory Boards for a variety of academic and governmental institutions bringing tremendous breadth and depth to his work.
Founder, Pan Pacific Microelectronics Symposium
Fellow, IMAPS (1994), IMAPS President (2001-2002)
SMTA Board of Directors (1997-2001)
SMTA International Leadership Award (2007)
SMTA Luminary (2009)
Senior Member IEEE/CPMT
Founder, ISHM/IMAPS Advanced Technology Workshop Program
University of Portland Pamplin School of Business Administration Significant 75 Alumni Award
Joe Belmonte is a Principal Consultant with ITM Consulting (Durham, NH). Joe has been a process engineer and process engineering manager in the electronic manufacturing industry for over 25 years with experience in all aspects of electronic product assembly operations. Past positions include Manager of Advanced Manufacturing Engineering as well as a Supplier Engineer at Bose Corporation, a Consultant at Cookson Electronics/Speedline Technologies Performance Solutions Group and Project Manger at Speedline Technologies Advanced Process Group, as well as Director of Process Technology where he managed the Application Engineering and Process Development Functions. Joe also worked as a process engineer and process engineering manager at Motorola ISG for 18 years where he was Manager of the SMT Manufacturing Engineering Group.
At ITM, Joe’s area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide.
Joe is well-known throughout Asia and SE Asia for both his process work and teaching engagements. Joe has written papers for and made technical presentation at numerous industry trade shows and professional society meetings including Nepcon West, Nepcon East, IPC/SMTA Conference, APEX, Productronica, IPC Singapore Lead Free Conference, Mexitronica, and numerous SMTA Chapter meetings. Joe is the co-holder of the United States Patent (US Patent Number 6,572,702) for High Speed Electronic Systems and Methods.
Joe has been a senior member of the Society of Manufacturing Engineers (SME) for over 20 years. He served as a member of the Electronic Manufacturing Association of SME Board of Advisors and was the chairman of the EM/SME board of advisors in 1996 and 2002. He was a member of the Motorola Corporate TOPS (Technical Operations) Council. He has also authored a technical column for Circuit Assembly Magazine. Joe has been a member of the Surface Mount Technology Association since 1985 and currently serves as a member of the SMTA Board of Directors.
Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Durham, NH). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide.
Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 200 engineers in the US, Canada, Mexico, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.
As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered at Dartmouth College.
Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 26 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for NEPCON, IMAPS and SMTA. Jim is also the co-host of Circuitnet/Circuitmart’s “BoardTalk” audio program.
Dr. Craig Hillman, CEO and managing partner of DfR Solutions, is an expert in the development and implementation of strategic reliability processes and operations. His specialties include best practices in Design for Reliability (DfR), strategies for transition to Pb-Free, supplier qualification, accelerated test plan development, and root-cause analysis of component, interconnect, and printed board failures. Dr. Hillman has over 40 publications, and has presented on a wide variety of quality and reliability issues to more than 250 companies and organizations. These include Apple, Dell, Hewlett Packard, Motorola, IBM, Cisco Systems, General Electric, Emerson Electric, Lockheed Martin, Northrop Grumman, Raytheon, Honeywell, and General Dynamics among others. Over the past four years, Dr. Hillman has led DfR Solutions through a period of tremendous growth into one of the largest and most renowned reliability organizations in the international electronics marketplace.
His degrees include a post doctoral fellowship from Cambridge University, a PhD in materials from the University of California, Santa Barbara, and a BS in metallurgical engineering and material science from Carnegie Mellon.
Jennie Hwang, Ph.D. has contributed to SMT manufacturing since its inception and conducted pioneering lead-free R&D and hands-on production implementation. She has served as an advisor to major OEMs, EMS companies and the U.S. government, providing solutions to challenging problems in production defects, field failure and reliability issues. Having held senior executive positions with Lockheed Martin, Sherwin Williams, SCM Corp. and IEM Corp., she is currently principal of H-Technologies Group, providing business, technology and manufacturing solutions to the global industry. Her formal education includes Harvard Business School Executive Program, Ph.D., M.S., M.A. and B.S. degrees in materials science and engineering, chemistry, and liquid crystal science, respectively. Dr. Hwang has received numerous honors and awards including citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering, etc. She is the author of 300+ publications including several textbooks, and a speaker in innumerable international and national events. She serves on the boards of many companies, civic groups and universities, and is also an invited distinguished adj. professor for the engineering school of Case Western Reserve University and serving on its Board of Trustees.
Andrew Mawer is currently a Senior Member of the Technical Staff and the manager of the Packaging Applications and Analysis Labs within the Worldwide Quality organization at Freescale Semiconductor in Austin, Texas. Freescale was formerly the Semiconductor Products Sector of Motorola until becoming an independent company in 2004. Andrew has been with Freescale/Motorola for a total of 16 years. His primary areas of interest there are new packaging technology assessment and implementation, resolution of customer assembly issues and array packaging interconnect reliability characterization. Prior to joining Freescale/Motorola, Andrew spent four years at Compaq Computer where he was involved with the implementation of some of the first high pin count Plastic BGAs in the industry. He has been active in authoring and presenting on many aspects of packaging and reliability at a variety of conferences, symposia, and in industry publications including two book chapters. Mr. Mawer is an active member of SMTA and serves on the Technical Committee of the SMTA International Conference, the Review Board of the SMTA Journal and as the Vice President of the Central Texas SMTA chapter. Andrew received his B.Sc. degree in Mechanical Engineering from the University of Texas at Austin, in 1987 and an M.Sc. degree in Mechanical Engineering from Rice University in Houston, Texas, in 1989.
Bihari Patel is a Quality Specialist NPI with Research in Motion. He has over 34 years experience in SMT Assembly and PCB Manufacture with MacDermid Inc (Global), Nortel Networks (Canada) and Leicester Circuits (England). His presentations and projects have taken him around the globe. A few places worth mentioning are Australia, USA, UK, Hong Kong, China, Taiwan, Singapore, Thailand, Brazil, Mexico and India. He is an International Speaker and Presenter on Lead Free Surface Finishes & Assembly, SMT, Solder Paste Printing, No Clean Process, BGA, Outsourcing, and Continuous Improvements. He has conducted Workshops and Tutorials for SMTA, IMAPS, SMCBA, ABRACI, JEDEC, IPC and IPCA.. He is Fellow of Institute of Circuit Technology, Institute of Metal Finishing, Institute of Manufacturing and a Distinguished Toastmaster.
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA” and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF .
He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.
Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA.
S. Manian Ramkumar, Ph.D. is a Professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center at RIT. This Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site.
Rob Rowland is currently the Supplier Engineering Manager at RadiSys Corporation in Hillsboro, Oregon. Rob has more than 25 years of experience with surface mount manufacturing technology. He is an active member of the Surface Mount Technology Association (SMTA), where he served 2 terms as a chapter president and multiple terms as technical director of SMTA International. In 1999 he received the Founders Award from the SMTA and in 2005 and 2008 he received Distinguished Committee Service Awards from the IPC for his contributions to IPC-7095. He was also a member of the IPC/EIA Surface Mount Council for nine years. Rob is a frequent author and speaker at industry trade events. He also writes a manufacturing column for SMT Magazine in addition to serving on the editorial advisory board. Rob is the co-author of the book Applied Surface Mount Assembly. He received a Bachelor of Science Degree in Manufacturing Engineering from Weber State University.
Dr. Randy Schueller has held numerous management and leadership positions at companies including 3M and Extreme Devices (an Austin high tech start-up company), where he developed flex-based IC packages. He has also worked at Dell, where he assisted in resolving failures in IC packages, connectors, PWBs, and assembly issues. He currently holds 15 patents and has authored and presented over 30 papers within the electronics industry. Dr. Schueller is the head of DfR’s office in Minneapolis, Minnesota which opened in November 2008.
Ph.D., Materials Science and Engineering (University of Virginia)
M.S., Materials Science and Engineering (University of Virginia)
B.S., Physics (St. John's University)
Bob Willis currently operates training and consultancy business based in England and has created one of the largest collections of interactive training material in the industry. Although a specialist for companies implementing lead-free manufacture Mr Willis provides world wide consultancy in most areas of electronic manufacture over the last 25 years. This is based on working in manufacture with contract assembly, printed board manufacture and environmental test facilities. This has recently eared him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has also been presented with the SMTA International Leadership Award.
He has worked with the GEC Technical Directorate as Surface Mount Co-Ordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. Over the years Bob has been Chairman and Technical Director of the SMART Group and holds the title of Honorary Life Vice President for his contributions to the group since its inception. SMTA, Surface Mount Technology Association recently presented Bob with their 2008 International Leadership Award for continued contribution to industry. Bob has also an IPC Committee Award for contribution to their standards work.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose, CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. Phil formed ITM in 1993.
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions".
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of Circuitnet/Circuitmart’s “Boardtalk” audio program.
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