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Tuesday
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Registration
08:00 - 9:30 (8:00am - 9:30am)
Session TA1: Pb Free Advancements
09:30 – 12:30 (9:30am – 12:30pm)
Chair: Thomas Oppert, Pac Tech GmbH
Industry-University Collaboration and Advances in Lead-Free Solder Technology
Kazuhiro Nogita, Ph.D., University of Queensland
The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints
Keith Sweatman, Tetsuro Nishimura, Nihon Superior; Kazuhiro Nogita, University of Queensland
Thin Palladium Layers as an Effective Cost Saving Strategy in Electronics Applications
Olaf Kurtz, Ph.D., Juergen Barthelmes, Eckart Klusmann, Stephen Kenny, Atotech GmbH
REFRESHMENT BREAK
11:00 – 11:30 (11:00am – 11:30am)
Session TA1: Pb Free Advancements - Continued
The Coffin-Manson Formula for Sn/3.0Ag/0.5Cu Solder Joints
Jao-Hwa Kuang, T.P. Hung, C.M. Hsu, A.D. Lin, and C.H. Wu, National Sun
Yat-sen University
*** Session Keynote ***
Tin-Copper-Nickel-Germanium - A Case Study in Lead-Free Implementation
Tetsuro Nishimura, Nihon Superior Co. Ltd.
Session TA2: 3D Integrated Circuits
09:30 – 12:30 (9:30am – 12:30pm)
Chair: Soren Norlyng, MICRONSULT
New 3D Packaging Approach for Next Generation High Performance DRAM
Vern Solberg, Simon McElrea and Wael Zohni, Invensas Corporation
3D IC Technology Perspectives in Taiwan
Shen-Li Fu, Ph.D., I-Shou University; Wei-Chung Lo, Ph.D., EOL/ITRI; Ray-Lin Yang, Ph.D., IEK/ITRI
3D Integration Packaging by Organic and Glass Materials
Henry H. Utsunomiya, Interconnection Technologies, Inc.
REFRESHMENT BREAK
11:00 – 11:30 (11:00am – 11:30am)
Session TA2 (continued): 3D Integrated Circuits
11:30 - 12:30 (11:30am - 12:30pm)
3D Integration - A Promising Approach for Smart Systems Integration
M. Juergen Wolf, Fraunhofer Institute IZM
*** Session Keynote ***
3D Heterogeneous Integration: 3D ICs with TSV vs. 3D Interposer with TPV
Rao Tummala, Ph.D., Georgia Institute of Technology
LUNCH BREAK
12:30 – 13:30 (12:30pm – 1:30pm)
TP1: Roadmap Plenary Session
13:30 – 17:00 (1:30pm – 5:00pm)
Chair: Vern Solberg, STC Madison
The IPC International Technology Roadmap for Electronic Interconnectors
Dieter Bergman, IPC
TSVs - A Defining Technology for 3D Integration
Mark Scannell, CEA - Léti
JISSO Electronics Technology Roadmap Through 2020
Henry H. Utsunomiya, Interconnect Technologies, Inc.
REFRESHMENT BREAK
15:00 - 15:30 (3:00pm – 3:30pm)
TP1 Continued: Roadmap Plenary Session
13:30 – 17:00 (3:30pm – 5:00pm)
2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission
Bill Bader, Chuck Richardson, iNEMI
Technology Roadmaps and their Importance to Product Competitiveness
Eddie Kobeda, Ph.D., IBM Corporation
Roadmapping Risks and Returns
Charles Bauer, Ph.D., TechLead Corporation
SYMPOSIUM KEYNOTE 1
17:15 – 18:00 (5:15pm – 6:00pm)
Chair: Charles Bauer, Ph.D., TechLead Corporation
EU Electronics Research and Development Direction; Highlights of Framework 7 and Expectations for Framework 8
Christopher Bailey, Greenwich University
Welcome Reception
18:00 – 19:00 (6:00pm – 7:00pm)
Graciously Sponsored
By Indium Corporation
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