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The Call for Papers is now closed, and the Program Committee has organized paper sessions from research submitted on the following topics:
You will be notified by October 2011 if your abstract has been accepted and scheduled for presentation.
3D/Heterogeneous Integration
Build Up/Blind & Buried Via PWBs
Cu Pillars & Posts
MCM/SiP Advances
Module Stacking
Origami Flex Packages
Package on Package (PoP)
Shaped Circuits
Thru Si Vias (TSV)
Green Electronics
Environmental Impact Analysis
Green Manufacturing (Pb/Halogen free, etc.)
Large Area/Module Assembly
Photovoltaics
Power Control/Conversion/Distribution
Power Packaging
Solar Thermal Conversion
High Performance Low I/O
Chip on Glass (CoG)
Compact Florescent Systems
Display Driver s
Flat Panel Processes
LED Packaging & Assembly
Lighting & Displays
OLED Developments
MEMS/MOEMS
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Material Advances
Integrated Passive Devices
Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
Nano Materials Applications
Phosphors & Light Absorption
Thermal Interface Materials (TIMs)
Thin & Thick Film Systems
Strategic Direction/Industry Roadmaps
Economics & Cost Analysis
Health & Prognostics
Manufacturing Management & Control
Penetration Strategies
Supply Chain & Operations Management
Technology Drives
Trends, Forecasts & Roadmaps
Reliability, Health/Prognostics
Failure Analysis
Quality Assessment
Reliability Physics
Test & measurement
Yield Projection
Emerging Technologies
Advanced Connectors
Embedded Approaches (Passive & Active)
Interposer Technologies
Si Interposers
Thermal Management
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Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.
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