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The Pan Pacific Microelectronics Symposium promotes International technical
interchange and provides a premier forum for extensive networking among
microelectronics professionals and business leaders throughout the Pacific
Basin. Participants come from Australia, China, India, Japan, Korea, North America,
Southeast Asia, and Taiwan as well as Europe!
The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.
For a PDF copy of the Pan Pac 2011 Call for Papers, please click here
Papers should be 6-10 pages in length including graphics and they should offer original, previously unpublished, non-commercial research results on any of the topics listed below.
Abstracts of 500 words should be submitted by August 16, 2010, with title and author contact information. Click the "Submit Abstract" button below to submit your abstract directly to the SMTA server, for review by the the Pan Pacific Technical Committee.
You will be notified by October 2010 if your abstract has been accepted and scheduled for presentation.
3D Technologies
Package on Package (PoP)
Thru Si Vias (TSV)
Module Stacking
Origami Flex Packages
Shaped Circuits
Build Up/Blind & Buried Via PWBs
Cu Pillars & Posts
Si Interposers
MCM/SiP Advances
Lighting & Displays
LED Packaging & Assembly
Compact Fluorescent Systems
OLED Developments
Display Drivers
Chip on Glass (CoG)
MEMS/MOEMS
Flat Panel Processes
Materials Advances
Nano Materials Applications
Thin & Thick Film Systems
Pb & Halogen Free
Thermal Management
Phosphors & Light Absorption
Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
Integrated Passive Devices
Embedded Approaches (Passive & Actives)
Failure Analysis and Reliability
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Renewable Energy Technologies
Photovoltaics
Power Control/Conversion/Distribution
Green Manufacturing
Power Packaging
Environmental Impact Analysis
Solar Thermal Conversion
Large Area/Module Assembly
Strategic Direction
Supply Chain & Operations Management
Economics & Cost Analysis
Trends, Forecasts & Roadmaps
Penetration Strategies
Technology Drivers
Health & Prognostics
Manufacturing Management & Control
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