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Electronics Industry News
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ZESTRON to Feature its Latest Product Solutions at the SMTA Dallas and Houston
Manassas, VA - February 1, 2012 - ZESTRON will showcase its complete line of product and process solutions at the SMTA Dallas and Houston on February 7th and 9th. The Dallas Expo & Tech Forum will be held at the Richardson Civic Center, Richardson, TX, and the Houston Show is scheduled to take place at the Stafford Centre in Stafford, TX. Show hours for both shows are from 10 am to 3:30 pm. At the show, ZESTRON will highlight the company's peripheral product lines, process solutions, services as well as training and workshop opportunities in addition to its entire portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry. "ZESTRON is more than a cleaning agent supplier to the electronics manufacturing industry," says Michael McCutchen, Vice President Americas and South Asia. "In addition to our superior line of cleaning agents for PCB, stencil, misprint, underside wipe and maintenance applications, we provide a complete solution package that consists of free-of-charge cleaning trials, process support, engineering tools, analytical and process optimization services as well as workshops and training. In fact, in 2012, we are hosting a free-of-charge10-part webinar series addressing a variety of topics related to cleaning." For more information about ZESTRON's cleaning process solutions, please visit our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the shows, please visit http://www.smta.org/expos/#dallas and http://www.smta.org/expos/#houston. |
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A Look into the Coming Year With Christopher Associates
2011 was a solid year for the company and 2012 looks to be an exciting one. We have a number of exciting new product introductions scheduled in the first quarter, and our customer base in test, inspection and measurement is expanding rapidly. Sales of production systems also have increased. The launch of the Akila X-ray system has been very successful and we also have had some very exciting developments in solder paste inspection and AOI. Marantz’s nine-camera AOI system and Island semiautomatic work cell have received tremendous approval from customers. While the European economic crisis clouded the forecast most of this year, the return of business from China due to increased labor costs and, particularly, a rise in the value of the RMB Yuan is strengthening the North American interconnect assembly industry. Christopher Associates has hired several new technologists as well as support staff and will continue to expand both infrastructure and service capabilities in 2012. We also will continue to increase our customers' value proposition and provide solutions, innovative technologies and the support necessary for our customers to thrive. |
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Panasonic Debuts New Series Of Smart Phone-Compatible Bluetooth® RF Modules
SECAUCUS, NJ (January 18, 2012) - Panasonic Industrial Devices Sales Company of America, the advanced industrial components and electronic devices sales division of Panasonic Corporation of North America and a leader in Wireless Bluetooth Technology, announced the launch of its new PAN1321i Series of Bluetooth RF Modules. The PAN1321i Series is compatible with Apple devices such as the iPod®, iPhone® and iPad® as well as Android, smart phones and most Bluetooth-enabled devices.1 The PAN1321i Series is a comprehensive Bluetooth system solution, with an integrated controller, GPIO, AT Command Set Application Program Interface (API), antenna, Bluetooth transceiver, SPP Profile, FCC and IC certifications and Bluetooth end product listing. The new Series is qualified to the Bluetooth 2.0 standard and delivers a highly integrated, cost engineered solution for Bluetooth applications using Serial Port Profile (SPP). The PAN1321i Series interfaces with the Apple authentication coprocessor and supports iPod Accessory Protocol (iAP) to enable Bluetooth Serial Port data communication2 with Bluetooth-enabled Apple devices. Using Panasonic's "tiny footprint" technology, which incorporates a Surface Mount Device (SMD) and Land Grid Array (LGA) package, the PAN1321i Series measures just 15.6 mm by 8.7 mm. A fully shielded case protects the transceiver from nearby RF emitters, simplifying PCB layout. Ideal for applications migrating from USB or RS232 to wireless, the integrated Bluetooth SPP is easily accessed using a simple AT command set. Evaluation and Development Kits are available. "In a world which has become increasingly dependent upon the use of integrated portable devices, the debut of our PAN1321i Series of Bluetooth RF Modules represents a significant benefit to manufacturers looking to create products that work efficiently and wirelessly with products including iPads, iPhones and the ever-expanding offerings in Android and smart phones," said Jeff Howell, President, Panasonic Industrial Devices Sales Company of America. "Panasonic's strong background in RF Module technology has enabled us to develop a solution to meet the needs of a wide range of electronic device manufacturers." For more information on Panasonic RF Modules, visit www.panasonic.com/rfmodules. |
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Indium Corporation's Eric Bastow Named Assistant Technical Manager
Indium Corporation <http://www.indium.com/> announces the promotion of Eric Bastow <http://www.indium.com/corporate/bio/eric_bastow.php> to Assistant Technical Manager. In this position, Eric provides oversight to the Technical Support Team through leadership, advice, technical knowledge, and support to product management. Eric continues to provide technical support for the Pacific Northwest (USA) and Western Canada. Eric has been with Indium Corporation for over ten years, starting as a laboratory technician under the direction of Dr. Ning-Cheng Lee and then in the field of technical support, including serving as a Senior Technical Support Engineer. He is an SMTA-certified process engineer (CSMTPE) and is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He is also a certified IPC-A-600 and 610D Specialist. Eric has an associate's degree in Engineering Science from Herkimer County Community College and has authored several technical papers and articles. Eric has experience in developing new solder paste flux chemistries, performing residual gas analysis of hermetic electronic packages, and developing electroless nickel-plating bath chemistries. Eric is based at Indium Corporation's global headquarters in Clinton, NY. He also authors a technology blog, which can be found at <http://blogs.indium.com/blog/eric-bastow>. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit <http://www.indium.com/> or email abrown@indium.com. |
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Qual-Pro Achieves Nadcap Certification
LOS ANGELES, CA - January 15, 2012 - Qual-Pro Corporation, an industry leading electronics manufacturing service provider for high-reliability, mission-critical electronics, today announced that the company was awarded Nadcap certification. This achievement is part of the company's commitment to reliability and quality in its manufacturing, engineering and procurement processes - it demonstrates the company’s commitment to providing outstanding, differentiated service to its customers. This certification enhances Qual-Pro’s strong competitive position and standardized quality processes across all of its programs. “Nadcap certification provides our customers with additional confidence in our ability to meet their rigorous,mission-critical manufacturing processes and quality requirements. The certification is a reflection of the continuous effort and commitment made by Qual-Pro toprovide products of the highest quality to support our customers’ success”, said Brian Shane, Qual-Pro CEO. Qual-Pro was awarded this certification by the PRI, the Performance Review Institute. Nadcap, which stands for National Aerospace and Defense Contractors Accreditation Program, is a global cooperative accreditation program for aerospace engineering, defense and related industries. The Nadcap program, as a part of PRI, was created in 1990 by the Society of Automotive Engineers. Nadcap's membership of prime contractors coordinates industry-wide standards for special processes and products. Theprime contractors setting this standard include: Airbus, BAE Systems, Bell Helicopter, Boeing, General Electric, General Dynamics, Goodrich, HoneywellAerospace, Lockheed Martin, Northrop Grumman, Parker Aerospace, Raytheon, Thales and the U.S. Air Force. Through PRI, Nadcap provides independent certification of manufacturing processes for the aerospace industry. PRI's mission is to "provide international, unbiased, independent manufacturing process and product assessments and certification services for the purpose of adding value, reducing total cost, and facilitating relationships between primes and suppliers. For a copy of the certificate, see the company’s site: http://www.qual-pro.com/Qual-Pro/Quality.html |
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MIRTEC 2D/3D AOI System Wins a Global Technology Award
MIRTEC, The Global Leader in Inspection Technology, announces that it was awarded a Global Technology Award in the category of Inspection Equipment - AOI for its MV-7 2D/3D In-Line AOI Series at the recently held Productronica 2011 exhibition.
The new MV-7 2D/3D AOI machines are configured with MIRTEC's exclusive 15 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 15 Mega Pixel Top-Down Camera and a Precision Telecentric Compound Lens. The resolution of the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance.
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FINEPLACER® matrix ma Wins Global Technology Award
Finetech has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma. The award was presented to the company during Productronica 2011. |
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KIC's Auto-Focus Power Software Named Environmentally Friendly Product by Global Technology Awards
KIC has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its Auto-Focus Power Software. This next-generation thermal process optimization system searches all available oven recipes and automatically selects the oven setup that requires less electricity while at the same time securing a deep in spec profile. Third-party research has verified the ability of the new Auto-Focus Power option to reduce energy consumption up to 15 percent. This key feature results in significant cost savings in today's environment of high energy prices. It also supports companies' drive to lower their carbon footprints. |
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Datest Wins Global Technology Award for Its SPEA 4060 with GOEPEL/JTAG Boundary Scan Technology
Datest, a leading provider of advanced, efficient and quality in-circuit testing solutions, has been awarded a Global Technology Award in the category of Test Services for its SPEA 4060 Flying Probe Tester with GOEPEL Boundary Scan. The 4060 features simultaneous top- and bottom-side probing, allowing printed circuit board assemblies (PCBA) to be tested without flipping the board for retest on the opposite side. Additionally, simultaneous probing on both sides of the PCBA can provide higher test coverage. With limited test access becoming more prevalent in today's designs, the ability to target both sides of a board provides more flexibility to meet specific customer requirements. The SPEA 4060 incorporates new instrumentation that is designed to increase test accuracy and resolution as well as measurement speed. The 4060 minimizes the distance between measurement electronics and the device under test by moving the data capture electronics to the probe heads. The new design also reduces signal noise and provides extremely stable test measurements. Datest is a GOEPEL Center of Expertise for engineering and application of JTAG/Boundary scan test solutions. For more information about GOEPEL electronic's boundary scan test solution, visit www.goepel.com. For more information about the SPEA 4060 Flying Probe System, visit www.spea.com. Datest is the West Coast USA Demonstration Site for SPEA flying probe PCBA test systems. For more information about Datest or to view the company's full service lineup, visit www.datest.com. |
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ZESTRON Invites You to Attend Webinar Titled 'Why Clean PCBs?'
Manassas, VA - January 5, 2012 - ZESTRON, the worldwide leader in high precision cleaning product, service and training solutions for electronics manufacturing industry, is pleased to announce that its first 2012 webinar titled "Why Clean PCBs?" is scheduled for January 18th at 12 pm and on January 26th at 1:30 pm. This 45 minute webinar (including 15 min. Q&A) presented by Umut Tosun, Application Technology Manager, ZESTRON, is free of charge and the first of a 10-part cleaning series ZESTRON @cademy will be hosting throughout 2012. What will you learn? If the reliability of your electronic assemblies is critical, removing impurities from the board’s surface as well as underneath the components is critical. "Why Clean PCBs?" will provide insight to why it is important to fully clean electronic assemblies and how electrochemical migration and leakage currents can lead to failures. Who should attend? The content of this webinar is geared towards production line operators, manufacturing and quality managers as well as process engineers within the electronics manufacturing industry. For more information or to register, please contact ZESTRON at infoUSA@zestron.com, call (888) 999-9116 or visit our website at http://www.zestron.com/us/electronics/upcoming-events.html. About ZESTRON: Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. |
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BTU International Wins Two Global Technology Awards
BTU International, a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, recently earned two Global Technology Awards. The first was presented in the category of Soldering Equipment for the new dual-lane, dual-speed capabilities of its PYRAMAX™ solder reflow system and the other in the category of Solar Manufacturing Products for its TRITAN™ Metallization Firing System. This marks BTU's 15th industry award in the past five years, and its fifth Global Technology Award. |
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2011 Global Technology Awards Honor Seika's McDry Cabinets
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has been awarded a Global Technology Award in the category of Storage Systems for its McDry Feeder Storage Cabinets. The award was presented to the company during Productronica 2011. |
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Kyzen's AQUANOX® A4638 Wins a Global Technology Award
 Kyzen, a world-leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, has been awarded a Global Technology Award in the category of Cleaning Materials for its AQUANOX® A4638 Advanced Packaging Cleaning Chemistry. The award was presented to the company during Productronica 2011. This marks Kyzen's eighth Global Technology Award in the Cleaning Materials category. "We are honored by this recognition. Our Research and Development team works hard every day to solve today's challenges in addition to staying abreast and hopefully ahead of tomorrow's. Kyzen's detailed study of our customers' technical requirements helps them to be successful and helps us to continue providing the best-in-class cleaning materials," said Tom Forsythe, Vice President of Kyzen. |
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Faisal Pandit Named President Of Panasonic Factory Solutions Company Of America
January 4, 2012 - Rolling Meadows, IL - Panasonic Corporation of North America has named M. Faisal Pandit the next President of Panasonic Factory Solutions Company of America (PFSA). Pandit assumed leadership on January 1, 2012 after holding several positions within Factory Solutions over his 20 years with the company. "Panasonic has a solid portfolio of manufacturing solutions and a highly-reputed customer support team helping electronics assembly manufacturers maximize their efficiency. I look forward to continuously improving how Panasonic can empower customers to better execute and become more sustainable," Pandit stated. Prior to being appointed President, Pandit served as Director of Solutions which includes managing the global software organization responsible for product development, sales, deployment, and customer support. In addition, he also directed all engineering services, field service support, and spare parts activities throughout North America. "Faisal Pandit has been a driving force for the expansion of Panasonic's manufacturing execution software across North America as well as overseas markets," remarked Tom Gebhardt, former PFSA President and current Panasonic Automotive Systems Company of America President. "Among his many achievements with Panasonic, Pandit established and directed the global software solutions group which developed PanaCIM® Enterprise Edition (a Manufacturing Execution System). He also spearheaded the concentration of the software business to become US-based, supporting customers worldwide." Pandit's experience includes equity analysis in the technology sector and a long stint in the electronics manufacturing industry in various business and product development roles including 5 years with PFSA as the head of the Global Systems Group. He holds a BS from the University of Illinois, MS from the Illinois Institute of Technology, and an MBA from Northwestern's Kellogg School of Management. |
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ZESTRON to Launch Cleaning Webinar Series in 2012
Manassas, VA - December 27, 2011 - ZESTRON, the worldwide leader in high precision cleaning products, services and training solutions for electronics manufacturing industry, is pleased to announce the launch of a free-of-charge 10-part "lunch and learn" webinar series throughout 2012. The first webinar titled “Why Clean PCB's?” will be offered on January 18th and 26th at two different times. Each webinar is scheduled for 45 minutes and is taught by ZESTRON's expert process engineers. Additional topics include Cleaning Equipment and Cleaning Agents, Process Control, Surface Analytics, Difficult to Clean Parts & Solutions, Cleaning before Conformal Coating, Stencil & Misprint Cleaning, Maintenance Cleaning, DI-Water vs. Chemistry and Low Standoff Cleaning.
"ZESTRON strives to be more than a supplier of cleaning agents," says Michael McCutchen, Vice President Americas and South Asia. "In addition to providing PCB, stencil, misprint and maintenance cleaning products and analytical services, ZESTRON offers a multitude of industry training programs through webinars, presentations at industry events, regional workshops and an extensive website library. We are committed to providing our customers with detailed knowledge and tools to ensure that their processes are fully optimized, enabling them to produce products exceeding their end customers' requirements." For more information, please call (888) 999-9116, contact infoUSA@zestron.com or visit www.zestron.com. |
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Intellectual Property Court Dismisses Administrative Suit Challenging Isola Group Patent
CHANDLER, Ariz., December 14, 2011 - Isola Group, a manufacturer of technologically advanced base materials used to fabricate complex printed circuit boards, today announced that on October 31, 2011, the Taiwanese Intellectual Property Court confirmed the validity of Isola's Taiwan patent no. 413659 (Fillers for Improved Epoxy Laminates) by dismissing an administrative suit filed by Taiwan Union Technology Corporation challenging Isola's patent. Commenting on the decision, Ray Sharpe, Isola's CEO, stated, "We are pleased to be able to bring positive closure to the challenge to our patented filler technology in Taiwan. This decision validates our patent and gives Isola the right to preclude other laminators from using talc based fillers covered by our patents in their products in Taiwan." About Isola Isola Group, S.a.r.l. is a holding company whose operating subsidiaries are innovators in the design, development and production of technologically advanced base materials used to manufacture complex, multi-layered printed circuit boards. Isola, which is headquartered in Chandler, Arizona and employs approximately 2,100 people, operates manufacturing, research and development facilities, as well as sales offices, in Asia, Europe and the United States. Isola's investment in research and development, technology and state-of-the-art manufacturing facilities provides value to our customers through innovative and cost-effective solutions for the most demanding applications. Isola's broad range of products are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. More information on the company can be found at www.isola-group.com. |
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Indium Corporation Technology Expert to Host Webinar on Head-in-Pillow Elimination
Indium Corporation <http://www.indium.com> Product Manager of PCB Assembly Materials Tim Jensen <http://www.indium.com/corporate/bio/tim_jensen.php> will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA's webinar series January 12, 2012, from 11 a.m. to 12:30 p.m. Tim's presentation will include an overview on Head-in-Pillow (HIP) defects and how process and material selection can have a significant impact on the potential for HIP defects. Tim will also analyze the printing and reflow processes for ways that optimization can help to significantly reduce the potential for HIP, including the critical solder paste attributes that can help minimize HIP. As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in Sn/Pb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire. Tim is an SMTA-certified process engineer and has earned his bachelor's degree in Chemical Engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. Tim also authors a blog, which can be found at <http://blogs.indium.com/blog/tim-jensen>. For more information or to register, visit <http://smta.org/education/presentations/presentations.cfm>. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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Enthone Appoints Denise Fucci, Manager of E-Marketing Communications
WEST HAVEN, Connecticut, USA, (December 5, 2011) - Ms. Denise Fucci has been appointed the Manager of e-Marketing Communications by Enthone Inc., a business of Cookson Electronics. In this newly created position, Ms. Fucci’s primary responsibilities will be to ensure the successful and continuous development, optimization and content management of Enthone websites, SEM and Online activities to clearly differentiate and position Enthone as a leading and preferred supplier to the markets and industries the company serves. Ms. Fucci brings over fifteen years of Internet and Marketing Communications experience to the position. She attended Southern CT State University for Marketing Communications and earned a Bachelor’s Degree in Electrical Engineering. Denise’s previous experience includes website development, technical writing and e-Media Marketing for HB Communications, North Haven, Connecticut, as well as being owner of her own marketing communications firm. About Enthone Enthone Inc. is a business of Cookson Electronics www.cooksonelectronics.com. The company is a global and leading supplier of high performance specialty chemicals and coatings. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board, semiconductor, photovoltaic, automotive, energy, aerospace, jewelry, and plumbing applications. For more information, please visit www.enthone.com. |
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Indium Corporation Hires New Technical Support Engineer for Global Accounts Group
Indium Corporation <http://www.indium.com/> announces that Greg Wade has been hired as Technical Support Engineer for the Global Accounts Group. Greg provides global technical support for Indium’s multi-national customers. This also includes coordinating, maintaining, and deploying technical resources for printed circuit board assembly (PCBA) materials and processes. Greg is an expert in surface mount and through-hole technologies, with more than 18 years of experience working with a number of electronics manufacturers and suppliers throughout the world. Greg is a veteran of the United States Navy and is educated in aviation RF electronics. After the Navy he continued his education, attaining his Six Sigma Green Belt, as well as certifications on numerous equipment sets and patents for tooling design. Greg is based at Indium Corporation’s Global Headquarters in Clinton, NY and resides in West Eaton. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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Indium Corporation's Dr. Mackie to Present at SMTA Arizona-Sonora Expo and Tech Forum
Indium Corporation's <http://www.indium.com/> Global Product Manager, Andy C. Mackie, PhD, MSc <http://www.indium.com/corporate/bio/andy_mackie.php>, is presenting at the Surface Mount Technology Association (SMTA) Arizona-Sonora Expo and Tech Forum, December 7, 2011 in Tempe, AZ, USA. Dr. Mackie is presenting Soldering in the Age of 3D Semiconductor Assembly. This presentation discusses the usage of solder and flux in advanced technologies, focusing on complex processes where solder is adjacent to the die surface. Dr. Mackie has over 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes. Dr. Mackie received the prestigious IPC President's Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials sub-committee. He is formally trained in Six Sigma "Design of Experiments" and has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, Dr. Mackie holds patents in novel polymers, gas analysis, and solder paste formulation. Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium's global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly <http://blogs.indium.com/blog/semiconductor-and-power-semi-assembly> blog. For more information about SMTA or to register for the conference, visit <http://www.smta.org>. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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Indium Corporation's Chris Nash Named Technical Support Engineer for Global Accounts Group
Indium Corporation <http://www.indium.com/> announces the promotion of Chris Nash <http://www.indium.com/corporate/bio/chris_nash.php> to Technical Support Engineer for the Global Accounts Group. In this new position, Chris's technical responsibilities have been expanded to encompass global technical support to Indium Corporation's multi-national customers. This also includes coordinating, maintaining, and deploying technical resources for printed circuit board assembly (PCBA) materials and processes. Chris joined Indium Corporation in February 2005, and has served in a variety of roles, including Inside Sales, Powder Product Management, and Technical Support for the Midwest and Southeastern United States. Most recently, he was promoted to Senior Technical Support Engineer. Chris has a bachelor's degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He has earned his certification as an SMTA Process Engineer and is a certified IPC-A-600 and IPC-A-610D Specialist. Chris is based at Indium Corporation's global headquarters in Clinton, NY. He resides in Oriskany. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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ZESTRON to Showcase 'More than Chemistry' at the SMTA Arizona-Sonora Expo
Manassas, VA - November 29, 2011 - In addition to its complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry, ZESTRON will showcase its peripheral product lines, process solutions, services as well as training and workshop opportunities at the SMTA Arizona-Sonora Expo and Tech Forum held at the Fiesta Resort Conference Center, 2100 S. Priest Drive, Tempe, AZ 85282, on Wednesday, December 7th, 2011. Show hours are from 9 am until 4 pm. "ZESTRON is more than a provider of cleaning agents to the electronics manufacturing industry," says Michael McCutchen, Vice President Americas and South Asia, ZESTRON. "In addition to our superior line of cleaning agents for PCB, stencil, misprint, printer underside wipe and maintenance applications, we provide a complete solution package that consists of process support, engineering tools, analytical and process optimization services as well as workshops and training." For more information about ZESTRON’s cleaning process solutions, please visit us at our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTA Arizona-Sonora Expo and Tech Forum, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=9. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning requirements. |
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Qual-Pro awarded Northrop Grumman Information Systems' Supplier Excellence Award
LOS ANGELES, CA - November 20, 2011 - Qual-Pro Corporation, an industry leading electronics manufacturing service (EMS) provider for high-reliability, mission-critical electronics, today announced that it was awarded a Supplier Excellence Award from Northrop Grumman Information Systems. After working with, and evaluating, its supplier base, Northrop Grumman Information Systems elected to recognize Qual-Pro for its expertise in the field of electronics manufacturing. Brian Shane, CEO, Rich Fitzgerald, COO and Bob Miller, Vice President Sales, were on hand to receive the award in Chantilly, Virginia. Shane commented, “Northrop Grumman Information Systems’ recognition of the excellence Qual-Pro delivers is a humbling, meaningful award for our entire organization. Our entire team is proud of the work we do for this importantcustomer.” Qual-Pro was chosen as a critical supply chain partner due to the company’s expertise in the field of mission-critical electronics manufacturing. “Our engineering team drove design enhancements which enabled significant cost reductions for Northrop GrummanInformation Systems. We earned this award by making a difference to Northrop Grumman Information Systems delivering program excellence, cost savings initiatives and customer service,” said Fitzgerald. With more than 40 years experience, Qual-Pro has built the infrastructure to support the demanding requirements of companies like Northrop Grumman. This award follows the company’s Nunn-Perry award earned in partnership with Northrop Grumman in 2009. See: http://goo.gl/ft59U for more information. About Qual-Pro Qual-Pro is an electronics manufacturing service provider certified to Nadcap (Dec 2011), AS9100 (aerospace devices), ISO 9001, ISO 13485 (medical devices) and UL 508A (electrical cabinets) quality standards. The company’s range of expertise encompasses complex Printed Circuit Board (PCB) assemblies and full-box builds. Qual-Pro offers the complete range of electronics manufacturing services including turnkey system assembly, flex assemblies, BGA and micro-BGA placements, functional and in-circuit testing(ICT), electro-mechanical assembly and design for manufacturability (DFM) services. Qual-Pro specializes in high-mix, low-to-medium volume assemblies, quick-turn prototypes and new product introduction (NPI) services. They provide complete manufacturing engineering and integrated supply chain services to all their customers. Qual-Pro builds products in its 55,000 square foot state of the art manufacturing facility in Gardena, California. |
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Mark Ragard Joins Panasonic Factory Solutions as Group Manager of Electronics Assembly Sales
November 16, 2011 - Rolling Meadows, IL - Panasonic Factory Solutions Company of America (PFSA) announces that Mark Ragard has joined its team as Group Manager of Electronics Assembly. Ragard is now in charge of Panasonic’s strategic implementation and sales execution of manufacturing solutions for the North American market. “I am proud to be with Panasonic—an undeniable leader in electronics manufacturing,” relayed Ragard. “An expansive equipment set, a modular, integrated Manufacturing Execution System, and a multitude of quality end solutions backed by real manufacturing know-how is offered for nearly every industry. With this combination, Panasonic is well-positioned to grow market share by helping customers get products out the door more efficiently, productively, and with great quality.” “Having Mark join the Panasonic team is such a natural progression in his career,” says Tom Gebhardt, PFSA President. “With over 25 years in the industry, he has experienced the challenges of electronics assembly including PTH, SMT, identification systems, and software. To couple his understanding of what manufacturers need with the solutions Panasonic can provide is a perfect fit.” Ragard holds a successful history with Universal Instruments as General Manager of and Director of sales, and with Microscan Systems as North East & Ontario Canada Regional Sales Manager. In addition, he has participated in many industry councils and possesses a Bachelor of Business Administration from Hofstra University. |
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Indium Corporation Technology Expert to Host Webtorial on Lead-Free Assembly
Indium Corporation <http://www.indium.com> Product Manger of PCB Assembly Materials Tim Jensen <http://www.indium.com/corporate/bio/tim_jensen.php> will present Lead-Free Assembly for High Yields and Reliability as part of SMTA's webtorial series on December 6 and 13, 2011, from 1 to 2:30 p.m.
Tim's course will include an overview of how Pb-Free assembly and the global environmental regulations affect the electronics assembler today; the selection process of Pb-Free alloys, PWBs, components, solder pastes, and fluxes to achieve both high process yields and reliable products; assembly process development and optimization, and more.
As a product manager, Tim works with customers to troubleshoot and optimize SMT process lines. He specializes in Sn/Pb and Pb-free solder paste, halogen-free soldering materials, wave solder fluxes, bar solder, rework fluxes, and flux-cored wire.
Tim is an SMTA-certified process engineer and has earned his Bachelor's degree in Chemical Engineering from Clarkson University. He readily shares his expertise by authoring technical papers, writing for technical publications, and participates actively in several IPC standards development committees. He also authors a blog, which can be found at blogs.indium.com/blog/tim-jensen <http://blogs.indium.com/blog/tim-jensen> .
For more information or to register, visit www.smta.org <http://smta.org/education/presentations/presentations.cfm> .
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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ZESTRON's Complete Product and Process Solutions at the SMTA Nutmeg Expo
Manassas, VA - November 10, 2011 - ZESTRON is pleased to announce that it will display its complete line of product and process solutions at the SMTA Nutmeg Expo and Tech Forum held at the Crowne Plaza Hotel, 1284 Strongtown Road, Southbury, CT, on November 16th, 2011. Show hours are from 10 am until 3 pm. "ZESTRON is more than a cleaning agent supplier," says Michael McCutchen, Vice President Americas and South Asia. "In addition to providing PCB, stencil, misprint and maintenance cleaning products and analytical tools to the electronics manufacturing industry, ZESTRON offers a multitude of services ranging from free-of-charge cleaning trials to process implementations and optimizations as well as surface analytics, such as visual inspections, Ion Chromatography and Ionic Contamination measurements. ZESTRON's commitment to ensuring that our customers' products meet their cleanliness requirements is without equal." For more information about our products and services, please join Mr. Richard Burke, Northeast Regional Sales Manager, at our tabletop display or contact ZESTRON's Application Technology Department at (703) 393-9880 or visit www.zestron.com. |
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ZESTRON to Present 'PCB Cleaning Before Conformal Coating' at the 1st SMTA Tech Forum in Guadalajara
Manassas, VA - November 8, 2011 On November 10th, 2011, Mr. Axel Vargas, Application Engineer at ZESTRON will present "PCB Cleaning Before Conformal Coating" at the first SMTA Technical Forum in Guadalajara, Mexico. The show will be held on November 9th and 10th, 2011, at the Centro de Enseñanza Técnica Industrial (CETI), Auditorio Nueva Escocia 1885, Fraccionamiento Providencia, 44620 Guadalajara, Jalisco. Show hours are from 8:30 am until 6:00 pm. This technical presentation will explore the reasons for cleaning printed circuit boards, especially prior to conformal coating applications. Furthermore, it will outline the potential implications of omitting this important production step as well as how and why coatings can fail. It will also provide an in-depth look at cleaning systems and analytical test methods that can be used to assess the cleanliness levels of printed circuit boards. During the show, ZESTRON will also highlight the company’s peripheral product lines, process solutions, services as well as training and workshop opportunities in addition to its entire portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry. For more information about ZESTRON’s cleaning process solutions, please visit us at our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTA Technical Forum in Guadalajara, please visit http://smta.org/chapters/chapters_detail.cfm?chapter_id=120. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning requirements. |
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SMTA Capital Chapter to Host AOI Presentation on November 15th, 2011
November 7 2011 - The SMTA Capital Chapter is pleased to announce the upcoming SMTA meeting at ZESTRON America in Manassas, VA, on 15 November 2011 from 5 pm until 8 pm. An industry expert from Goepel Electronics will share his knowledge and expertise on Automated Optical Inspection. During his presentation, Patrick Schuchardt, Senior Application Engineer, will provide an in-depth view of AOI, spanning from the basics to AOI placement in the production line, typical applications, challenges and limits. The evening is scheduled as follows: 5:00 pm Registration 6:00 pm Dinner 6:45 pm Presentation and Q&A: “AOI Process” - Patrick Schuchardt, Goepel Electronics Location: ZESTRON America 11285 Assett Loop Manassas, VA 20109 The registration fees are $20 for members and $25 for non-members. To register for this event as well as any upcoming ones or for more information about the SMTA, please visit www.smta.org or contact Ms. Karen Ebner, Chapter President, at Karen_Ebner@raytheon.com. To RSVP, please follow the link: http://www.smta.org/chapters/rsvp.cfm?BEE_ID=2681&BULK_EMAIL_NO=1 |
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ASC International's AOI and SPI Solutions at SMTA Empire NY Expo
Maple Plain, Minnesota, USA - ASC International, a leading global manufacturer of true 3D SPI and AOI solutions will be demonstrating it full lineup of products at the upcoming SMTA Empire - Upstate New York Expo and Tech Forum in Rochester, NY - November 10, 2011. "ASC has been a market leader in offering cost effective SPI and AOI solutions since 1992. The recent release of the VisionPro bench top SPI system and the AV862 stand alone AOI platform solidifies ASC's commitment to developing products that meet both the inspection requirements and budgetary needs of our current and future customers." Steve Arneson, ASC International's National Business Manager, states directly. The VisionPro Series of bench top SPI systems are feature rich, high end measurement systems designed for companies looking for a value packed machine capable of assisting with proper print setup and the overall task of real time print quality. Offering a flexible multi-sensor configuration, VisionPro provides the most cost effective SPI solution on the market today. The AV862 AOI system provides a solution to those companies requiring an economical approach to their component inspection requirements. The AV862 is capable of detecting faults such as absence/presence, OCR, polarity, solder bridging, registration and more. Priced at under $30K installed, the AV862 is well worth your time to stop by and get a hands-on, live demonstration. For more information, visit www.solderpasteinspection.com or www.ascinternational.com or contact us by email at info@ascinternatonal.com or by Telephone: 888-478-2912 |
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ASC International's AOI and SPI Solutions at SMTA Wisconsin / Great Lakes Expo
Maple Plain, Minnesota, USA - ASC International, a leading global manufacturer of true 3D SPI and AOI solutions will be demonstrating it full lineup of products at the upcoming SMTA Wisconsin / Great Lakes Expo and Tech Forum in Milwaukee, WI - November 8, 2011. "ASC has been a market leader in offering cost effective SPI and AOI solutions since 1992. The recent release of the VisionPro bench top SPI system and the AV862 stand alone AOI platform solidifies ASC's commitment to developing products that meet both the inspection requirements and budgetary needs of our current and future customers." Steve Arneson, ASC International's National Business Manager, states directly. The VisionPro Series of bench top SPI systems are feature rich, high end measurement systems designed for companies looking for a value packed machine capable of assisting with proper print setup and the overall task of real time print quality. Offering a flexible multi-sensor configuration, VisionPro provides the most cost effective SPI solution on the market today. The AV862 AOI system provides a solution to those companies requiring an economical approach to their component inspection requirements. The AV862 is capable of detecting faults such as absence/presence, OCR, polarity, solder bridging, registration and more. Priced at under $30K installed, the AV862 is well worth your time to stop by and get a hands-on, live demonstration. For more information, visit www.solderpasteinspection.com or www.ascinternational.com or contact us by email at info@ascinternatonal.com or by Telephone: 888-478-2912 |
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ZESTRON to Present at the SMTA Empire Chapter Technical Session and Vendor Show
Manassas, VA - November 1, 2011 ZESTRON's Naveen Ravindran, Application Engineer, will present "Fluid Flow Mechanics - Key to Low Standoff Cleaning" at the SMTA Empire Chapter Technical Session and Vendor Show held at the Radisson Hotel Rochester Airport, 175 Jefferson Road, Rochester, NY, on Thursday, November 10th, 2011. Show hours are from 10 am until 6 pm. More than five years ago, ZESTRON first discussed cleaning underneath 4 MIL standoff components. With the emergence of lead-free solder and flux as well as a miniaturization of components and an increase in board densities, the latest challenges include components with less than 1 MIL gaps. This study was designed to specifically investigate the impact of mechanical vs. chemical energy during the removal of contamination under 1-2 MIL standoff components. To validate the results obtained, extensive experiments were conducted, including actual user case studies, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help customers in the future. These included but were not limited to various flow patterns and industry leading cleaning agents. As a result, the authors also included experimental data that addressed fluid flow mechanics as well as temperature and concentration related effects. During the show, ZESTRON will also feature its peripheral product lines, process solutions, services as well as training and workshop opportunities in addition to the company's complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry. For more information about ZESTRON's cleaning process solutions, please visit us at our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTA Empire Chapter Technical Session and Vendor Show and Naveen's presentation, please visit http://smta.org/chapters/chapters_detail.cfm?chapter_id=26. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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ZESTRON to Present PoP Cleaning Study at the SMTA's Wisconsin/Great Lakes Expo & Tech Forum
Manassas, VA - October 26, 2011 - Jigar Patel, Senior Process Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present "Is Cleaning Critical to PoP Assemblies?" at the SMTA's Wisconsin/Great Lakes Expo & Tech Forum held at the Wyndham Milwaukee Airport Hotel & Convention Center on Tuesday, November 8, 2011. Additionally, ZESTRON will host a tabletop display featuring the company's latest cleaning process solutions and educational opportunities. Show hours are from 9:45 am to 3:30 pm. Package on package (PoP) assemblies are widely growing in use for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. As a result, PoP's have become an ideal component selection for products such as advanced mobile platforms and digital cameras. Cleaning is a critical process within the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper will address the cleanliness level of PoP assemblies including underneath PoP components and in between packages. Expected results will empirically confirm the effectiveness of cleaning technologies for this rapidly evolving technology. For more information on this topic, please join Mr. Jigar Patel at the show, stop by our tabletop display, contact ZESTRON's Application Technology Department at (703) 393-9880 or visit www.zestron.com. To register for the SMTA's Wisconsin/Great Lakes Expo & Tech Forum, please visit http://smta.org/expos/#WIGL. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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ZESTRON to Showcase More than Chemistry at the SMTA's LA/OC 1st Annual Expo & Tech Forum
Manassas, VA - October 24, 2011 - In addition to its complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry, ZESTRON will showcase its peripheral product lines, process solutions, services as well as training and workshop opportunities at the SMTA's LA/OC 1st Annual Expo & Tech Forum, held on November 2, 2011, at the The Grand Event Center, 4101 E. Willow St., Long Beach, CA 90815. Show hours are from 10 am to 3 pm. "ZESTRON is more than a supplier of cleaning agents to the electronics manufacturing industry," says Michael McCutchen, Vice President Americas and South Asia. "In addition to our superior line of cleaning agents for PCB's, stencil, misprint, underside wipe and maintenance applications, we provide a complete solution package that consists of continuous support during process implementation and operation, engineering tools, analytical and process optimization services as well as workshops and training. Our ultimate goal is to ensure the successful implementation and maintenance of all processes for our clients, thereby guaranteeing a mutually beneficial business partnership." For more information about ZESTRON's cleaning process solutions, please visit our tabletop exhibit at the expo, contact our Application Technology Department at (703) 393-9880 or visit www.zestron.com. To register for the show, please visit http://www.smta.org/expos/#laoc. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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ZESTRON to Present PoP Cleaning Study at the SMTA Penang
Manassas, VA - October 20, 2011 - Ravi Parthasarathy, Senior Process Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present "Is Cleaning Critical to PoP Assemblies?" at the SMTA Penang held at the Eastin Hotel, Penang, Malaysia, on October 28th, 2011. Package on package (PoP) assemblies are widely growing in use for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. As a result, PoP's have become an ideal component selection for products such as advanced mobile platforms and digital cameras. Cleaning is a critical process within the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper will address the cleanliness level of PoP assemblies including underneath PoP components and in between packages. Expected results will empirically confirm the effectiveness of cleaning technologies for this rapidly evolving technology. For more information on this topic, please join Mr. Ravi Parthasarathy at the SMTA Penang, contact ZESTRON's Application Technology Department at (703) 393-9880 or visit www.zestron.com. To register for the SMTA Penang, please visit http://smtapenang.com.my/news/index.php#SMTAVendorShow. |
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SIPAD SYSTEMS INC. Celebrates 10 years
14 years after it was introduced, SIPAD process still being pioneered
10/14/2011 - SIPAD Systems Inc celebrated ten years of business in their Alpharetta GA location. The company began operations on September 1st, 2001, just ten days before the 911 tragedy. "Timing was not on our side, but I was committed to making this work," said Matt Kehoe, SIPAD president. Kehoe left his position at Midwest Printed Circuit Services (MPCS) to start SIPAD SYSTEMS, Inc. after setting up and managing the first SIPAD facility in the US at MPCS. "Leaving MPCS was difficult but I knew that if this process was going to grow we needed to be able to apply it to anyone's circuit boards, no matter where they were built". SIPAD solid solder deposit (ssd) replaces solder paste stencil printing with a more predictable, repeatable and dependable attachment method. SIPAD Systems applies SIPAD to complex surface mount printed circuit boards enabling the attachment of all surface mount parts including very small, fine pitch and blind termination components, by hand or machine, with perfect results. "We've carved out a niche in the high reliability commercial market, as well as the space and military industries" said Kehoe. SIPAD ssd is traditionally used in the small quantity arena either for prototypes or high reliability applications. SIPAD Systems customers include General Dynamics, NASA Goddard Space Flight, Jefferson Labs, Micromeritics, Harvard University, Kidee Aerospace and many other leading companies in the military, space and commercial markets. SIPAD Systems Inc. was co-founded by Ray Crenshaw, a fixture in the printed circuit manufacturing industry for over fifty years. Crenshaw believed passionately in the SIPAD process as well as in Matt Kehoe's ability to successfully bring it to the US. Ray Crenshaw died in 2003 after working almost every day in the shop during the startup. SIPAD Systems also manufactures laser cut stencils from the Alpharetta location.
Media Contact: Matt Kehoe
770-475-4576
mattkehoe@sipad.com |
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ZESTRON to Highlight ATRONR AC 207 at the SMTAI 2011
Manassas, VA - October 12, 2011 - In addition to its complete portfolio of broad spectrum cleaning agents for the electronics manufacturing industry, ZESTRON will highlight its latest cleaning agent ATRON® AC 207 at the SMTAI 2011 held from Tuesday, October 18th through Wednesday, October 19th at the Fort Worth Convention Center, Fort Worth, Texas. ATRON® AC 207 is a FAST® Technology-based surfactant PCB cleaner, specifically designed to provide a superior level of material compatibility with sensitive metals. With a bath life that is 3 to 10 times longer than that of traditional surfactants, ATRON® AC 207 offers excellent cleaning results in high and medium pressure inline as well as batch cleaning systems at low concentrations and temperatures. It removes a wide variety of the latest lead-free and eutectic flux residues as well as unsoldered solder pastes. For more information about ATRON® AC 207 as well as ZESTRON's complete line of products and services, please visit us at booth #315 at the SMTAI 2011 or at www.zestron.com. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTAI 2011, please visit http://www.smta.org/smtai/. |
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ZESTRON to Open New Technical Center in Shenzhen, China
Manassas, VA - October 13, 2011 - ZESTRON, the worldwide leading provider of high precision cleaning products and services, will open its 5th global Technical Center in Shenzhen, China. On October 25th, 2011, ZESTRON will celebrate the official inauguration of its newest Technical Support Center in Shenzhen, China. The celebration will include an official opening ceremony to which customers, business partners and local officials have been invited. With the opening of this facility, ZESTRON is adding its 2nd Customer Support Center for China and 5th globally in addition to Europe, the US and South East Asia. This demonstrates ZESTRON's strong commitment to support its Chinese customers for years to come. This more than 1000 m2 state-of-the-art facility features: - a fully equipped Technical Center featuring a range of different cleaning machines by various suppliers that cover all cleaning applications and are available for free-of-charge cleaning trials with customer substrates - a team of highly trained process engineers to support and help customers solve any of their cleaning challenges - fully equipped conference rooms as a platform for technical seminars as well as knowledge exchange and transfer - a complete HD video teleconferencing system that enables ZESTRON and its customers to access any of the company’s global expert engineering teams in the US, Europe and South East Asia For further information, please contact info@zestronchina.com or visit us at www.zestron.com. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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Indium Corporation Technology Experts Presenting at SMTAI 2011
Indium Corporation experts will present their technical findings at SMTA International, October 16-20, 2011, in Fort Worth, TX. Indium Corporation's Vice President of Technology Dr. Ning-Cheng Lee <http://www.indium.com/corporate/bio/ning-cheng_lee.php> will present three papers. The first, High Temperature Lead-Free Solder Joints via Mixed Powder System, talks about the research that was done to develop a mixed powder solder paste technology to design alternative high-temperature, lead-free solder pastes. Dr. Lee's second presentation includes Performance of BGA Assembly Using SAC105Ti Solder Spheres, which discusses the improved drop test performance of a new alloy, designed to reduce the fragility of SnAgCu (SAC) solder joints in assembled BGA/CSP devices. His third presentation, Voiding Control at QFN Assembly, will evaluate various designs of thermal pads, stencil patterns, and reflow profiles and identify the optimal conditions to minimize voiding. Nicole Palma <http://www.indium.com/corporate/bio/nicole_palma.php> , Technical Support Engineer, will present Correlation of SIR, Halide/Halogen, and Copper Mirror Tests. This paper explains the theories behind these test techniques, their differences, and how the presence of halides in the flux activators will affect the SIR and copper mirror results. Brook Sandy <http://www.indium.com/corporate/bio/brook_sandy.php> , Product Support Specialist of PCB Assembly Materials, will present Choosing a Low Cost Alternative to SAC Alloys for PCB Assembly: Preliminary Work. This paper outlines low cost alternatives to near-eutectic SAC alloys for Pb-free assembly, including performance as compared to current options, and approaches to enhance the performance of low-cost solder alloys. Seth J. Homer <http://www.indium.com/corporate/bio/seth_homer.php> , Product Specialist, will present Minimizing Voiding in QFN Packages Using Solder Preforms. This paper quantifies the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing void reduction using preforms will also be presented. Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Nicole joined Indium Corporation in 2004 and spent several years in Quality as a Senior Quality Engineer, focused on SMT solder paste and semiconductor flux products. She now provides technical assistance on the selection, use, and application of solder paste, flux, and engineered solders. Nicole has a bachelor's degree in Biochemistry from Daemen College in Amherst, NY. She is a Certified Quality Engineer from the American Society of Quality and is certified as a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Brook acts as a technical liaison between our customers and internal departments, such as R&D and production, to insure the best quality and selection of products. She also provides support in improving informational materials to assist PCB assembly materials customers. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in Chemical Engineering (with a focus on materials) and German Language. She also authors a blog which can be found at <http://blogs.indium.com/blog/brooksandy> . Seth has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including solder spheres, sputtering targets, indium chemicals, and solder preforms. Seth has also worked extensively with Indium Corporation customer support teams, especially those in China, Singapore, and Europe. He also authors a blog which can be found at <http://blogs.indium.com/blog/seth-j-homer> . Indium Corporation will be exhibiting at booth #321. For more information about SMTAI 2011, visit <http://www.smta.org/> . Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation visit <http://www.indium.com/> or email abrown@indium.com. |
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SIPAD SYSTEMS INC. Appoints The Murray Percival Company and Battleship Technologies As Sales Reps
Well established Rep Groups will help expand the SIPAD presence in The Midwest and Southeast
9/30/2011 - SIPAD Systems Inc announced the addition of two well established manufacturers' representative groups to their sales force. Battleship Technologies is an electronics manufacturer's rep company covering the states of NC and SC. Battleship Technologies represents a select group of highly synergistic manufacturers to the benefit of their company and the customers they serve. Battleship Technologies serves customers in the OEM market segments of Computers, Telecommunications, Industrial, Consumer and Military/Aerospace, both direct and through distribution. The SIPAD process will compliment their line of printed circuits as well as their customers using components and other custom engineered products. In addition, SIPAD Systems has signed an agreement with The Murray Percival Company to cover the Midwest United States including Michigan, Indiana, Ohio and Western Pennsylvania. The Murray Percival Company is a 50 Yr old Sales Rep Firm for the Electronics Industry-equipments and distribution products. Founded in 1960, the Murray A. Percival Company provides a wide array of equipment, processes and consumables to the printed circuit board assembly and repair industries. Representing over 50 different manufacturers, they maintain a multi-state technical sales force and provide on-demand shipping of over 3,000 products throughout the continental United States. SIPAD solid solder deposit (ssd) replaces stencil printing with a more predictable, repeatable and dependable attachment method. SIPAD Systems applies SIPAD to complex surface mount printed circuit boards enabling the attachment of all surface mount parts including very small, fine pitch and blind termination components, by hand or machine, with perfect results. SIPAD Systems Inc. is a 10-year old Georgia-based independent SIPAD solid solder deposit service bureau offering SIPAD ssd coating services to OEM's, CEM's and PCB facilities throughout the U.S. |
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ZESTRON to Present PoP Cleaning Study at the SMTAI 2011
Manassas, VA - October 3, 2011 - Umut Tosun, Application Technology Manager at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present “Is Cleaning Critical to PoP Assemblies” at the SMTAI 2011 in Fort Worth, Texas, on Wednesday, October 19th at 2 pm. This presentation is part of a session titled “Critical Cleaning and the Environment.” Package on package (PoP) assemblies are widely growing in use for applications that require small footprint technology. Typically, this integrated circuit design stacks and integrates logic and memory packages, thereby increasing board density and substantially expanding functionality within the same footprint of a single BGA. As a result, PoP’s have become an ideal component selection for products such as advanced mobile platforms and digital cameras. Cleaning is a critical process within the electronics manufacturing industry. Effective cleaning improves product reliability by ensuring optimal surface resistance and preventing current leakage that can lead to PCB failure. This paper will address the cleanliness level of PoP assemblies including underneath PoP components and in between packages. Expected results will empirically confirm the effectiveness of cleaning technologies for this rapidly evolving technology. For more information on this topic, please join Mr. Umut Tosun at the SMTAI 2011 or contact ZESTRON’s Application Technology Department at (703) 393-9880 www.zestron.com. To register for the SMTAI, please visit http://www.smta.org/smtai/registration_content.cfm. About ZESTRON: Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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JBC Tools Inc. to Highlight Advanced Hand Soldering and Rework Tools at SMTAI
 ST. LOUIS, MO - September 2011 - JBC Tools, Inc., a leading provider of hand soldering and rework tools, announces that it will exhibit in Booth #609 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. A technological leader of tools for hand soldering and rework operations in the electronics industry, JBC provides numerous innovative products to satisfy demanding requirements. For example, its exclusive heating system generates high power with a small-size heater, resulting in a minimum of heated mass and thermal inertia. The system also integrates an extremely sensitive temperature sensor in the heating element, allowing for immediate temperature recovery and high accuracy. The implementation of lead-free soldering has made it necessary to use methods to clean tips with more than a simple wet sponge. JBC offers various methods and tools for cleaning tips that are designed to remove oxidation, flux residues and more. Innovation, efficiency and reliability are the key features of the wide range of products offered by JBC Tools that satisfy the most demanding requirements of professionals. With local offices and a distributor network spanning five continents, JBC Tools guarantees quick and efficient service. Additionally, all JBC products comply with EC regulations and ESD recommendations. Stop by Booth #609 at SMTA International to see JBC Tools’ Nano Station, a complete station designed for micro soldering and desoldering of small-size components such as 0201 and 0402 sized chips. The unique station is designed specifically for precise, under-the-microscope applications. For a private demonstration or to schedule a specific appointment time, contact Francisco Fourcade, Sales Manager at (314) 775-7232 or ffourcade@jbctools.com. For more information about JBC Tools’ full line of hand soldering and rework tools, visit www.jbctools.com. |
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Data I/O Corporation to Exhibit New RoadRunner3 Inline Programming System at SMTAI 2011
Just-in-time programming reduces costs and risks with Factory Integration
 REDMOND, Wash. - August 2011 - Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, will feature the new RoadRunner3 inline programming system, the next generation of the world's only just-prior-to-placement programming solution, in Booth #228 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. With its Factory Integration Software (FIS), RoadRunner3 streamlines the production process and eliminates operator errors through its connection to a firm's manufacturing execution system (MES) or other shop-floor control software and through that connection all the way to the firm's enterprise resource planning (ERP) system. RoadRunner3 —a versatile and configurable high speed automated inline programming feeder that mounts directly onto an SMT machine without consuming additional floor space or altering the production line — easily integrates into existing SMT processes. By removing unprogrammed Flash memory devices from tape, the RoadRunner3 programs four devices in parallel and then delivers the programmed parts to the pickup point of the placement machine. New interface kits for all major SMT machines including SIPLACE, Fuji, Panasonic, and MYDATA allow customers to easily move RoadRunner3 to different SMT machines in their facility. A configurable Tape-In module adjusts for tape widths from 16mm to 44mm, thus allowing for quick job changeover. RoadRunner3 with Factory Integration Software modules FIS Remote and FIS Track allows customers to manage and monitor the programming process. The FIS Remote software module eliminates operator errors through automated job selection and job downloads to RoadRunner3. The FIS Track software module enables data-driven decision making to optimize the programming process and minimize scrap and rework costs through automated collection and export of programming results. To ensure optimal equipment utilization, FIS Remote and FIS Track sends e-mail alerts when RoadRunner3 needs maintenance or when yields drop below a set threshold. RoadRunner3 features FlashCORE III, the world's fastest Flash programming architecture available on the market today for programming high-density Flash memories such as e.MMC, SD and NAND Flash. FlashCORE III is the highest-quality proven solution for programming Microcontrollers, EPROM, EEPROM, NOR Flash and many others. Data I/O has successfully installed hundreds of RoadRunner systems for Tier 1 companies incorporating programming into their lean manufacturing process. Customers are able to eliminate their inventory of pre-programmed devices, dramatically reduce inventory carrying and rework costs, by using the Just-In-Time programming provided by RoadRunner, as well as recognize a rapid ROI in only a matter of months. "Since its introduction over ten years ago, the RoadRunner platform has programmed over 10 Billion devices and enabled the world's leading manufacturers of electronic products to streamline their programming process, literally saving millions of dollars while simultaneously increasing production velocity. RoadRunner3 with Factory Integration Software takes streamlining the programming process to the next level by providing a combination of benefits that offline programming and ISP/ICT solutions simply cannot match, including virtually eliminating operator errors, reducing production risks and delivering the lowest cost per programmed part," said Carl Olson, Director of Engineering at Data I/O. |
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AIM to Showcase NC258 Lead-Free and Tin-Lead Solder Pastes at SMTAI 2011
 AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will exhibit its NC258 Lead-Free and Tin-Lead Solder Paste in Booth #526 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
AIM's most robust solder paste, NC258, has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 Solder Paste reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. Additionally, the paste offers very low post-process residues that remain crystal clear even at the elevated temperatures required for today’s lead-free alloys. Additionally, the company will highlight SN100C® and its wide variety of flux types and solder alloys, including lead-free alloys. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. For more information, meet company representatives in Booth #526 at the show or visit www.aimsolder.com. |
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ZESTRON Adds Aqueous Technology's Trident LD Batch Cleaner to its Technical Center
Manassas, VA - September 26, 2011 - ZESTRON, the global leader in high precision cleaning products and services for the electronics manufacturing industry, is pleased to announce that Aqueous Technologies has equipped ZESTRON's US Technical Center in Manassas, VA, with a Trident LD Batch Cleaner. "The addition of AQT's Trident LD batch cleaner to our equipment portfolio is not only exciting for us but also provides an additional option for our customers who are evaluating their existing cleaning process or planning to install a new one. Upon request, our process engineers are available to conduct free-of-charge cleaning trials to ensure a successful cleaning process implementation," says Michael McCutchen, Vice President Americas and South Asia, ZESTRON. "The Trident LD is one of five pieces of state-of-the-art equipment we have added to our US Technical Center within the last few months," he continues. For more information about the Trident LD, please visit Aqueous Technologies at http://www.aqueoustech.com/index.html. To schedule your free-of-charge cleaning trial at ZESTRON's Technical Center, please contact our Application Technology Department at (703) 393-9880 or visit www.zestron.com |
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ZESTRON to Showcase 'More than Chemistry' at the SMTAI 2011
Manassas, VA - September 27, 2011 - In addition to its complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry, ZESTRON will showcase its peripheral product lines, process solutions, services as well as training and workshop opportunities at the SMTAI 2011 held from Tuesday, October 18th through Wednesday, October 19th at the Fort Worth Convention Center, Fort Worth, Texas. "ZESTRON is more than chemistry," says Michael McCutchen, Vice President Americas and South Asia, ZESTRON. "In addition to our superior line of cleaning agents for PCB, stencil, misprint, underside wipe and maintenance applications, we provide a complete solution package that consists of continuous support during process implementation and operation, engineering tools, vapor recovery devices, analytical and process optimization services as well as workshops and training. Our ultimate goal is to ensure the successful implementation and maintenance of all processes for our clients, thereby guaranteeing a mutually beneficial business partnership." For more information about ZESTRON's cleaning process solutions, please visit us at booth #315 at the SMTAI 2011 or at www.zestron.com. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTAI 2011, please visit http://www.smta.org/smtai/. |
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ZESTRON to Showcase 'More than Chemistry' at the SMTA Long Island Chapter Expo and Technical Forum
Manassas, VA - September 16, 2011 - In addition to its complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry, ZESTRON will exhibit its peripheral product lines, process solutions, services as well as training and workshop opportunities at the SMTA Long Island Chapter Expo and Technical Forum held at the Islandia Marriott Long Island, 3635 Express Drive North, Islandia, NY 11749 on Wednesday, September 21, 2011. The technical sessions start at 10:30 am and the expo showcase will be held from 11 am until 6 pm. "Simply put, ZESTRON is more than chemistry," says Michael McCutchen, Vice President Americas and South Asia, ZESTRON. "In addition to our superior line of cleaning agents for PCB, stencil, misprint, underside wipe and maintenance applications, we provide a complete solution package that consists of process support, engineering tools, vapor recovery devices, analytical and process optimization services as well as workshops and training." "In fact, following this chapter show, we will be hosting a free-of-charge troubleshooting workshop at our US headquarters featuring seven presentations and hands-on training provided by some of the most well-known companies in the industry. These include Speedline, MPM, Kester, Sawa, DfR Solutions and SMT North America," he continues. For more information about ZESTRON’s cleaning process solutions, please visit us at our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTA Long Island Chapter Expo and Technical Forum, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=27. For more information about our upcoming free-of-charge workshop, please visit http://www.zestron.com/us/electronics/upcoming-events.html. Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements. For additional information and to tour one of our unparalleled technical centers, please visit http://www.zestron.com. |
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Atotech's New Semiconductor Grade Chemistry Facility in Neuruppin, Germany
Green Lights for Customer Qualifications
To meet the demands of the semiconductor industry, Atotech has enhanced its production capabilities by constructing a production plant dedicated to the manufacture of high purity chemistry. On Monday, September 12th, 2011 Atotech celebrated the introduction of its new strategic semiconductor grade plating chemistry facility in Neuruppin, Germany.  The internal production qualification has been successfully completed and the facility is now ready for on-site customer qualifications. In addition to the introduction of the facility - its equipment and capabilities - we showcased our competitive advantage and provided an industry update on high purity chemistry in metallization technology solutions used for semiconductor and MEMS applications. In doing so, Atotech was able to both upgrade its existing production facilities and improve conventional methods of production to fully-automatic custom-designed production. Located 40 miles northwest of Atotech Headquarters in Berlin, the new facility specializes in high purity and ultra high purity chemistry production, made possible by the use of selected and qualified raw materials and processes, closed systems, and class 1000 mini-environments for filling. The plant itself has a production area of 700m² (7500ft²) with additional areas designated for ultra pure water generation, analytical equipment, and warehousing.  State of the Art Semiconductor Grade Chemistry ProductionThe production facility is designed to satisfy the high purity chemistry demands of the semiconductor industry by use of highly automated manufacturing methods and enclosed production environments. The newest engineering design techniques were used to ensure the manufacture of highest quality products while reducing chemical consumption and waste water in order to provide global, cost-effective process solutions. Production methods have been optimized to reduce contamination in the final product and allow for ease purging and cleaning. In addition to delivering these new capabilities, the facility raises the bar in terms of internal production quality and customer qualification standards, thereby presenting customers and end-markets with a true single advantage. The new facility sets new standards in chemistry manufacturing and provides us with a means of branching out from conventional methods of production to semi-automatic custom-designed production, while increasing annual production levels overall. Chemistry Production Flow Prior to production, raw materials are carefully selected and qualified by a skilled R&D team. Production begins with the filtration and dosing of raw materials via the Chemistry Distribution System (1). Each raw material container uses a separate, isolated dosing system for transfer to the mixing vessel. In the mixing vessel, liquid raw materials are combined with Ultra Pure Water and are sent through the filtration loop (2), where samples are extracted. After filtration, the chemistry is transferred to the filling stations for bottling of final products (3). 1. Chemistry Distribution System (CDS) - Separate and isolated distribution for each liquid raw material - Automated dosing and circulation loop for filtration of raw materials 2. Mixing Vessel - Ultra Pure Water using reverse osmosis, EDI units and in-line TOC - Inside spray device for in-place vessel cleaning, gas exhaust apparatus and overflow safety device - Filtration of final product down to 0.2µm, monitored by Optical Particle Counter (OPC) 3. Filling Station - Class 1000 clean room environment for filling - Filling apparatus and piping with automatic valve - Weighing unit for precise and consistent filling Turning to its code of conduct that has been successfully implemented among its own and partner locations worldwide, Atotech has been paying special attention to critical issues such as social awareness, environmental protection, health and safety, and the intricacies of the existing work environment in Neuruppin, Germany. As the heart of Atotech's chemical production, the Neuruppin facility will continue to play a key role in the company for years to come. The location is already a center of Atotech manufacture, serving our entire market and customers all over the world. About Atotech With annual sales of 779 million Euros, Atotech is one of the world's leading manufacturers of processes and equipment for the printed circuit board industry and the decorative and functional surface finishing industry. Committed to sustainability, Atotech develops technologies that minimize waste and reduce environmental impact. Atotech is headquartered in Berlin, Germany and employs about 3,300 people in more than 40 countries. |
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ZESTRON to Host SMT Troubleshooting Workshop
Manassas, VA - September 12, 2011 - Together with Kester and DfR Solutions as well as four other well-known EMS suppliers, ZESTRON, the worldwide leading provider of cleaning process solutions, services and training for the electronics manufacturing industry, will host an extensive, free-of-charge, one day workshop at ZESTRON's US headquarters on September 27 and 28, 2011, from 8:15 am to 5:00 pm. With seven presentations and hands-on training provided by each of the participating companies, this comprehensive one-day workshop will provide in-depth information on the key elements for a successful SMT process. In particular, Kester will address potential reliability challenges caused by solder paste and flux residues as well as decreasing pitch. DfR Solutions will provide detailed information on contamination and cleanliness and a practical approach to today's challenging industry requirements. Additionally, this theoretical as well as practical workshop will feature presenters from Speedline, MPM, SMT North America, Sawa and ZESTRON to thoroughly cover topics, such as stencil cleaning, reflow oven as well as inline cleaning process optimization and troubleshooting techniques, cleaning process control methodologies and detailed information on how to optimize your printer's underside wipe process. For more information or to participate in this free-of-charge event, please contact Sal Sparacino at s.sparacino@zestronusa.com or visit http://www.zestron.com/us/electronics/upcoming-events.html. |
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ZESTRON to Present Award Winning Paper at the SMTA's Upper Midwest Chapter Meeting
Manassas, VA - September 7, 2011 - Ravi Parthasarathy, Senior Process Engineer at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will present "Fluid Flow Mechanics – Key to Low Standoff Cleaning" at the SMTA's Upper Midwest Chapter meeting held at the Hennepin Technical College, Eden Prairie Campus, 13100 College View Drive, Eden Prairie, MN 55347, on September 13, 2011. More than five years ago, ZESTRON first discussed cleaning underneath 4 MIL standoff components. With the emergence of lead-free solder and flux as well as a miniaturization of components and an increase in board densities, the latest challenges include components with less than 1 MIL gaps. This study was designed to specifically investigate the impact of mechanical vs. chemical energy during the removal of contamination under 1-2 MIL standoff components. To validate the results obtained, extensive experiments were conducted, including actual user case-studies, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help customers in the future. These included but were not limited to various flow patterns and industry leading cleaning agents. As a result, the authors also included experimental data that addressed fluid flow mechanics as well as temperature and concentration related effects. For more information on this topic, please join Mr. Ravi Parthasarathy at the SMTA's Upper Midwest Chapter meeting or contact ZESTRON's Application Technology Department at (703) 393-9880 (www.zestron.com). To register for this event, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=1#chapter_news. |
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SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards
Hong Kong - Sep 07, 2011 - SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen. Flextronics Industrial (Zhuhai) Ltd's Henley Zhou was awarded the Best Paper of Technology Conference One (CS11) for "Tolerance Stack-up Analysis Case Study for SMT End to End Yield Improvement". Hong Kong University of Science and Technology's Dr. Fubin Song received the award for the Best Paper of Technology Conference Two (CS11) for "Effect of Pad Design and PCB Material on the Pad Cratering Failure". IBM CPC's Wayne Zhang was awarded the Outstanding Paper of Technology Conference One (CS11) for the presentation titled "Fine Pitch Compliant Pin Connector Attachment and Rework Challenges and Solutions". Atotech Asia Pacific Ltd's Dr. Kenneth Lee received the award for the Outstanding Paper of Technology Conference Two (CS11) for the presentation titled" Corrosion Resistance of different PCB Surface Finishes in Harsh Environments". Huawei Technology's Roger He was awarded the Best Presentation of Technology Conference One (CS11) for the presentation titled "PCB Creep Corrosion and Board Design Considerations". Atotech Asia Pacific Ltd's Dr. Kenneth Lee received the award for the Best Presentation of Technology Conference Two (CS11) for the presentation titled "Corrosion Resistance of different PCB Surface Finishes in Harsh Environments". Nordson MARCH's Dr. Jack Zhao received the award for the Outstanding Presentation of Technology Conference one (CS11) for the presentation titled "High Reliability and Yield Wire Bonding Processing with Plasma". Zymet Incorporated's Dr. Simon Zhang received the award for the Outstanding Presentation of Technology Conference Two (CS11) for the presentation titled "Reliability Impact of Underfills on Area Array SMD Assembly with Mathematic Approach". Kyzen Corporation's Phil Zhang was awarded the Best Presentation of Vendor Conference One (CS11) for the presentation titled "Cleaning Flux Residue from under Bottom Termination Components". PVA's Lim Seng Chong was awarded the Best Presentation of Vendor Conference Two (CS11) for the presentation titled "Electronic Potting -Design for Success". Dongguan Anda Automation Equipment Co., Ltd's Jieyuan Liu was awarded the Best Presentation of Vendor Conference Three (CS11) for the presentation titled "The Coating Equipment Application in Production". The award for The Best Emerging Exhibit of the Year went to ECD Inc. for its SuperM.O.L.E. Gold 2 Temperature Profiling Kit. The award for The Best Exhibit Technology of the Year went to BTU International Inc. for its Pyramax 125N Nitrogen Convection Reflow System. |
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7 Presentations and Hands-on Training: ZESTRON to Host SMT Troubleshooting Workshop
Manassas, VA - September 6, 2011 - Together with MPM and Speedline as well as four other well-known EMS suppliers, ZESTRON, the worldwide leading provider of cleaning process solutions, services and training for the electronics manufacturing industry, will host an extensive, free-of-charge, one day workshop at ZESTRON's US headquarters on September 27 and 28, 2011, from 8:15 am to 5:00 pm. With seven presentations and hands-on training provided by each of the participating companies, this comprehensive one-day workshop will provide in-depth information on the key elements for a successful SMT process. In particular, Speedline will be presenting optimization and troubleshooting techniques for inline cleaning equipment. MPM will provide detailed instructions on printer optimization with a focus on underside wipe processes. Additionally, this theoretical as well as practical workshop will feature presenters from SMT North America, Kester, Sawa, DfR and ZESTRON to cover topics, such as stencil cleaning, reflow oven optimization and troubleshooting techniques, cleaning process control methodologies, reliability challenges caused by solder paste and flux, as well as a practical approach to addressing today’s challenging industry requirements for cleanliness. For more information or to participate in this free-of-charge event, please contact Sal Sparacino at s.sparacino@zestronusa.com or visit http://www.zestron.com/us/electronics/upcoming-events.html. |
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ZESTRON to Showcase 'More than Chemistry' at the SMTA Capital Chapter Expo
Manassas, VA - September 1, 2011 - In addition to its complete portfolio of broad spectrum cleaning chemistries for the electronics manufacturing industry, ZESTRON will showcase its peripheral product lines, process solutions, services as well as training and workshop opportunities at the SMTA Capital Chapter Expo and Tech Forum held at the Johns Hopkins Applied Physics Lab on September 13th, 2011. Show hours are from 8 am to 4 pm. "ZESTRON is more than just chemistry," says Michael McCutchen, Vice President Americas and South Asia, ZESTRON. “In addition to our superior line of cleaning agents for PCB, stencil, misprint, underside wipe and maintenance applications, we provide a complete solution package that consists of process support, engineering tools, vapor recovery devices, analytical and process optimization services as well as workshops and training. In fact, soon after the SMTA Capital Chapter Expo, we will be hosting a free-of-charge troubleshooting workshop at our US headquarters featuring seven presentations and hands-on training provided by some of the most well-known companies in the industry. These include Speedline, MPM, Kester, Sawa, DfR Solutions and SMT North America." For more information about ZESTRON’s cleaning process solutions, please visit us at our tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have. To register for the SMTA Capital Chapter Expo and Tech Forum, please visit http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=14. For more information about our upcoming free-of-charge workshop, please visit http://www.zestron.com/us/electronics/upcoming-events.html. |
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ZESTRON's Highlight At NEPCON Shenzhen 2011
ZESTRON, the leading supplier of cleaning agents and services for SMT and Semicon Backend industry will exhibit ATRON® AC 207 during the upcoming NEPCON Shenzhen 2011 (booth #1C40). ATRON® AC 207 is a FAST® Technology-based surfactant defluxing agent, specifically designed to provide a superior level of material compatibility with sensitive metals. With a bath life that is 3 to 10 times longer than that of conventional surfactants, ATRON® AC 207 offers excellent cleaning results in high and medium pressure inline as well as batch cleaning systems at low concentrations and temperatures. It removes a wide variety of the latest lead-free and eutectic flux residues as well as unsoldered solder pastes. FAST® Technology - Fast Acting Surfactant Technology - is an innovative surfactant-based cleaning technology developed and introduced by ZESTRON in 2007. FAST® Technology based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of a wide variety of the latest lead-free and leaded flux residues. For more information about ATRON® AC 207 or the FAST® Technology, please visit our booth (#1C40) at NEPCON Shenzhen or www.ZESTRON.com. |
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ZESTRON to Host Joint Workshop on Troubleshooting the SMT Process
ZESTRON to Host with Speedline, MPM, Kester, Sawa, SMT North America and DfR Solutions
Manassas, VA - August 23, 2011 - Together with six well known EMS suppliers, ZESTRON, the worldwide leading provider of cleaning process solutions, services and training for the electronics manufacturing industry, will host an extensive, free-of-charge one day workshop at ZESTON's US headquarters on September 27 and 28, 2011, from 8:15 am to 5:00 pm. This comprehensive one-day training provides in-depth information on the key elements for a successful SMT process as well as hands-on demonstrations by each of the participating companies. The theoretical as well as practical portions of the workshop will cover topics, such as stencil cleaning, reliability challenges caused by solder paste and flux residues, underside wipe processes, reflow, process control methodologies, troubleshooting the inline cleaning process as well as a practical approach to addressing today’s challenging industry requirements for cleanliness. For more information or to participate in this free-of-charge event, please contact Sal Sparacino at s.sparacino@zestronusa.com or visit http://www.zestron.com/us/electronics/upcoming-events.html |
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SEHO's Gus Mavrou to Discuss Robust Selective Soldering Practices at SMTAI
ERLANGER, KY - September 2011 - SEHO, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, announces that Gus Mavrou will present a paper titled “How Detailed Design Guidelines Can Improve Soldering Quality and Reduce Costs in Selective Through-Hole Soldering Processes” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session MFX5, titled “Developing a Robust Selective Solder Process,” which will take place Wednesday, October 19, 2011 from 2:00-3:30 p.m. in Room 202D. For companies producing electronic equipment, it is of existential importance to reduce production costs while maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is unacceptable due to the required quality and the requested reproducibility of the whole manufacturing process. Additionally, densely populated multilayer boards and miniaturized, high-pin-count, fine-pitch devices cannot be efficiently repaired with high quality. "Hidden costs," such as productivity rates, operator training and damaged assembly costs have to be taken into consideration as well. Special focus must be given to lead-free applications as manual repair soldering processes can cause enormous thermal problems. Therefore, the target is a zero-fault soldering process that applies particularly for the soldering of single through-hole components after reflow. With many practical examples, this presentation provides a detailed explanation of the individual points that should be found in the selective soldering process with regard to the assembly design and solder nozzle technology. |
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R&D Technical Services' David Suihkonen to Present Vapor Phase Soldering at SMTAI
 BURNSVILLE, MN - September 2011 - Vapor phase manufacturer R&D Technical Services Inc. announces that David Suihkonen, President, will Chair a technical session at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentations will be held during session SMT4, titled Vapor Phase Soldering - Reflow to Rework Applications, which will take place Wednesday, October 19, 2011 from 8-9:30 a.m. in Room 202C. The technical session will consist of the presentations of three case studies for the uses of Vapor Phase Reflow and Rework. From tin whisker mitigation improvements for reflow to high-reliability solder reflow and vapor phase used as a rework process, this session will cover various vapor phase uses, process requirements and benefits, and will shed light on many of the discussion points currently revolving around vapor phase. Challenges for the three case studies will be revealed and solutions presented. The three case studies and authors include Anthony Primavera, Ph.D., “In-Process Reduction Mitigation of Tin Whiskers by Condensing Vapor Reflow”; Rupen Trivedi, "Vapor Phase Rework - A Case Study for Heavy Thermal Challenges of Complex Assemblies;" and Michael S. Clawson, "Overcoming the Challenges of High Mix, Leading Edge Technologies in a High Reliability Environment with Vapor Phase Reflow." The session promises to be of great interest to SMTAI attendees. |
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Kyzen's Dr. Mike Bixenman to Discuss Compatibility of Cleaning Agents at SMTAI 2011
 NASHVILLE - September 21, 2011 - Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present “Compatibility of Cleaning Agents with Nano-Coated Stencils” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session SMT5, titled “Cleaning Interactions With Assembly Processes,” which will take place Wednesday, October 19, 2011 from 10:30 a.m. - 12 p.m. in Room 202C. Dr. Bixenman co-authored the paper with David Lober, Process Chemist. High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and µBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes and to develop a quantitative method for measuring nano-coating thickness remaining on the stencil surface. Co-founder and CTO of Kyzen Corporation, Dr. Mike Bixenman has more than 35 years of experience in the precision cleaning field, and is an active researcher and innovator. Dr. Bixenman chaired the IPC-CH-65B Cleaning Handbook and the IPC-7526 Stencil Cleaning Handbook. |
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Cobar's Gerjan Diepstraten to Present at SMTAI 2011
 September 2011 - The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled "Are Selective Soldering Fluxes Reliable," at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session MFX5 titled "Developing a Robust Soldering Process," which will take place Wednesday, October 19, 2011 from 2-3:30 p.m. in room 202D. Miniaturization results in more SMD components on the printed circuit board. This includes more reflow applications. The through-hole components that are still on the assembly may need to be soldered automatically to assure the highest quality. The way to make these connections will depend on the number of joints to be soldered, but for most products, selective soldering will be the best alternative for wave soldering in pallets or hand soldering. The objectives of this presentation are to demonstrate a reliable selective soldering application and identify differences between alcohol (rosin), low VOC and VOC-free flux systems. Additionally, the presentation will identify the impact of process parameters on the reliability of assemblies. Statistical analyses using Taguchi as well as Full Factorial Experiments are used to study the impact of the selected process parameters on the surface insulation resistance of the soldered test boards. Thermo-Gravimetric Analysis (TGA) is the method that is used to monitor activity of the flux system during these soldering conditions. Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group. For more information visit: www.cobar.com. |
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Christopher Associates' Jasbir Bath to Present on Low Silver Pb-Free Alloy Solder at SMTAI
 September 2011 - Christopher Associates/Koki Solder announce that Jasbir Bath, Consulting Engineer, co-authored the paper titled “An Investigation into Low Silver Lead-Free Alloy Solder Paste for Electronics Manufacturing Applications,” to be presented at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 16-20, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session MFX4, titled “Alternate Lead-Free Alloys: Materials and Processes,” which will take place Wednesday, October 19, 2011 from 10:30 a.m.-12p.m. in Room 202D. The electronics industry has widely adopted Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. One of the challenges with this alloy is the use of the three percent silver that has caused rapid price increases in solder alloys because of the limited global availability of silver metal. Low silver containing alloys have been developed to address the cost issue, but they have been mainly found to have reduced thermal cycling reliability performance compared with Sn3Ag0.5Cu. Development was performed on a new lead-free solder alloy (Sn0.1Ag0.7Cu0.03Co) as a potential replacement for Sn3Ag0.5Cu. Bulk alloy mechanical testing was performed for Sn0.1Ag0.7Cu0.03Co, Sn3Ag0.5Cu, Sn0.3Ag0.7Cu and SnCuNi solder alloys. Solder joint thermal cycling tests showed equivalent or better reliability for the Sn0.1Ag0.7Cu0.03Co alloy compared with Sn3Ag0.5Cu. Additionally, copper erosion tests were performed with the low silver cobalt containing alloy showing reduced copper erosion versus Sn3Ag0.5Cu. Reflow profile development also was performed with the 227°C melting point Sn0.1Ag0.7Cu0.03Co alloy to understand peak temperature and time above liquidus guidelines during board assembly. The presentation will report on the results of these tests. Jasbir is a Consulting Engineer for Christopher Associates/ Koki Solder in the Americas. He was the Corporate Lead Engineer with Solectron Corporation and Flextronics International for ten years with a role involving tin-lead and lead-free solder process development. |
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Charlie Barnhart & Associates LLC's (CBA) Eric Miscoll to Discuss Electronics Outsourcing at SMTAI
 CHICAGO, IL - September 2011 - Charlie Barnhart & Associates LLC (CBA), a leading provider of hard data about the cost drivers and risks of global electronics manufacturing, announces that Eric Miscoll, Principal, will present a paper titled “How to Calculate the True Cost of Global Electronics Outsourcing” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session BUS1, titled ”Supply Chain Management: Modeling, Processes, and Obsolescence,” which will take place Tuesday, October 18, 2011 from 2-4 p.m. in room 202D. The outsourcing of electronics manufacturing has become a common business solution for many OEMs. Unfortunately, conducting an accurate True Cost of Outsourcing (TCO) analysis is less common. OEMs and EMS alike need to be able to do so in order to determine when the use of outsourcing to specific geographies is the best viable business solution. As the outsourcing of electronics manufacturing by OEMs has grown into a global industry over the last few decades, it has become increasingly important that OEMs analyze the total cost of their outsourcing initiatives and not focus just on the price paid to their EMS and ODM suppliers. A proper TCO analysis involves consideration of costs both inside and outside of the OEM. This paper will present the variables that are involved in such and analysis. For more information about Charlie Barnhart & Associates LLC, visit www.charliebarnhart.com. |
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Data I/O Corporation to Unveil New RoadRunner3 Inline Programming System at SMTAI 2011
Just-in-time programming reduces costs and risks with Factory Integration
 REDMOND, Wash. - August 2011 - Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, will debut the new RoadRunner3 inline programming system, the next generation of the world's only just-prior-to-placement programming solution in Booth #228 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. With its Factory Integration Software (FIS), RoadRunner3 streamlines the production process and eliminates operator errors through its connection to a firm's manufacturing execution system (MES) or other shop-floor control software and through that connection all the way to the firm's enterprise resource planning (ERP) system. RoadRunner3 - a versatile and configurable high speed automated inline programming feeder that mounts directly onto an SMT machine without consuming additional floor space or altering the production line-easily integrates into existing SMT processes. By removing unprogrammed Flash memory devices from tape, the RoadRunner3 programs four devices in parallel and then delivers the programmed parts to the pickup point of the placement machine. New interface kits for all major SMT machines including SIPLACE, Fuji, Panasonic, and MYDATA allow customers to easily move RoadRunner3 to different SMT machines in their facility. A configurable Tape-In module adjusts for tape widths from 16mm to 44mm, thus allowing for quick job changeover. RoadRunner3 with Factory Integration Software modules FIS Remote and FIS Track allows customers to manage and monitor the programming process. The FIS Remote software module eliminates operator errors through automated job selection and job downloads to RoadRunner3. The FIS Track software module enables data-driven decision making to optimize the programming process and minimize scrap and rework costs through automated collection and export of programming results. To ensure optimal equipment utilization, FIS Remote and FIS Track sends e-mail alerts when RoadRunner3 needs maintenance or when yields drop below a set threshold. RoadRunner3 features FlashCORE III, the world's fastest Flash programming architecture available on the market today for programming high-density Flash memories such as e.MMC, SD and NAND Flash. FlashCORE III is the highest-quality proven solution for programming Microcontrollers, EPROM, EEPROM, NOR Flash and many others. Data I/O has successfully installed hundreds of RoadRunner systems for Tier 1 companies incorporating programming into their lean manufacturing process. Customers are able to eliminate their inventory of pre-programmed devices, dramatically reduce inventory carrying and rework costs, by using the Just-In-Time programming provided by RoadRunner, as well as recognize a rapid ROI in only a matter of months. “Since its introduction over ten years ago, the RoadRunner platform has programmed over 10 Billion devices and enabled the world's leading manufacturers of electronic products to streamline their programming process, literally saving millions of dollars while simultaneously increasing production velocity. RoadRunner3 with Factory Integration Software takes streamlining the programming process to the next level by providing a combination of benefits that offline programming and ISP/ICT solutions simply cannot match, including virtually eliminating operator errors, reducing production risks and delivering the lowest cost per programmed part,” said Carl Olson, Director of Engineering at Data I/O. |
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ZESTRON at SMTA China South Technical Conference 2011 in Shenzhen
ZESTRON will participate in the upcoming SMTA China South Technical Conference at the Shenzhen Internation Exhibtion Center, which will be held during the NEPCON Shenzhen 2011. Visitors are invited to attend ZESTRON's technical presentation on August 30th from 1:45 pm to 2:15 pm. The topic this year is "pH-Neutral vs. Alkaline Cleaning Agents." This collaborative study was conducted to compare the cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations. The study employed the use of industry recognized Umpire (including IPC-B-24 test patterns) and IPC approved B52 test boards. While the most challenging component geometries were chosen, the authors also determined the need to quantify cleanliness to provide data that was not included in previous publications related to this topic. Extensive SIR, Ion Chromatography and analytical test data were accumulated to validate the visual residue analysis. As a secondary point of assessment, material compatibility effects were also examined. Particularly sensitive materials were chosen for exposure under worst case scenarios. They included but were not limited to anodized aluminum and certain nickel alloy substrates. Specialized, high resolution spectroscopic images were captured to ascertain close surface effects. Furthermore, to learn about the FAST® technology based PCB cleaning agent ATRON® AC 207, customers are encouraged to visit ZESTRON's booth (#1C40) at the NEPCON Shenzhen 2011. Our local engineering team will be readily available to answer all your questions regarding our innovative product and process technologies. |
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ZESTRON's President Dr. Harald Wack Moves to European HQ to Assume Overall Responsibility
Manassas, VA - August 16, 2011 Dr. Harald Wack, president of ZESTRON, the worldwide leading provider of high precision cleaning products and services, has recently moved to the company's European HQ in Ingolstadt, Germany, to assume the additional responsibility of managing Dr. O.K. Wack Chemie. Dr. O.K. Wack Chemie, was founded by Harald's father, Dr. Oskar K. Wack, in 1975 in his garage and quickly became the leading European manufacturer of premium care products for motor vehicles and motorcycles. After many years of continued expansion in precision surface cleaning, Dr. O.K. Wack Chemie diversified into the electronics cleaning market and established ZESTRON in 1990 with the passing of the Montreal Protocol. Since then, the company has experienced tremendous growth leading to the inauguration of four Technical Centers worldwide (Ingolstadt, Germany; Manassas, VA; Kulim, Malaysia; Shanghai, China) and thereby the ability to offer globally linked engineering and sales support around the clock. "It is an absolute honor and a humbling experience to have the opportunity to lead our family business that my father built from the ground up,” says Dr. Harald Wack. ”ZESTRON has long become more than chemistry. Leveraging our worldwide ZESTRON assets, the company's R&D and engineering staff services its customer base not only through the development of revolutionary cleaning agents, the implementation of new cleaning processes and process optimizations, but also through extensive research, presentations of white papers, on-site training, workshops, webinars and multiplier collaboration. I look forward to leading the company's continued growth and expansion in the years to come." As part of this organizational change for ZESTRON America, Michael McCutchen has been promoted to Vice President Americas and South Asia and Christine Demetz to Operations Manager while Dr. Harald Wack has assumed the role of president for ZESTRON and Dr. O.K. Wack Chemie. |
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FHP Reps LLC to Exhibit at SMTA International 2011
GRANBURY, TX - August 2011 - FHP Reps LLC, a leading manufacturers’ representative corporation, specializing in solutions for electronics manufacturing, will exhibit in Booth #441 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Representatives from FHP Reps will display products from the following companies: ASI – Proven innovator and leader in providing innovative adhesive solutions (www.instantca.com). AVEN – High performance precision tools and optical inspection systems (www.aveninc.com). Daylight – Magnifying lamps and task lighting (www.us.daylightcompany.com). Panasonic – Innovative pick-and-place systems and printers (www.panasonic.com) Speedprint – Innovative stencil printers (www.speedprint-tech.com). RED-E-SET - Universal Board Support System (www.production-solutions.com). Schleuniger – High-precision wire and cable processing (www.schleuniger.com). Vi Technologies – AOI and SPI inspection systems (www.vitechnology.com). Zestron – High-precision cleaning products and services (www.zestron.com). For more information about FHP Rep’s products and services, contact Keith Favre at 719-238-2747 or on the Web at www.fhpreps.com. |
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Production Solutions to Highlight the New RED-E-SET GO! at SMTAI 2011
POWAY, CA - August 2011 - Production Solutions Inc., manufacturer of the industry-leading Red-E-Set Board Support System, will highlight the new RED-E-SET GO!, ML and AutoSet in FHP Reps’ Booth #441 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. PSI developed the GO!, a cost-effective PCB support solution for pick-and-place, AOI and SPI machines, using a patent-pending, non-locking, resilient pin and polyurethane design. The GO! removes board sag, dampens board bounce, and is entirely hands- and tool-free. Shipped from the factory set to the correct height, the GO! self adjusts and requires no setup, air, power or machine modification. Once placed in the machine, support tooling becomes hassle- and worry-free, making it the most flexible, easy-to-use support tool worldwide. With the addition of the GO!, the RED-E-SET product line now offers three different levels of support tooling, from the GO! to the mid-range ML Manual Lock, to the fully automatic AS AutoSet. All of the RED-E-SET products are proven to reduce changeover times, improve quality, eliminate component damage, and increase revenue once implemented on any screen printer, pick-and-place, chip shooter or dispensing machine. For more information about Production Solutions' new RED-E-SET GO!, visit www.production-solutions.com. |
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Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011
OSAKA, JAPAN - September 2011 - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. SN100C (551CT) fluxed-cored solder wire, newest addition to the SN100C lead-free solder series, combines the benefits of a eutectic lead-free alloy with a robust, high temperature capable cored flux for high-speed sequential soldering. The cored flux is formulated for high soldering tip temperatures up to 380°C with good tip separation for reduced icicles, allowing fast wetting and high spreadability, The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. SN100C (551CT) is specifically designed for high-speed robotic soldering processes and the excellent wetting and high spread factor offers increased soldering speeds with hand soldering as well. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305. Now in the 12th year since its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion, and cost effectiveness. Nihon Superior also will display several next-generation products that are completely halogen-free, which means there are no intentional additions of the halogens F, Cl, Br or even I hidden in the chemistry. SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls. The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C P603 D4 and SN100C P605 D5/D6 dispensing grade lead-free solder pastes offer superior dispensing stability, ensuring no skipped pads. SN100C P605 D5/D6 is optimized for high precision dispensing for chip components down to 01005(0402 metric). Being completely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction. SN100C (044) completely halogen-free high performance flux-cored solder wire makes it possible to achieve a high first-pass yield due to its excellent wetting and spread, while providing approximately 30 percent faster soldering speeds in manual soldering when compared to the company's previous halogen-free flux-cored solder wire. For more information about Nihon Superior's new SN100C (551CT) fluxed-cored solder wire or any of its completely halogen-free products, meet company representatives in Booth #310 at the show or visit www.nihonsuperior.co.jp. |
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LORD Corporation’s Wang To Present At Electrical Manufacturing & Coil Winding Expo
LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries – has announced that Larry Wang, Ph.D., staff scientist, Electronic Materials Research and Development at LORD Corporation, will present a paper at the 2011 Electrical Manufacturing and Coil Winding Expo. The paper will be presented on Sept. 21 at the Opryland Convention Center in Nashville, Tenn. at 12:30 p.m. Wang’s paper is entitled: “Inherently Flexible Epoxy Encapsulant – New Alternative for Low-Stress Electronic Packaging.” The presentation will provide an overview of low-stress electronic packaging and new encapsulation materials and solutions, such as flexible epoxy gels, to meet the need of protecting sensitive components in harsh environments. Results of physical and mechanical property testing, chemical and humidity exposure, and high-temperature exposure experiments will be discussed. In today’s marketplace, electronic component technology has been moving steadily towards high functionality, smaller size and complex designs. At the same time, components are being used in a wide variety of industries and integrated into new and more demanding applications than ever before. To meet these industry demands, LORD Corporation responded by developing a unique low-stress epoxy gel encapsulant – ES-100. This epoxy encapsulant provides an alternative option for customer applications with harsher demands such as resistance to high temperatures and chemicals. Wang is responsible for the development and commercialization of new materials for the electronics market. With expertise in various areas including conductive materials, adhesives, underfills, potting and encapsulants, he has also served in a technical supporting role for the LORD electronics business. Having worked for LORD Corporation for 10 years, Wang has more than 20 years of combined industrial experience focused on adhesives, coatings and potting encapsulants for the electronics industry. Wang earned his Ph.D. in polymer science from Peking University. For more information, please visit http://www.electricalmanufacturing.org |
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Indium Corporation Technology Expert Presenting at EMPC
Indium Corporation's Technical Manager Karthik Vijay will present his technical findings at the European Microelectronics and Packaging Conference (EMPC), September 12-15, 2011, in Brighton, UK. Karthik will present Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window. This paper describes the development of a flux technology platform to realize print consistency, eliminate head-in-pillow, obtain complete solder coalescence and prevent clumpy solder joints, and achieve very low voiding. Karthik will also present Power Electronics - Solder TIMs (Thermal Interface Materials) for Improved Thermal Management, which discusses the work done on solder TIMs that have been developed for high-power applications and how they compare to thermal grease. These papers will be available online at www.indium.com/whitepapers after publication at EMPC. Karthik joined Indium Corporation in 2003. He earned his master's degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six-Sigma Green Belt certification from Dartmouth College's Thayer School of Engineering. Indium Corporation will also participate in the exhibition September 13-15. For more information about EMPC 2011, visit www.empc2011.com. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. |
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Mentor Graphics to Display Software Solution Plans at SMTA International 2011
The Valor Division of Mentor Graphics is the world leader in software solutions for DFM and manufacturing productivity improvement, covering all segments of electronics PCB assembly. With more than 930 customers in 45 countries, we understand the complexity and dynamic nature of the electronics industry and the business challenges facing our customers. Valor's software solutions span from design verification, data validation, process engineering, test and inspection engineering, manufacturing planning and operations management (MOM/MES). Visit our booth #300 for a demonstration. |
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Cobar Solder Products to Introduce SELective Soldering Package at SMTAI 2011
 September 2011 - The BalverZinn Group announces that Cobar Solder Products Inc. will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The SEL package is a collection of soldering materials that is specially designed to make the most reliable assembly solder joints using a selective soldering application. The package is unique because it contains more than just materials. Selective soldering has overtaken wave soldering applications and has some critical areas that can only be overcome using the right materials, process control and knowledge. Balver Zinn/Cobar has developed chemistry with properties that are required to make reliable solder joints. The company offers four different fluxes that have the right properties for high temperature applications and are chemical inert even when they are not activated. In other words, using these fluxes will take away any concerns regarding reliability, dendrite formation or corrosion issues. These fluxes have excellent spreading properties, and the low VOC flux types are environmentally friendly since they minimize alcohol emission. Balver Zinn/Cobar has it all: chemicals and metals. All fluxes are optimized to work with the metals manufactured by the company. In order to meet all different types of selective soldering applications, the solder alloy package is diverse. The package contains different alloys offered in wire on a reel (of course different wire diameters are available), special small 500 gram solder bars, or hemispherical pallets. Additionally, the package contains special materials such as a nozzle cleaning chemistry in case wettable nozzles are used in the process. Only supplying solder alloy and chemistry is not enough for a consistent selective soldering process. The high temperature makes the process sensitive for copper leaching. The SN100C alloy is the most dedicated alloy for selective solder applications because of its low copper leaching and low metal erosion. The package also includes solder sample analysis free of charge. The Balver Zinn/Cobar lab will analyze the solder bath sample and give recommendations regarding maintaining the composition. The BalverZinn/Cobar team has experts with decades of experience in all types of selective solder applications. Engineers are available to provide support whenever special attention is needed to optimize the process. For detailed studies on metallurgy and/or chemistry, the company uses its well-equipped laboratories in Balve (D) and Breda (NL). Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group. |
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A-Laser to Highlight UV Laser Depaneling at SMTA International 2011
 MILPITAS, CA - September 2011 - A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, will highlight UV laser depaneling of rigid and flex materials in Booth #206 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Laser cutting technology has taken the precision parts industry to new levels, enabling increased complexity in design, higher cut quality and the ability to maintain tighter tolerances. A-Laser is accustomed to providing tight tolerance laser cutting solutions for a wide range of industries, fulfilling both prototype and production needs. A-Laser can accommodate a wide range of materials on its UV laser systems, from polyimide to precious metal to thermal. Additionally, these materials are seen with adhesive combos or clad and bonded. The company’s laser cutting specialists have built a huge library of tools to accommodate the various material combinations, thicknesses, and cut demands of its customers. A-Laser provides high cutting edge precision and position accuracy (±0005"), fine contours and virtually radius-free internal edges (<20 µm beam), and contact-free material processing to prevent material distortion. Same day quotes and 24-hour turnaround also are available. For more information, stop by Booth #206 at the show or visit www.a-laser.com. |
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Juki to Demonstrate Industry-Leading SMT Assembly Systems at SMTAI 2011
 MORRISVILLE, NC - September 2011 - Juki Automation Systems, a world-leading provider of automated assembly products and systems and part of Juki Corporation, will exhibit its KE-1080 modular placement system and FlexSolder W510 in Booth #309 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Juki’s KE-1080 modular placement system has a five-nozzle head to handle larger parts and uses a tri-colored advanced vision system featuring blue, green and red LEDs for accurate placement of fine-pitch ICs, connectors and odd-shaped components. Additionally, the KE-1080 has an IPC9850 rated speed of 14,100 CPH for chips, and 3,400 CPH for IC components when using the advanced lighting system. The effective component placement range for the KE-1080 is 01005 (0402 metric) to 74mm2 or 50 x 150 mm.  For the best results in repeatability, accuracy and reliability, all Juki machines use the LNC60 optical centering laser that is built into the head to easily measure components while moving from the pick to the placement site. This eliminates the need to move to a stationary or line scan camera, creating an efficient method of component measurement centering. LNC60 is not affected by the color of a part and easily can transfer a part profile back to the database. Other important features of the LNC60 optical centering laser include the ability to detect the exact height of the nozzle tip, bent nozzle detection and a tombstone pick check. Additionally, the laser ensures that a component is present before placement and that the component has been placed successfully. The FlexSolder W510 is able to handle dual mini-waves for simultaneous or individual use. The advantage of individual use is having the ability to solder closer than 1mm to other SMD, but also being able to solder large connectors or other devices without the need for changing nozzle sizes. This is done automatically during production. No other machine in this market has this ability. This adds much needed flexibility to the process, allowing various soldering options with no changeover. The flexibility of the W510 also is evident in that it offers both 7° soldering to support laminar nozzles and 0° soldering to support wetted nozzles down to 1.8mm. A wide variety of other nozzles also are available for use with the W510, including nozzles up to 30mm and a special miniature wide wave that supports 60mm wide soldering. |
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ZESTRON's Highlight At NEPCON Shenzhen 2011
ZESTRON, the leading supplier of cleaning agents and services for the SMT and Semicon Backend industries, will exhibit ATRON® AC 207 during the upcoming NEPCON Shenzhen 2011 (booth #1C40). ATRON® AC 207 is a FAST® Technology-based surfactant defluxing agent, specifically designed to provide a superior level of material compatibility with sensitive metals. With a bath life that is 3 to 10 times longer than that of conventional surfactants, ATRON® AC 207 offers excellent cleaning results in high and medium pressure inline as well as batch cleaning systems at low concentrations and temperatures. It removes a wide variety of the latest lead-free and eutectic flux residues as well as unsoldered solder pastes. FAST® Technology- Fast Acting Surfactant Technology - is an innovative surfactant-based cleaning technology developed and introduced by ZESTRON in 2007. FAST® Technology-based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of a wide variety of the latest lead-free and leaded flux residues. For more information about ATRON® AC 207 or the FAST® Technology, please visit our booth (#1C40) at NEPCON Shenzhen or www.ZESTRON.com. |
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Indium Corporation Technology Experts Presenting at ICEPT-HDP2011
Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China. Dr. Lee will present A Novel High Melting Lead-Free Mixed Solder Paste System. This paper, which is co-authored by Research Metallurgist Hongwen Zhang, discusses the development of a novel high melting lead-free BiAgX mixed solder paste system, and compares the performance with several representative high lead solder alloys. Dr. Lee will also be presenting the technical poster Fragility Suppression Via BGA with SAC105Ti Ball, which is co-authored by Research Metallurgist Weiping Liu. This poster discusses the drop test performance of different solder combinations. Dr. Lee will also be teaching a professional development course, Achieving High Reliability of Lead-free Soldering and Flip Chip 3D/TSV Packaging & Materials Consideration and chairing the session Packaging Materials & Processes. Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. For more information about ICEPT-HDP 2011, visit www.icept.org. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation visit www.indium.com or email abrown@indium.com. |
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Breakthrough Indentation Yield Strength Test by Nanovea
Irvine, CA - Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.  Traditionally yield strength has been tested by using a tensile testing machine, a large instrument requiring enormous strength to pull apart metal, plastic and others. The yield strength (also known as yield point) of a material in engineering (and or materials science) is the point of stress that a material starts to deform plastically. Before reaching the yield point a material will deform elastically but returns to its original shape when stress is removed. A crucial material property for nano and micro related materials found in advancing industries such as biomedical, microelectronics, energy and many others. Until now the most reliable way took large machine effort, sample preperation, and or was impossible to perform on small samples and localized areas like that of the industries listed. By using Nanovea’s Mechanical Tester in indentation mode, using a cylindrical flat tip, yield strength data can be easily obtained. For years now, the indentation test has been used for hardness and elastic modulus measurements. There has traditionally been an issue with linking macro tensile properties to what was measured during an indentation test. Many studies measuring with spherical tips have allowed stress-strain curves but were never able to give reliable tensile yield strength data that corresponded directly to macro tensile data. Nanovea’s patent pending method, using a cylindrical flat tip, gives yield strength directly comparable to what is measured by traditional means. It is believed that the load per surface area at which the cylindrical flat tip penetrates, at increased speed, is directly linked to the load versus surface area at which the material starts flowing in a tensile mode test. Therefore, reliable yield strength results on an endless list of materials, small or large has never before been as obtainable until now. "This is just another addition, on a long and growing list, of what can be tested with our Mechanical Tester," said Pierre Leroux, Nanovea’s CEO. While this specific test is a breakthrough of great importance, it is ultimately just another reason why the Nanovea Mechanical Tester has the widest testing capability of any mechanical testing system. For application note visit: Breakthrough Indentation Yield Strength Testing http://www.nanovea.com/Application%20Notes/yieldstrengthtesting.pdf |
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VJ Electronix, Inc. to Demonstrate the SRT Micra Rework Platform at SMTA International 2011
 September 2011 - VJ Electronix, Inc., a leader in rework technologies and global provider of X-ray inspection systems, will exhibit the new SRT Micra Rework Platform in Booth #232 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The SRT Micra is a brand new benchtop platform that is specifically designed for the rework of mobile products incorporating small, high density electronic devices, such as Smartphones, Netbooks, GPS and other handheld products. The new SierraMate V9 software simplifies process definition and assures consistent, repeatable results between facilities and even continents. The systems' redesigned heaters and revolutionary power controls provide extremely high throughput and unmatched results, regardless of typical facility voltage variations. The Micra offers an unprecedented Auto-Run feature, a newly developed automated process set-up tool and a virtual process engineer. Auto-Run minimizes rework setup and profiling times. Highly efficient heaters on the Micra minimize rework cycle times and maximize production throughput. The systems' inherent accuracy and fixed position core (head) easily accommodates tiny electronic device packages, including 01005 micro-passives and 0.3 mm pitch area array devices. The Micra also delivers optimized scavenging and the automated removal of residual solder, including tightly spaced micro-passives, PoP layers, asymmetrical RF Shield patterns and micro-BGA sub-millimeter lands and pitches. Additionally, the Micra provides a complete mobile device rework solution. |
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STI Electronics to Showcase Its Distribution Line SMTA International 2011
 MADISON, AL - September 2011 - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will highlight its key products and services in Booth #307 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. STI will showcase its complete electronics/industrial distribution line. As a nationwide distributor of more than 120 product lines, STI Electronics can service industrial and electronics assembly needs nationwide. The company offers direct and after-sales support through its dedicated staff of sales engineers, customer service representatives, and highly trained mechanical and electrical engineers. STI is able to directly service customers located in the North American states of Alabama, Florida, Georgia, Mississippi, Tennessee, Texas, Arkansas and Oklahoma. STI's Engineering Services Department will feature its IC/DT services. STI's Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of electronics manufacturing. From product design and manufacturability analysis to pre-production prototype and development, STI's Prototype and Development Lab is a full service design review and pre-production facility. STI's Training Resources Department will feature its training services and materials. STI Electronics, Inc. offers a wide variety of electronics assembly and solder training courses, ranging from commercial to high-reliability requirements including NASA for through-hole, surface mount, and cable/harness assembly, as well as staking and conformal coating. STI is an IPC Approved Certification center for all currently available courses (IPC-A-600, IPC-J-STD-001, IPC-A-610, IPC-7711/7721, IPC/WHMA-620). Most courses can be customized to meet a specific need or requirement and can be conducted at STI's facility in Madison, AL or at a customers' site. In addition to the standardized training program support materials, STI Electronics provides unique or custom training materials ranging from chip scale and BGA to through-hole and terminal attachments. STI also provides cable and harness kits to support cable fabrication programs. Process development kits for machine applications provide an opportunity to evaluate operation capabilities for issues such as fine-pitch production and lead-free materials. STI is a total solutions partner when it comes to training resources. The company offers both training services and materials to better serve its customers. STI's technical and instructional staff is unsurpassed in knowledge and experience in the world of electronics assembly/solder training and specification requirements. For more information about STI Electronics Inc.'s products and services, stop by Booth #307 at the SMTA International Conference & Exhibition or visit www.stielectronicsinc.com. |
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Count On Tools to Introduce New SMT Nozzles and Consumables at SMTA International 2011
 GAINESVILLE, GA - September 2011 - Count On Tools Inc., a leading provider of precision components and SMT spare parts, will introduce its latest developments in SMT nozzles and consumables in Booth #323 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Company representatives will be on hand to explain how Count On Tools products and services can help optimize SMT equipment for faster production and lower build costs. Count On Tools supplies a full range of SMT tooling, odd-form component tooling and design services, and other SMT consumables for the electronics manufacturing industry. The company's product range can be found in leading EMS companies worldwide. New product lines to be showcased at the event include: LED Nozzle Series, StripFeeder Trays, Micro Placement Nozzles, RPS Selective Soldering Nozzles and Risers, Manncorp Selective Solder Nozzles, Ace Custom Wave Solder Nozzles, an expanded selection of Mydata Spare Parts (feeder springs, filters and board lock arms), Pace Pre-Filters, Quad Peel Feeder Rollers, Universal Ceramic nozzles and a broad assortment of custom nozzle designs for odd-form components. For more information about Count On Tools' SMT nozzles or consumables, stop by Booth #323 at the show or visit www.cotinc.com. |
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See BPM Microsystems' 2800 Universal Device Programmer at SMTA International 2011
 HOUSTON - September 2011 - BPM Microsystems will highlight its Model 2800, the newest addition to its manual universal device programmer family, in Booth #117 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The 2800 combines the unrivaled speed of Vector Engine Co-Processor® technology plus true universal device support, resulting in the fastest universal programmer in the industry. The ultra-fast programming speed of the 2800 is attributed to BPM Microsystems' Vector Engine Co-Processor, the same proven technology that established Flashstream® as the fastest flash-dedicated programmer. This technology uses a co-processor design to hardware-accelerate waveforms during the programming cycle. Faster speeds are achieved through synchronous operations that eliminate the dead times so that the device under test no longer waits for the programmer. The result is programming near the theoretical limits of the silicon design - the faster the device, the faster the device is programmed. The 2800 supports all device technologies including high density NAND Flash, NOR Flash, Serial Flash, Managed NAND Flash, EPROM, EEPROM, Flash EPROM, Microcontrollers and more with densities up to an 8Eb theoretical limit. The new model 2800 also uses BPM Microsystems' cost-effective and efficient socket cards with receptacle-base socket option. Individual socket cards can be fully utilized and replaced without dramatically affecting programming capacity. With the receptacle-base socket option, customers can purchase only the consumable socket as needed. The design of BPM Microsystems' socket cards increases manufacturing up-time, produces higher first-pass yield, and saves replacement costs by as much as 75 percent. |
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Viscom to Highlight Desktop AOI S2088-II at SMTA International 2011
 Duluth, GA, September 2011 - Viscom is pleased to introduce the S2088-II desktop AOI inspection system to the US market. This new system is designed for automatic optical inspection of paste print, pre- and post-reflow and THT solder joints. The S2088-II now includes high-performance 8M camera technology with the same angled inspection and OnDemandHR function as Viscom’s established inline systems. Faster loading/unloading and large PCB fixturing are two key advantages of the new system. The system will be on display in booth #326 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Like all Viscom AOI systems, the desktop S2088-II features high-performance camera modules, intelligent software and an advanced PCB clamping design. Not to be overlooked: the comprehensive IPC-compliant inspection library has been refined and improved over the last 25 years. This compact system covers all inspection stages from paste print, pre- and post-reflow to THT solder joint inspection. Integration of 8M camera technology, supporting both orthogonal and angled inspection, ensures 100 percent compatibility with current Viscom inline systems. AOI inspection programs can be quickly and easily transferred to other systems, including the S3088, S6056 and X7056. The S2088-II can also inspect larger printed circuit boards up to 20" x 18". Boards are changed within a few seconds due to a directly accessible PCB tray. A mobile work table, designed especially for this system, is available as an option. This desktop system is the ideal solution for customers with the need of an entry-level offline AOI system that offers program portability to existing or future inline systems. For example, a program developed on the desktop S2088-II for low-volume NPI (New Product Introduction) boards also can be used in high-volume inline AOI machines overseas. Viscom’s S2088-II system combines the peak performance capabilities of Viscom high-end systems with the advantages of a manually operated desktop system. Especially significant is the system’s angled camera technology with integrated standard and high resolutions to positively detect critical production errors such as lifted leads. For more information about Viscom’s S2088-II, visit booth #326 at the upcoming SMTA International exhibition in Fort Worth, TX. |
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Virtual Industries to Demonstrate Vacuum Handling Solutions at SMTAI 2011
 COLORADO SPRINGS, CO - September 2011 - Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display several advanced systems in Booth #214 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The Small Part Handling Kit (TV1000-SP8-BD-MAG1), the company's show special, is for parts as small as 01005. This general-purpose vacuum handling tool plugs directly into 110 V 50/60 Hz. The compact unit will handle a variety of optics, ball lenses and SMT parts used in the industry today. The kit includes a set of rubber tipped vacuum tips as well as a set of eight small parts tips. As a special at the show, all Small Part Handling Kit purchases will come with a free 2.5X lighted magnifier that runs on three AAA batteries (included). With the Small Part Handling Kit, parts as small as 0.05" (0.10 mm) are handled without damage. A vacuum tweezer eliminates lost parts associated with mechanical tweezer handling. The long-life diaphragm vacuum pump generates up to 10" of mercury with an open air flow of 2.3 lpm. The unit connects to ground automatically with a three-wire power cord. The 110 Volt SMD-VAC-HP™ System (V8100A-SP8-BD-MAG1) runs on 12 VDC @ 500mA w/ solenoid. With a precision pump and motor that generates over 15" of mercury, this tool provides additional pick-up power for handling small to very large size components. The compact tower design takes up a small footprint on the bench. An electric eye pen holder on the side automatically shuts the unit off when the vacuum pen is placed in it. Additionally, a jack on the rear of the V8100A series allows the use of a foot switch to control vacuum during pick-and-place operations. For more information about any of Virtual Industries' advanced equipment, stop by Booth #214 at the show or visit www.virtual-ii.com. |
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Speedprint to Debut the SP700avi Screen Printer at SMTA International 2011
 Tampa, FL - September 2011 - Speedprint, part of the Blakell Europlacer Group, will debut the Speedprint SP700avi Screen Printer in FHP Reps' Booth #441 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The SP700avi combines Speedprint's commitment to high performance and reliability. The system was designed to cope with the rigors of high-volume SMT production while incorporating the flexibility needed in high-mix, quick product setup and changeover environments. The screen printer was designed to deliver unequaled value with 6 Sigma alignment capabilities. The SP700avi utilizes 1 µm resolution linear encoders on all axes combined with a suite of intuitive software that enables total control of the printing process. A rigid one-piece frame is the foundation for the simple, solid state design that will provide many years of reliable service. The SP700avi features unique Look Down/Look Down vision that facilitates optimized board-to-stencil alignment, yielding 20 µm performance at 2 Cpk. Additionally, the system is fully equipped, as standard, with many features such as auto stencil load/unload, fully programmable vacuum assisted stencil cleaner, and optical inspection of the paste bead. Two-dimensional post-print bridge detection and various tooling solutions also are available as options. For more information about the Speedprint SP700avi Screen Printer, stop by Booth #441 at SMTA International or visit www.speedprint-tech.com. |
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See Seika Machinery, Inc's New Advanced Machinery at SMTA International 2011
 TORRANCE, CA - August 2011 - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Seika will feature the new Sawa Eco-Roll large roll model that cleans wiper rolls up to 24". The Sawa Eco-Roll eliminates waste and saves money by reusing wiper rolls for printing machines. In addition to providing a reduction in waste, use of the wiper roll cleaner results in reduced CO2 emissions in just 20 minutes. Wiper rolls are widely used for under stencil cleaning to wipe off solder paste in the SMT printing process. Most of them are used only once, then are disposed of with other solder waste. Recycling wiper rolls not only reduces emissions but also reduces lumber usage. In addition, tests have shown that repeated cleaning of wiper rolls does not compromise the performance when cleaning stencil apertures. Seika also will debut the Seitec STS-2533SJ Soldering System, specially-designed for off-line and modular selective soldering. The programmable system features a special nozzle design and a spray fluxer unit, enabling flawless soldering of leads and pads. Additional features include a conveyor with roller, a specially-designed solder pot and a drawer-type solder pot. The Bravo ST-2533 from Seitec is the ideal soldering solution for mass production. The STS-2533SJ features a CCD camera option that measures and compensates the solder flow height automatically by controlling the motor speed. The camera provide reliable soldering with stable solder temperature control (±1° @ 28°), a heated N2 supply, top and bottom pre-heating and drop jet fluxing. Additionally, with the CCD camera, there are no bridges and fewer voids, as well as improved tact time. For more information, stop by Booth #136 at the show or visit www.seikausa.com. |
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SEHO Systems to Showcase Its SelectiveLine at SMTA International 2011
 ERLANGER, KY - September 2011 - SEHO North America, Inc. will showcase its SelectiveLine soldering module in Booth #237 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. With the SelectiveLine, SEHO has implemented a modular system concept for mini-wave soldering that may be adapted to changing production conditions any time. With low production quantities, for example, only the SelectiveLine solder module is required. With increasing throughput requirements or very massive products, the unit can be individually expanded by adding coordinate fluxer modules, preheater modules or even another SelectiveLine solder module. Consequently, cycle times are significantly reduced. Conversely, the production line can be reduced in size again with end-of-line products and falling numbers by taking modules out of the line and using them for other products. Featuring a high-precision mini-wave process, the SelectiveLine is ideally suited for a high product mix, offering maximum flexibility. The system features a precise axis system for exact positioning of various workstations and is capable of handling either bare boards or assemblies in carriers up to 500 x 500 mm. The automatic circuit board position correction via fiducial recognition ensures maximum precision and process reliability. Various types of misalignment, such as offset, position error and linear distortion of the circuit board, are compensated. Incorrectly positioned assemblies are detected and not soldered. The soldering unit can be changed quickly if different alloys need to be processed. To minimize change-over times, a second soldering unit can be preheated on an external heating station prior to installation in the machine. Thus, changing to a different solder alloy only takes a few minutes. The SelectiveLine is equipped with a modern control unit, which is very simple to operate using a color touch screen. With the cutting-edge offline teaching program, soldering programs can be taken over by the machine using a USB memory stick or network connection without any further conversion - or vice versa. The route optimization is particularly innovative. After being taught all the solder points, the program independently calculates the quickest path - to keep pure handling times to a minimum. Additional automatic control functions include automatic solder wave height control, real quantity control for drop jet fluxers, a scanning unit to allocate the installed solder wire reel to the corresponding soldering program, and a barcode reading system. As always, all soldering systems from SEHO are fully lead-free capable. For more information about SEHO’s SelectiveLine, stop by Booth #237 at the show or visit www.sehona.com. |
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Nordson DAGE to Highlight Ultimate High Magnification X-ray Inspection System at SMTAI
 Aylesbury, Buckinghamshire, UK - September 2011 - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will highlight its XD7600NT Diamond X-ray inspection system in Booth #301 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, Texas.
The Nordson DAGE XD7600NT Diamond X-ray inspection system utilizes the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today. Equipped with the unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 100 nanometer (0.1 µm) feature recognition and up to 10 watts of power, together with the 3 mega pixel long lifetime CMOS flat panel detector, the XD7600NT Diamond is the crystal clear choice for the greatest performance and highest magnification of real-time imaging. At the show, Nordson DAGE also will demonstrate its µCT 3D modeling and volumetric measurement ideally suited for analytical investigation of critical applications such as stacked die, MEMS, PiP and PoP devices. About Nordson DAGE Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com. |
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MIRTEC To Premier Its Technologically Advanced Automated Optical Inspection Systems At SMTAI 2011
 OXFORD, CT - September 2011 - MIRTEC, "The Global Leader in Inspection Technology," announced that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, Texas. At the show, MIRTEC will feature its award-winning MV-7xi In-Line AOI System configured with its exclusive 10 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 10 Mega Pixel Top Down camera and a Precision 13.4 Micron Telecentric Compound Lens. The MV-7xi also will be configured with Four (4) Ten Mega Pixel Side-View Cameras, a 2D camera bar code reader, a high throughput, three-stage PCB conveyor and a PCB under board support system. MIRTEC's patented "Quad Angle Lighting System" provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi also will feature MIRTEC's industry acclaimed Intelli-Scan Laser System that provides: superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The MV-7xi is powerful yet simple to use. A comprehensive Package Type Library provides simple "Drag and Drop" component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data. MIRTEC also will display its award-winning MV-3L Desktop AOI System. The MIRTEC MV-3L is heralded as the industry's most widely accepted Five Camera Desktop AOI system. This machine will be configured with the same 10M ISIS Vision System as that of the MV-7xi, providing true program compatibility across both platforms. The MV-3L also will be configured with Four (4) Ten Mega Pixel Side-View Cameras as well as MIRTEC's exclusive Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost effective desktop AOI system. "MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment," stated Brian D'Amico, president of MIRTEC's North American Sales and Service Division. "We are confident that this ground-breaking technology will undoubtedly set a new standard by which all other inspection equipment will be measured. We look forward to welcoming visitors to our booth #124 during the two-day event." |
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MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011
 MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. MARTIN's Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow. The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone. The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters. Also at the show, MARTIN will demonstrate the Expert 10.6, a cost-effective rework system with an intuitive interface, process repeatability and semi-automated operation. A leading-edge camera driven alignment system provides a flawless solution for the automatic placement process. The hybrid platform combines both infrared and convection heating technologies to achieve outstanding board temperature uniformity, thus minimizing temperature-based PCB distortion. For further information, visit MARTIN in Booth #407 at the show or online at www.bgarework.com. |
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Learn About Kyzen's New AQUANOX® A4638 Advanced Packaging Cleaning Chemistry at SMTAI 2011
 NASHVILLE - September 2011 - Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will feature its new AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in Booth #500/501 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. AQUANOX® A4638 was developed to rapidly dissolve water-soluble polar flux residues and exhibits a low surface tension. A4638 is combined with Kyzen's revolutionary inhibition technology to provide superior material compatibility. An engineered electronics assembly and advanced packaging cleaning agent, AQUANOX® A4638 is designed to remove flux residue from flip chip and low clearance components. A4638 is a nonhazardous, biodegradable aqueous solution that contains no CFCs or HAPs. AQUANOX® A4638 is available in one, five and 55 gallon containers. Kyzen® and AQUANOX® are registered trademarks in the United States and other countries. |
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Krayden to Showcase Cutting-Edge Technologies at SMTA International 2011
DENVER - September 2011 - Krayden, Inc., a leading distributor of engineered materials, will showcase its suppliers' technologies in Booth #514 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Krayden is a "NASA top 100 Supplier," "Dow Corning Electronics Distributor of the Year 2008, 2009 & 2010," Certified AS 9120, ISO 9001:2008, and now offers Dow Corning Solar Solutions. The company is a technical problem solving distributor, specializing in adhesives, sealants, coatings, solvents, various types of chemicals, solder and lead-free solder. Krayden serves the electronics, aerospace, transportation and energy industries (solar, oil and gas) as well as OEM manufacturers. With numerous locations, the company provides distribution throughout North America including Canada and Mexico. Krayden provides technical expertise, working with its customers from purchase and engineering through production. The company also offers application assistance through custom packaging and formulating, dispensing/processing equipment and technologies, in addition to fabricating capabilities. Some of Krayden's product lines include Dow Corning, Humiseal, Henkel, Huntsman, Cytec, Chomerics, Loctite, Permabond, Lord, Nihon Superior, FCT Assembly, 3M, Dow Automotive and more. For more information about any of Krayden's suppliers' technologies, meet with company representatives at the show or visit www.krayden.com. |
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See Inovaxe's Newest Handling and Inventory Control Systems at SMTA International 2011
 DEERFIELD BEACH, FL - August 2011 - Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will exhibit its latest storage and handling systems in Booth #515 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The NPI Award-winning InoCart MSD unit and the InoCart one-bay Material Handling System will be on display at the show with various reels. The system features new Web-based software with additional features and controls to promote unparalleled inventory accuracy within the conventional stockroom, the lean manufacturing/floor stocked discipline and WIP environments. Inovaxe will debut its new portable InoKit unit, an ultra lean solution for the acquisition and handling of "C Parts." Inovaxe proposes that through its portable InoKit carrier and associated software, it can reduce the high cost of acquisition and handling of "C parts" while eliminating shortages on the production floor. The portable InoKit carrier can be delivered directly to SMT machines with easy identification for placement into production. Inovaxe proposes that users assign the penny parts to its program as part of a sub-assembly or group of part numbers. At the customer's request, Inovaxe will ship the parts (sub-kit) packaged in its proprietary InoKit carriers within 48 hours. Inovaxe also will highlight its InoSource ? International Advantage service to address the challenges facing customers with existing international sources of supply or those just getting started. By leveraging Inovaxe's experience and the strength of its supply chain, customers realize international sourcing with U.S. ease. The company's national sales staff manages supply chains in concert with a professional, locally based operations and engineering staff. Inovaxe's offices in China and India provide a new level of local support to provide the custom parts support you need. International Advantage enhances profitability through improved sources of supply both domestically and internationally. Inovaxe is your single source, bringing together more than 40 trusted partners to provide customers with highly reliable sources for tooling and custom production part needs. For more information about any of Inovaxe's innovative material handling systems and services, meet company representatives in Booth #515 at SMTAI or visit www.inovaxe.com. |
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GPD Global to Debut PCD 'H' Series at SMTA International 2011
 GRAND JUNCTION, CO - August 2011 - GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production will debut its Positive Cavity Displacement (PCD) 'H' Series high resolution pumps in Booth #133 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. GPD's PCD Dispensing provides next-generation volumetric dispensing and is compatible with materials used in electronics assembly such as epoxies, thermal greases, underfills, oils, silicones and UV encapsulants, as well as materials outside of the electronics industry. PCD Technology is designed for GPD Global platforms and may be used with other robots or tabletop operations with an easy-to-use tabletop controller. Viscous fluids are delivered to the substrate via luer nozzles and performance excels when using GPD Global 'S' Taper tips. The metering technique is not affected by variations in temperature or reservoir pressure, thereby improving day-to-day and start-to-finish process results. GPD's enhanced flow rate luer dispense tips offer higher flow rates than standard luer nozzles with a much lower pressure build-up. GPD also will demonstrate the PCD and MicroDot technologies on its MAX Series platform. MAX Series dispensing systems offer high accuracy, precision dispensing over a wide range of applications. The MAX Series platforms are ideal for die attach, underfill, MEMS, micro-volume conductive adhesive and paste applications. For more information about GPD Global's PCD Dispensing, stop by Booth #133 at the show or visit www.gpd-global.com. |
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FCT Assembly to Showcase Proven Solder Paste and Stencil Technologies at SMTA International 2011
MILPITAS, CA - FCT Assembly is pleased to announce that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. NL930PT is a no-clean, lead-free, halogen-free pin probable solder paste. The paste is unique in that it is a clear residue, pin probable paste that can print down to low surface area ratios consistently. NC676 features best-in-class solder spread and wetting, print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean, halogen-free paste leaves a colorless residue that is penetrable, maximizing pin testability. WS889 is FCT's newest lead-free water soluble solder paste. The paste provides excellent wetting on all surface finishes with consistent printing down to low surface area ratios and can be run in R/H of 30-65 percent without slump. WS159 water-soluble solder paste offers best-in-class solder spread and wetting. It also features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS159 is fully cleanable, with the widest cleaning process window in its class. SN100C Bar Solder is used in thousands of wave soldering machines around the world and has proven its reliability in products exposed to the most severe service environments. Features to be highlighted at the show include: - Low drossing
- Low copper erosion
- Shiny finish
- Easiest maintenance of all lead-free alloys
- Joint reliability at least equal to that of Sn63/Pb37
- Over 1.5 billion products assembled using SN100C with no known defects
Fine Line Stencil will showcase its new UltraSlic™ Stencil with Nano-Coating. UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the UltraSlic™ stencil foil minimizes solder paste's ability to stick to the stencil apertures and the bottom side of the foil. Up to a 10X increase in the number of prints before cleaning the stencil is possible as well as successful printing at surface area ratios below 0.45. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today. Representatives from FCT Assembly and Fine Line Stencil will be on hand at the show to discuss the company's innovative Root Cause Analysis Service. Most OEMs and CMs are periodically confronted with challenging assemblies that have low yields and have to be fixed at rework. Unfortunately, rework costs time and money, and decreases the reliability of the product. These assembly challenges will only increase as component sizes continue to decrease. OEMs and CMs can surely determine the root cause(s) of the low yields, but most don't have the capacity, nor the time, to take on this difficult task. FCT Assembly developed its Root Cause Analysis Service to specifically address the need to quickly determine the root cause(s) of low yields anywhere in the assembly process and then provide a sound solution to its customers for yield improvement. This proven process can dramatically improve process yields with any assembly, regardless of complexity. For more information about FCT Assembly's new paste or stencil technologies, stop by Booth #206 at SMTA International or visit www.fctassembly.com. |
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FCT Recovery to Exhibit at SMTA International 2011
GREELEY, CO - FCT Recovery, a division of FCT Assembly and a provider of high-quality recovery services, announces that company representatives will be available in Booth #206 to discuss its advanced services at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. FCT Recovery is committed to providing a high-quality, reliable and transparent service to its customers and offers recovery services for lead-free, tin/lead dross and scrap including solder paste and wipes in quantities as small as 25 lb. Customers are updated at every step in the process, and FCT Recovery writes customer checks within 15 days of receipt of material. Customers also receive a certificate of recycling for their material. Additionally, FCT Recovery will pick up scrap, bare and populated circuit boards. For more information, meet company representatives in Booth #206 at the show or visit www.fctrecovery.com. |
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ESSEMTEC to Highlight Flexible Swiss Made Solutions at SMTAI 2011
 Glassboro, NJ - Essemtec, a leading manufacturer of surface mount technology (SMT) production equipment, announces that it will showcase flexible Swiss-made solutions in Booth #127 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The Paraquda 4C pick-and-place system combines a large feeder capacity, fast programming and changeover while the machine is running, with the ability to quickly place any component from 01005 up to 40x40 mm including fine-pitch, BGA, CSP or flip chips. The Paraquda series automatic pick-and-place machines are designed to fulfill the requirements of a high-mix SMT production. All SMD components are placed quickly, and are reproducible and reliable using modern placement technologies. The system features a three-stage conveyor with manual rail adjustment, and a tool changer with 1x36 positions and 14 nozzles. The high-resolution fly-by vision system is equipped with the latest Cognex SMD image processing technology, thus can detect any kind of component - even odd-shaped parts. The Paraquda is the first machine generation worldwide that is operated by ePlace – the new standard in pick-and-place software. ePlace, the new software designed entirely by Essemtec, is based on the company's eez-technology. It has been fully developed in .net, uses an integrated database and offers a modern, interactive, intelligent and intuitive tool for controlling all parameters. Essemtec's Tucano automatic stencil printer was designed based on experiences from solar wafer printing and metallization. The printer uniquely combines accuracy and quality with high-speed and reliability. Tucano features a unique double camera vision system with no moving parts or mirrors. Tucano features a unique design with only one XY-drive for vision, PCB stopper, stencil cleaning system, stencil load and unload, and 2D inspection. The special design increases the reliability of the printer and simplifies maintenance. Additionally, Tucano requires less space than other printers with a 600 x 580 mm printing area on a footprint of only 1.3 m2. It uses less motors than other systems for its operation, and therefore, uses less drive control electronics and energy. For more information about Essemtec's flexible production equipment, visit the company in Booth #127 at the show or on the Web at www.essemtec.com. |
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Christopher Associates Announces Product Line up for SMTA International 2011
 SANTA ANA, CA - September 2011 - Christopher Associates Inc. announces that it will exhibit in Booth #132 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. In addition to contributing to the technical sessions, Christopher Associates will exhibit the latest equipment and materials from its world-class suppliers, including: The MAGNUS HD high-definition inspection system will be on display at the show. The MAGNUS HD offers the highest image quality in the industry with superb ergonomics. Measurement capability, magnifications up to 104X and true 1080P performance give the MAGNUS HD a versatility and range of applications found in no other system. Also at the show, Christopher will introduce the new Koki S01X7C48-M500 low silver alloy solder paste. With spiraling metals costs, Koki's new, patented formulation offers perfect melting and wetting (<0.3 mm dia CSP 0603 chip) at super fine-pitch, low halide content (CL+BR<1500 ppm), and excellent printability and process parameters, while reducing material costs substantially. Representatives from Christopher Associates also will highlight the award-winning Akila XR-3 X-Ray inspection system from WKK offers unparalleled performance in the inspection of high-density electronics assemblies including micro BGA and CSP packages. Developed by the world's leading 3D moire' inspection technology company – the Intek Plus SPI-4000 SPI systems offer unparalleled accuracy and performance and also will be highlighted during SMTA International. With a programming time of less than 15 minutes, real-time SPC, excellent GR&R and North America's best support network, the SPI-4000 offers unbeatable performance. This year, Marantz introduced the iSpector U22XHMA Multi Camera AOI System, a nine-camera system developed for superior detection of lifted components and leads. Also new from Marantz, the iSpector U22X Large Format AOI System was developed for large panels up to 21.6 x 31.5" and incorporates Marantz's industry-leading full-color inspection capability for both SMT and through-hole components. Additionally, representatives will premier the Semblant Plasma Finish (SPF), a revolutionary new patented solution for PCB surface finishing as well as many other significant protective applications. Finally, representatives will highlight VacuNest Universal Shape Memory Tooling from Nocatec S.A. The system supports thin substrates very well, and end of line yields typically improve significantly when the technology is installed. VacuNest can be fitted to any printer, dispenser or placement machine. For more information about any of Christopher Associates' new equipment or materials, stop by Booth #132 at the show or visit www.christopherweb.com. |
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See Aqueous Technologies’ Environmentally Friendly Trident XLD at SMTAI 2011
RANCHO CUCAMONGA, CA - September 2011 - Aqueous Technologies Corp., North America's largest provider of batch defluxing systems, will highlight the Trident XLD in Booth #505 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The Trident XLD is the industry's most environmentally responsible fully automated defluxing and cleanliness testing system. Unlike other closed-loop defluxing systems, the XLD is capable of removing all flux types including no-clean, rosin and water soluble. The Trident XLD also is capable of operating with a variety of environmentally safe defluxing chemistries frequently required for specific types of flux removal. The Trident XLD provides automatic cleaning, cleanliness testing, drying, chemical dosing, complete assembly specific SPC via bar-code scanning, and operates without sending any water to the drain. The Trident XLD's average total cycle time is less than 30 minutes, making it the fastest fully automatic defluxing system available. The system can clean one month's worth of production while consuming less than 10 gallons (38 liters) of water, all of which is lost to normal evaporation. For more information about Aqueous Technologies' Trident XLD, stop by Booth #505 at the show or visit www.aqueoustech.com. About Aqueous Technologies Corp. Founded in 1992 and headquartered in Rancho Cucamonga, CA, Aqueous Technologies Corporation is North America's leading manufacturer of aqueous cleaning systems. Aqueous Technologies manufactures batch-format aqueous cleaning/defluxing systems. Aqueous Technologies also manufactures ultrasonic stencil cleaning systems, PCB and stencil cleaning chemistries and the Zero-Ion ionic contamination (cleanliness) tester. Aqueous Technologies' products have won more than 40 industry awards. Visit the company on the Web at www.aqueoustech.com. |
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ACD to Highlight Off-Shore Manufacturing Services at SMTA International 2011
 RICHARDSON, TX - September 2011 - ACD (Automated Circuit Design), a leading supplier to the electronics industry, will highlight its off-shore manufacturing services in Booth #529 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Since 1984, ACD has worked hard to meet or exceed customers’ requests and requirements. ACD recognizes that its customers outsource their manufacturing needs for several reasons. Among those reasons are to reduce cost, to maintain focus on core activities and to leverage similar business processes between unrelated industries. In addition to its quick-turn prototypes and domestic production, ACD now offers a low-cost international manufacturing option. Customers have requested this service and ACD has responded. For customers who have products that are price-sensitive, or that require introduction into the marketplace at a lower cost, ACD is responding with an approach that maintains the ACD quality at a lower cost point. After careful preparation, ACD neutralizes the difficulties and fears that typically arise when companies attempts to establish overseas manufacturing capacity. Tim Tsui, ACD’s highly experienced International Production Manager, actively maintains and reviews ACD’s capabilities in the international marketplace. ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and through-hole build, rework, X-ray, flying probe and functional test, and development. For more information about ACD’s design and contract assembly services, stop by Booth #529 at the show or visit www.ACDUSA.com. About ACD (Automated Circuit Design) Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and through-hole mixed technology assembly, box build, rework, X-ray, flying probe and functional test, and development. For more information, visit www.ACDUSA.com. |
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