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Nihon Superior

Seika Machinery, Inc.
 


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    SMTA JOURNAL ARTICLES: 1999 - Present
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    YEAR   VOLUME   TITLE AUTHOR VIEW DOWNLOAD
    2009 22-4 Evaluation of Lead-fre Solders, Halogen-free Laminates, and Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications Gregory Morose, et al. Abstract Purchase 
    22-4 ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, et al. Abstract Purchase 
    22-4 ACHIEVING HIGH RELIABILITY LOW COST LEAD-FREE SAC SOLDER JOINTS VIA MN OR CE DOPING Dr. Weiping Liu, et al. Abstract Purchase 
    22-3 REFLOW PROFILE EVALUATION FOR LEAD-FREE STACKED CSP COMPONENTS SUBJECTED TO MULTIPLE REFLOW CYCLES Satyanarayan Iyer and Krishnaswami Srihari Abstract Purchase 
    22-3 IMPACT OF TRACE AND VIA JOULE HEATING ON MULTILAYER STRUCTURES Mudasir Ahmad and David Popovich Abstract Purchase 
    22-3 DETECTING COUNTERFEIT and REWORKED ELECTRONIC COMPONENTS IN THE OPEN MARKETPLACE Art Ogg Abstract Purchase 
    22-2 Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies Lei Nie, Michael Osterman, and Michael Pecht Abstract Purchase 
    22-2 LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, Marie Cole, Jim Wilcox, David Braun Abstract Purchase 
    22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract Purchase 
    22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R. Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Abstract Purchase 
    22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Ki Abstract Purchase 
    22-1 COMPREHENSIVE METHODOLOGY TO CHARACTERIZE AND MITIGATE BGA PAD CRATERING IN PRINTED CIRCUIT BOARDS Mudasir Ahmad, Jennifer Burlingame, and Cherif Gui Abstract Purchase 
    2008 21-4 A Comprehensive Analysis of the Thermal Fatigue Reliability of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes Richard Coyle, Peter Read, Steven Kummerl, Debra F Abstract Purchase 
    21-4 iNEMI Pb-FREE ALLOY ALTERNATIVES PROJECT REPORT: STATE OF THE INDUSTRY Gregory Henshall, Ph.D., Robert Healy, Ranjit S. P Abstract Purchase 
    21-4 STENCIL PRINTING EVALUATION OF A 01005 COMPONENT BASED ON A STATISTICAL APPROACH Sung Chul Joo, Daniel F. Baldwin, Ph.D., and Weon Abstract Purchase 
    21-3 THERMO-MECHANICAL RELIABILITY MANAGEMENT MODELS FOR AREA-ARRAY PACKAGES ON Cu-CORE AND NO-CORE ASSEMBLIES Pradeep Lall, Milan Shah, Luke Drake, Timothy Moor Abstract Purchase 
    21-3 EFFECT OF TEMPERATURE CYCLING PARAMETERS ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGE John Manock, Richard Coyle, Brian Vaccaro, Heather Abstract Purchase 
    21-3 ALTERNATE SOLDER BALLS FOR IMPROVING DROP/SHOCK RELIABILITY Ahmer Syed, TaeSeong Kim, and Se Woong Cha Abstract Purchase 
    21-2 ROHS CONVERSION FOR MEDICAL DEVICES: RISKS, CONSIDERATIONS AND COMPANY IMPACT PLUS SEVERAL BOM ANALYSIS CASE STUDIES Kim Sharpe Abstract Purchase 
    21-2 MINIATURE IC PACKAGE INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS Vern Solberg Abstract Purchase 
    21-2 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly Abstract Purchase 
    21-1 A COMPLIANT AND CREEP RESISTANT SAC-Al(Ni) ALLOY Dr. Benlih Huang, Dr. Hong-Sik Wang, and Dr. Ning- Abstract Purchase 
    21-1 QUALIFICATION OF A LEAD-FREE CARD ASSEMBLY & TEST PROCESS FOR A SERVER COMPLEXITY PCBA Matthew Kelly, et al. Abstract Purchase 
    21-1 CREEP CORROSION ON LEAD-FREE PRINTED CIRCUIT BOARDS IN HIGH SULFUR ENVIRONMENTS Randy Schueller, Ph.D. Abstract Purchase 
    2007 20-4 CHARACTERIZATION OF Sn-Ag-Cu SOLDER UNDER TENSILE AND SHEAR LOADING Mohammad M Hossain1, Tommi Reinikainen2, Puligandl Abstract Purchase 
    20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Abstract Purchase 
    20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G. Subbarayan and R. Kinyanjui, J. Deutsch and M. Abstract Purchase 
    20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Abstract Purchase 
    20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD-FREE WAVE SOLDERING Chrys Shea, Sanju Arora, Steve Brown, and Steven W Abstract Purchase 
    20-3 FAILURE MECHANISM OF SAC 305 AND SAC 405 IN HARSH ENVIRONMENTS AND INFLUENCE OF BOARD DEFECTS INCLUDING BLACK PAD Polina Snugovsky, Zohreh Bagheri, Heather McCormic Abstract Purchase 
    20-2 Lead Free Wave Soldering: Process Optimization for Simple to Highly Complex Boards Denis Barbini, Paul Wang, Peter Biocca, Quyen Chu, Abstract Purchase 
    20-2 MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER Heather McCormick, Polina Snugovsky, Zohreh Bagher Abstract Purchase 
    20-2 65nm FCBGA RELIABILITY FOR NEXT GENERATION GAMING DEVICE1* PHASE I-A METHODOLOGY FOR STREAMLINE PRODUCT DESIGN CYCLE AND 2ND SYSTEM LEVEL QUALIFICATION Paul P.E. Wang, Ph.D.1, DongJi Xie, Ph.D4., Michae Abstract Purchase 
    20-1 MECHANICAL TESTING OF SOLDER JOINT ARRAYS VERSUS BULK SOLDER SPECIMENS Robert Darveaux Abstract Purchase 
    20-1 UTILIZATION OF DIE ATTACH ADHESIVES IN WAFER LEVEL ASSEMBLY OF CAVITY PACKAGES FOR IMAGE SENSORS G Humpston and M Nystrom, S Kanagavel, M Previti a Abstract Purchase 
    20-1 JCAA/JG-PP LEAD-FREE SOLDER TESTING FOR HIGH RELIABILITY APPLICATIONS: -55ºC to +125ºC THERMAL CYCLE TESTING David Hillman and Ross Wilcoxon Abstract Purchase 
    2006 19-4 VOIDS IN SOLDER JOINTS Raiyo F. Aspandiar Abstract Purchase 
    19-4 RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS Marie Cole, Matthew Kelly, Mario Interrante, Grego Abstract Purchase 
    19-4 AGING EFFECTS ON DYNAMIC BEND TEST PERFORMANCE OF PB-FREE SOLDER JOINTS ON NI/AU FINISH Min Ding and Adriana Porras Abstract Purchase 
    19-3 SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS FOR HIGH VOLTAGE MEDICAL APPLICATIONS J. Bultitude, P. Gormally, J. Rogers, and J. Jiang Abstract Purchase 
    19-3 RELIABILITY ASSESSMENT OF MIXED TECHNOLOGY DRIVEN BY AVAILABILITY OF LEAD FREE COMPONENTS Lucian Kasprzak, Milind Sawant, Gerry Adams, Brian Lewis, Paul N. Houston, Daniel Baldwin, and Mike Nahorniak Abstract Purchase 
    19-3 COMPARISON OF NEAR-EUTECTIC SnPb AND SnAg SOLDER PLATING FOR WLP APPLICATIONS Bioh Kim, Charles Sharbono, Tom Ritzdorf, and Dan Abstract Purchase 
    19-3 EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K Abstract Purchase 
    19-2 INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher, A. Neumann, A. Ostmann and H. Reichl Abstract Purchase 
    19-2 MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILL-FLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer, Nagendra Nagarur and Purushotha Abstract Purchase 
    19-2 A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson Abstract Purchase 
    19-2 EFFECT OF AGING ON PULL STRENGTH OF SnPb, SnAgCu, AND MIXED SOLDER JOINTS IN PERIPHERAL SURFACE MOUNT COMPONENTS A. Choubey, D. Menschow, S. Ganesan, M. Pecht Abstract Purchase 
    19-1 SUPPLY CHAIN DATA EXCHANGE FOR MATERIAL DISCLOSURE Mark Myles Abstract Purchase 
    19-1 DEVELOPMENT OF A "SYSTEMS BASED" COMPLIANCE APPROACH TO THE EUROPEAN UNION'S ROHS DIRECTIVE Holly Evans Abstract Purchase 
    19-1 SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES Fay Hua and Carl Deppisch Abstract Purchase 
    19-1 PROCESS AND RELIABILITY ISSUES WITH LEAD-FREE CSP REWORK Arun Gowda et al. Abstract Purchase 
    2005 18-4 RELIABILITY CONSIDERATIONS FOR IMPLANTED MEDICAL ELECTRONICS Anthony Primavera, Ph.D. and Jamie Hoffpauir Abstract Purchase 
    18-4 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER BOARD FINISHES WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez et al. Abstract Purchase 
    18-4 EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al. Abstract Purchase 
    18-4 GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al. Abstract Purchase 
    18-3 SMT GOES FROM MICRO TO NANOSCALE R. Tummala, A. Aggarwal, S. Bansal, and P.M. Raj Abstract Purchase 
    18-3 DESIGN ANALYSIS AND OPTIMIZATION OF WAFER-LEVEL CSP BOARD LEVEL SOLDER JOINT RELIABILITY Tong Yan Tee et al. Abstract Purchase 
    18-3 A STUDY ON MOLDING MATERIAL FOR FLEXIBLE FLIP CHIP CONNECTION S. Lu, T-H. Lin, D. McBride, and F. Andros Abstract Purchase 
    18-3 A RELIABILITY EXAMINATION OF LEAD-FREE QUARTZ CRYSTAL PRODUCTS USING SURFACE MOUNT TECHNOLOGY ENGINEERED FOR HARSH ENVIRONMENTS Todd H. Treichel, CQE Abstract Purchase 
    18-2 NANOTECHNOLOGY AND LOW TEMPERATURE ELECTRONICS ASSEMBLY Alan Rae Abstract Purchase 
    18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract Purchase 
    18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Abstract Purchase 
    18-2 MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS R. Scott Priore, S. Camerlo, and Mark V. Brillhart Abstract Purchase 
    18-1 OPTIMIZING STENCIL DESIGN FOR LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher Abstract Purchase 
    18-1 HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar Abstract Purchase 
    18-1 DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF VERTICAL POWER DEVICES Lars Boettcher et al. Abstract Purchase 
    18-1 DETECTING AND ANALYZING WAFER BUMP VOIDS WITH X-RAY INSPECTION Dr. Udo E. Frank Abstract Purchase 
    2004 17-4 YIELD ENHANCEMENT AND YIELD MODELING FOR MASS REFLOW PROCESS OF 0201 COMPONENTS Susan Lu, Sarah Lam, and Wei-Yun Cheng Abstract Purchase 
    17-4 LEAD-FREE SOLDERING FOR SMT COMPONENTS: A REVIEW OF PROCESSING AND RELIABILITY ISSUES Frank Liotine, Jr., PE Abstract Purchase 
    17-4 COMPONENT RELIABILITY ON METAL-BACKED SUBSTRATES FOR HARSH AUTOMOTIVE ENVIRONMENTS John L. Evans et al. Abstract Purchase 
    17-3 TRENDS IN MEDICAL DEVICE DESIGN AND MANUFACTURING Phil Salditt Abstract Purchase 
    17-3 IMPLANTABLE MEDICAL ELECTRONICS ASSEMBLY QUALITY AND RELIABILITY CONSIDERATIONS Peter Borgesen / Eric Cotts Abstract Purchase 
    17-3 IMPACT OF ADVANCES IN COMPONENT PACKAGING ON MEDICAL DEVICES James Marshall et al. Abstract Purchase 
    17-3 IMPROVING MANUFACTURABILITY, REDUCING COST, AND EXTENDING PRODUCT LIFE - PROCESSES AND PITFALLS UNIQUE TO MEDICAL DEVICES Chris Rozewski and Walter Thomson Abstract Purchase 
    17-2 EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLY S. Bukhari, D.L. Santos, L.P. Lehman and E. Cotts Abstract Purchase 
    17-2 COMPREHENSIVE NUMERICAL AND EXPERIMENTAL ANALYSIS OF MATRIX TFBGA WARPAGE Tong Yan Tee et al. Abstract Purchase 
    17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract Purchase 
    17-2 ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al. Abstract Purchase 
    17-2 TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al. Abstract Purchase 
    17-1 A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA Andrew Mawer, D. Hodges Popps, and G. Presas Abstract Purchase 
    17-1 MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS Dave Nelson and Hector Pallavicini et al. Abstract Purchase 
    17-1 EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al. Abstract Purchase 
    17-1 LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al. Abstract Purchase 
    17-1 ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar Sethuraman Abstract Purchase 
    2003 16-4 AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS Robert Rowland Abstract Purchase 
    16-4 MOISTURE SENSITIVE COMPONENT STORAGE Hiro Suganuma and Alvin Tamanaha Abstract Purchase 
    16-4 THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT PACKAGES B.T. Vaccaro, R.L. Shook, and D.L. Gerlach Abstract Purchase 
    16-4 CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVITY LEVEL AND RELIABILITY OF DEVICES FOR HIGH-REL APPLICATIONS S. R. Martell Abstract Purchase 
    16-3 FAILURE MODE AND EFFECTS ANALYSIS IN ELECTRONICS MANUFACTURING Jayang Patel et al. Abstract Purchase 
    16-3 AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS Sunny Zhang et al. Abstract Purchase 
    16-3 DROP TEST AND IMPACT LIFE PREDICTION MODEL FOR QFN PACKAGES Tong Yan Tee et al. Abstract Purchase 
    16-3 OPTICAL CONNECTOR CONTAMINATION/SCRATCHES AND ITS INFLUENCE ON OPTICAL SIGNAL PERFORMANCE Tatiana Berdinskikh et al. Abstract Purchase 
    16-2 FLUX-LESS / VOID-FREE: AN ENVIRONMENT-FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES Gary Pangelina Abstract Purchase 
    16-2 NANO-OPTICS: NEW OPTICAL STRUCTURES AND LITHOGRAPHY ENABLE STANDARDIZED MANUFACTURING FOR MULTIPLE COMPONENTS Barry J. Weinbaum and Hubert Kostal Abstract Purchase 
    16-2 AUTOMATED PACKAGING OF MEMS DEVICES Joseph S. Bell Abstract Purchase 
    16-2 SURFACE MOUNT OPTICS A NEW APPROACH TO PHOTONIC ASSEMBLY Dr. Steven K. Case Abstract Purchase 
    16-1 ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING Janet E. Semmens and Lawrence W. Kessler Abstract Purchase 
    16-1 REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION Dr. Gerald Pham-Van-Diep et al. Abstract Purchase 
    16-1 A NEW DIMENSION IN STENCIL PRINT OPTIMIZATION Ian Fleck and Prashant Chouta* Abstract Purchase 
    16-1 SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al. Abstract Purchase 
    2002 15-4 IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al. Abstract Purchase 
    15-4 EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL W. T. Chen, R. Y. Tsai, Y. L. Lin, and C. R. Kao Abstract Purchase 
    15-4 COMPONENT TEMPERATURE STUDY ON TIN-LEAD AND LEAD-FREE ASSEMBLIES Matthew Kelly et al. Abstract Purchase 
    15-4 FATIGUE PROPERTIES OF Sn/3.5Ag/0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION J. Oliver, M. Nylén, O. Rod, C. Markou Abstract Purchase 
    15-3 CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS Jodi Roepsch, Robert Champaign, Marlin Downey Abstract Purchase 
    15-3 EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS Daryl Santos et al. Abstract Purchase 
    15-3 RELIABILITY ASSESSMENT OF FLIP CHIP ON LAMINATE CSP Julia Y. Zhao, Ph.D. Abstract Purchase 
    15-3 DEVELOPMENT AND APPLICATION OF A PRESS-PIN/PTH RELIABILITY MODEL A. Kulkarni et al. Abstract Purchase 
    15-2 A STUDY OF MICROSTRUCTURAL CHANGE OF LEAD-CONTAINING AND LEAD FREE SOLDERS Hans-Juergen Albrecht Abstract Purchase 
    15-2 LAND GRID ARRAY PACKAGING TECHNOLOGY IN PORTABLE ELECTRONICS Arni Kujala Abstract Purchase 
    15-2 STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS Vern Solberg Abstract Purchase 
    15-2 ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES Ji Wu and Michael Pecht Abstract Purchase 
    15-1 THE NEW MILLENNIUM FOR CCGA - BEYOND 2000 I/O Marie S. Cole Abstract Purchase 
    15-1 ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION VS. VECTORAL IMAGING Mark J. Norris Abstract Purchase 
    15-1 RAPID QUALIFICATION OF CSP ASSEMBLIES BY INCREASE OF RAMP RATES AND CYCLING TEMPERATURE RANGES Reza Ghaffarian Abstract Purchase 
    15-1 e-MANUFACTURING SOFTWARE FOR PRODUCT AND PROCESS REAL-TIME MONITORING Hersh Kohli, Ranjan Chatterjee, and Dan Kauss Abstract Purchase 
    15-1 LOW COST SOLDER BUMPING VIA PASTE REFLOW Dr. Benlih Huang and Dr. Ning-Cheng Lee Abstract Purchase 
    2001 14-4 EVALUATING SOLDER JOINT FATIGUE RELIABILITY BY MOIRÉ INTERFEROMETRY Cemal Basaran Abstract Purchase 
    14-4 IMPROVING PCBA SOLDERABILITY BY DESIGN Dale Lee Abstract Purchase 
    14-4 RELIABILITY OF ELECTRICALLY CONDUCTIVE ADHESIVES AS A SUBSTITUTE FOR LEAD BASED SOLDER IN MILITARY, AUTOMOTIVE, AND HIGH STRESS ENVIRONMENTS Frank Liotine Abstract Purchase 
    14-4 WETTABILITY ANALYSIS FOR C4 OLGA PACKAGE Jinlin Wang Abstract Purchase 
    14-3 A SMORGASBORD OF PACKAGES – PETITE AND LIGHT Dr. Ken Gilleo Abstract Purchase 
    14-3 AUTOMATING OPTOELECTRONIC PACKAGING Bryan Pate Abstract Purchase 
    14-3 SURFACE MOUNTABLE PACKAGE (OPTOBGA TM) FOR 10G DATA LINK Yuji Kishida Abstract Purchase 
    14-3 OPTOELECTRONIC PACKAGING TECHNOLOGIES FOR FUTURE TELECOMMUNICATION SYSTEMS IN JAPAN Hideyuki Takahara Abstract Purchase 
    14-2 FLIP-CHIP AND GAAS : A ROUTE FOR RF PACKAGING Claude Drevon Abstract Purchase 
    14-2 IC AND MEMS TRENDS AND RELIABILITY Reza Ghaffarian, Ph.D. Abstract Purchase 
    14-2 CIRCUIT CONSTRUCTIONS AND MATERIAL SELECTIONS OF FLEX CIRCUITS FOR HIGH DENSITY INTERCONNECTS Dominique Numakura Abstract Purchase 
    14-2 INTERCONNECTIONS IN 3 DIMENSIONS FOR HIGH SPEED COMPONENTS Christian Val Abstract Purchase 
    14-1 ELECTROLESS Ni-P/Pd/Au PLATING FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa Abstract Purchase 
    14-1 AIRCRAFT FLIGHT TESTS AND RELIABILITY IMPROVEMENTS OF MEMS PRESSURE SENSOR ASSEMBLY Dr. Namsoo Kim Abstract Purchase 
    14-1 AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer Abstract Purchase 
    14-1 EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V.Srirama Sastry Abstract Purchase 
    2000 13-4 EFFECTS OF NEMI Sn/Ag/Cu ALLOY ASSEMBLY REFLOW ON PLATED THROUGH HOLE PERFORMANCE John J. Davignon Abstract Purchase 
    13-4 IMPACT OF HIGHER MELTING LEAD-FREE SOLDERS ON THE RELIABILITY OF PRINTED WIRING ASSEMBLIES Dr. Laura J. Turbini Abstract Purchase 
    13-4 ISSUES AND SOLUTIONS TO IMPLEMENTING LEAD FREE SOLDERING Lee Whiteman Abstract Purchase 
    13-4 TIN WHISKER GROWTH AND PREVENTION Yun Zhang, et al. Abstract Purchase 
    13-3 INLINE FLUX VOLUME MEASUREMENT FOR CSP PROCESS CONTROL Stacy Kalisz Abstract Purchase 
    13-3 AUTOMATING UNDERFILL FOR NON-TRADITIONAL PACKAGES, SECONDARY CSP UNDERFILL, STACKED DIE, AND NO-FLOW UNDERFILL Al Lewis Abstract Purchase 
    13-3 AUTOMATION & CONTROL OF THE SURFACE MOUNT PROCESS Neil Douglas Abstract Purchase 
    13-3 WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY Dr. Shelgon Yee and Dr. Paul Wang Abstract Purchase 
    13-2 APPLICATION OF MICROELECTRONIC DEVICES FOR PACKAGE-INDUCED STRESS MEASUREMENT Tung-Sheng Chen Abstract Purchase 
    13-2 PROCESS 'OPTIMIZATION' USING DESIGNED EXPERIMENTS IN AN EMS PROVIDER'S FACILITY Sandeep Tonapi Abstract Purchase 
    13-2 A VISION OF ELECTRONICS IN THE 21st CENTURY Toru Ishida Abstract Purchase 
    13-2 ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada Abstract Purchase 
    13-1 CSP ASSEMBLY RELIABILITY: COMMERCIAL AND HARSH ENVIRONMENTS Namsoo P. Kim Abstract Purchase 
    13-1 PROCESS OPTIMIZATION FOR 1.0 MM PITCH CBGA Marie Cole Abstract Purchase 
    13-1 ENVIRONMENTAL ISSUES IN ELECTRONICS ASSEMBLY Greg Munie Abstract Purchase 
    13-1 EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson Abstract Purchase 
    1999 12-4 REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow Abstract Purchase 
    12-4 NEW GENERATION METALLIC SOLDERABILITY PRESERVATIVES Donald P. Cullen Abstract Purchase 
    12-4 RELIABILITY EXPERIMENTS FOR DIFFERENT MICROVIA CONSTRUCTIONS Lavanya Gopalakrishnan Abstract Purchase 
    12-4 IMPLEMENTING LEAD FREE SOLDDERING - EUROPEAN CONSORTIUM RESEARCH Dr. Malcolm Warwick Abstract Purchase 
    12-3 SURFACE MOUNT CERAMIC CHIP CAPACITOR RELIABILITY IN A HIGH VOLTAGE ENVIRONMENT Frank Liotine, Jr. Abstract Purchase 
    12-3 INTERCONNECT RELIABILITY OF MICRO BGA AND CHIP SCALE PACKAGES M. Avery et al. Abstract Purchase 
    12-3 CAN CIM IMPROVE OVERALL FACTORY EFFECTIVENESS? Douglas Scott Abstract Purchase 
    12-3 CSP SELF-CENTERING ASSESSMENT USING OFFSET NORMALIZATION METHODOLOGY Dr. Paul P.E. Wang and Dr. Katsuji Takasu Abstract Purchase 
    12-2 SOLDER JOINT RELIABILITY OF ChipArray BGA Ahmer Syed and Tony Panczak et al. Abstract Purchase 
    12-2 Ultra CSP: A WAFER-LEVEL PACKAGE Peter Elenius Abstract Purchase 
    12-2 CHOOSING THE CORRECT CHIP SIZE PACKAGE FOR THE RIG Marc Papageorge Abstract Purchase 
    12-2 CONSIDERATIONS FOR PRACTICAL IMPLEMENTATION OF CSP James Rathburn Abstract Purchase 
    12-1 ADVANCES IN CHIP SCALE PACKAGES AND TOOLS Ron Bauer and James Malatesta Abstract Purchase 
    12-1 PACKAGE-TO-BOARD INTERCONNECTION AND RELIABILITY OF BGA PACKAGES OVER EXTENDED TEMPERATURE RANGE* Puligandia Viswanadham et al. Abstract Purchase 
    12-1 SOLDER JOINT RELIABILITY OF THE BLP PACKAGE Kwang-Seong Choi et al. Abstract Purchase 
    12-1 FACTORS THAT AFFECT VOID FORMATION IN BGA ASSEMBLY Anthony A. Primavera et al. Abstract Purchase 


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