The Charles Hutchins Educational Grant, co-sponsored by the SMTA and
Circuits Assembly magazine, was established in memory of past SMTA president and industry colleague Dr. Charles Hutchins.
Chapter Challenge The SMTA recently announced that for 2008 they will match "dollar for dollar" each donation made by a chapter (up to $1,000 per chapter) to the Hutchins Grant.
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The $5000 grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field.
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The 2008 recipient, Lei Nie, a graduate student in the field of mechanical engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
Lei has a Bachelor of Material Science and Engineering from Tsinghua University and now works as a Graduate Research Assistant at the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland under the guidance of Faculty Advisor, Dr. Michael Pecht.
Ms. Nie's research work involves two main parts: the quality control and reliability analysis of reballed parts and assemblies using different reballing methods, and quality and reliability evaluations of BGA assemblies after multiple rework processes. Her research work is state-of-the-art as very little information is available on the reliability of reballed parts and assemblies, especially after multiple rework processes.
The award is presented annually at the SMTA Annual Meeting during the SMTA International Conference.
PAST RECIPIENTS:
2007
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Gayatri Cuddalorepatta
University of Maryland
(College Park, MD)
"Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
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2006
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Sungchul Joo
Georgia Institute
of Technology
(Atlanta, GA)
"Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
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2005
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Leila Janessari Ladani
University of Maryland
(College Park, MD)
"Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
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2004
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Brian McAdams
Lehigh University
(Bethlehem, PA)
"Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
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2003
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Andrew Perkins
Georgia Institute
of Technology
(Atlanta, GA)
"Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
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2002
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Arun Gowda
Binghamton University
(Binghamton, NY)
"High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
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2001
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Renzhe Zhao
Auburn University
(Auburn, AL)
"Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
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2000
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Jennifer Venton
Georgia Institute
of Technology
(Atlanta, GA)
"Flip Chip on Flex for Low Cost Electronic Packaging"
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1999
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Anita Sargent
Binghamton University
(Binghamton, NY)
"The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
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1998
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Daniel Lewis
Lehigh University
(Bethlehem, PA)
"Solidification of Ternary Alloys"
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HUTCHINS GRANT COMMITTEE
Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Microelectronics
David Forshner, C-Vision Limited
Tim Ginzburg, Celestica Inc.
Glen Herzog, Fairfield Industries
R. Wayne Johnson, Ph.D., Auburn University
Jason Keeping, P.Eng., Celestica Inc.
Robert Kinyanjui, Ph.D, Sanmina-SCI Corp.
Michael P. Levesque, Engineered Systems Inc.
Steven Lustig, LSI Corporation
Randy D. Schueller, Ph.D., DfR Solutions Inc.
Steve Stach, Austin American Technology Corp.
Laura J. Turbini, Ph.D., Research in Motion
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