The Charles Hutchins Educational Grant, co-sponsored by the SMTA and
Circuits Assembly magazine, was established in memory of past SMTA president, educator, and industry colleague, Dr. Charles Hutchins.
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The $5000 grant has been presented annually since 1998 to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field.
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The 2009 recipient, Zhaozhi Li (George), a graduate student in Industrial and Systems Engineering at Auburn University in Auburn,
Alabama, has been selected by the SMTA Grant Committee for his project
entitled "Design, Processing and Reliability Characterizations of 3D
Wafer Level Chip Scale Packaging Technology".
George is a researcher in the area of electronics manufacturing and
packaging with his faculty advisor, Dr. John L. Evans. During his tenure
at Auburn, he has been involved with several applied research programs
through Auburn's Center for Advanced Vehicle Electronics (CAVE). In
particular, George worked in printed circuit board qualification for
automotive applications, reliability packaging and testing for QFN and
micro-BGA packages for harsh environments applications, and module level
overmolding reliability and thermal performance for automotive
electronics. His main topic toward PhD is the research and development
of novel 3D Wafer Level Chip Scale Packaging Technology that leverages
the fine pitch flip chip process and high throughput, cost-effective
wafer level packaging.
George received his MISE degree from Auburn University in 2009 and has a
Master of Science in Electrical Engineering from Shanghai Jiao Tong
University in China and an undergraduate degree in Electrical
Engineering from North China Electric Power University.
The award was presented at the SMTA Annual Meeting during the SMTA International Conference in San Diego, California, October 4-8, 2009.
PAST RECIPIENTS:
2008
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Lei Nie
(CALCE) University of Maryland
(College Park, MD)
"Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process"
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2007
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Gayatri Cuddalorepatta
University of Maryland
(College Park, MD)
"Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach"
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2006
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Sungchul Joo
Georgia Institute
of Technology
(Atlanta, GA)
"Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Approach Using Nano-Particle Metal"
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2005
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Leila Janessari Ladani
University of Maryland
(College Park, MD)
"Effect of Voids Caused By Manufacturing Variation on the Thermo-mechanical Durability of Sn3.8Ag0.7Cu Solders"
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2004
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Brian McAdams
Lehigh University
(Bethlehem, PA)
"Sub-critical Initiation of Delaminations at the Underfill/ Passivation Interface in Flip-chip Assemblies"
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2003
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Andrew Perkins
Georgia Institute
of Technology
(Atlanta, GA)
"Investigating the Combination of High and Low Cycle Fatigue on Solder Joints"
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2002
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Arun Gowda
Binghamton University
(Binghamton, NY)
"High I/O Area Array Devices and Stacked CSPs-Issues in Assembly and Reliability"
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2001
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Renzhe Zhao
Auburn University
(Auburn, AL)
"Wafer Applied Reworkable Fluxing Underfill for Direct Chip Attach"
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2000
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Jennifer Venton
Georgia Institute
of Technology
(Atlanta, GA)
"Flip Chip on Flex for Low Cost Electronic Packaging"
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1999
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Anita Sargent
Binghamton University
(Binghamton, NY)
"The Mechanism of Electroless Gold Plating Using Dimethylamineborane Baths for Electronic Packaging Applications"
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1998
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Daniel Lewis
Lehigh University
(Bethlehem, PA)
"Solidification of Ternary Alloys"
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HUTCHINS GRANT COMMITTEE
Laura J. Turbini, Ph.D., Chair, Research in Motion (Canada)
Tom Borkes, The Jefferson Project
Marie S. Cole, IBM Microelectronics
Ravi Doraiswami, Ph.D., University of Maryland-CALCE
Tim Ginzburg
Glen Herzog, Fairfield Industries
R. Wayne Johnson, Ph.D., Auburn University
Jason Keeping, P. Eng., Celestica Inc. (Canada)
Robert Kinyanjui, Ph.D., Sanmina-SCI Corporation
Michael P. Levesque, Engineered Systems Inc. (Canada)
Steven Lustig, LSI Corporation
Randy D. Schueller, Ph.D., DfR Solutions Inc.
Steve Stach, Austin American Technology Corporation
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