Surface Mount Technology Association
Member Log On
 Member ID 
 Password     
Forgot Password/ID?
 
 
 
      
 

 


Educational Opportunity One of the ways SMTA enables its members to achieve professional success is by providing unparalleled educational programs and events. Read the brief descriptions below of the respective links on the left nav bar.

SMTA International: The association's annual conference, which features exhibit opportunities, courses, paper sessions, panel discussions, lectures, and other special events.
The Pan Pacific Symposium: An international event with exhibit opportunities, special events, and paper sessions on microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly.
The International Wafer-Level Packaging Conference (IWLPC): Sponsored jointly by Chip Scale Review magazine and the SMTA, the IWLPC and Tabletop Exhibition tracks leading-edge IC packaging and test technologies with special emphasis on 3D stacked packaging.
The Academy Program: Half- and full-day courses that are intended to target audiences with offerings tailored for the local professionals of a particular geographic area.
Symposia: Events that focus on one general topic that do so by paper sessions, panel discussions, lectures, and related special events.
Chapter Tutorials: Like the Academy Program, these are tailored locally but feature just one speaker addressing the chosen topic.
Chapter News: A summary of events planned independently by local SMTA officers, including anything from technical presentations and facility tours to networking events and golf outings.
On-line Presentations: 90-minute broadcasts using telecon audio, Web file downloads, and email for submitting questions, featuring speakers on specific, timely topics.

See below for opportunities to present your research during an SMTA event.
Submit an article to the SMTA director of communications & IT for the SMTA Journal.

Also search the Knowledge Base of nearly 2000 technical articles of the type featured at SMTA events.
Browse the Bookstore for examples of proceedings that have been produced at SMTA events.



 
CALL FOR PARTICIPATION
Leaders Learning from Leaders

Consider submitting an abstract for an upcoming SMTA educational program. See conference choices below.

All submissions must be non-commercial in nature and focus on technology research rather than a company product.
Please note: Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a written manuscript for the proceedings.



Call for Papers: International Conference on Soldering and Reliability

May 20-22, 2009
Toronto, Ontario, Canada


The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. The European Union’s directive on lead-free electronics which became a reality on July 1, 2006 complicates that with the variety of alloy choices, component compatibility and mixed-solder concerns. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada in 2007 and 2008, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

Suggested topics to be covered include:
  • SnPb with lead-free components
  • Reliability
  • Harsh Environment
  • Tin Whiskers
  • New Alloys
  • Electromigration
  • Thermal dissipation
  • Manufacturing Process
  • Package on Package
  • Advanced Packaging
  • Halogen-Free Laminates
  • High Density Interconnects
  • Thermal Interface Materials
  • Underfill
  • THE DEADLINE FOR ABSTRACTS IS JANUARY 16, 2009.

    If you would like to present at this conference, please submit a 200-300 word abstract to Melissa Serres Marx at melissa@smta.org. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February, 2009. Technical papers are required and will be due on April 7, 2009.

    The conference is sponsored by the SMTA Toronto Chapter.

    Questions? Please contact:
    Melissa Serres Marx, Conference Coordinator
    Phone: 952-920-7682
    Email: melissa@smta.org




    AIMS Harsh Environment Electronics Symposium
    (covering Automotive, Industrial, Military & Space)

    The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 5-6, 2009. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space. We are soliciting abstracts that will provide NEW and TIMELY INFORMATION to attendees on the LATEST DEVELOPMENTS in these areas. The symposium format will allow a significant amount of time for interaction and questions.

    AIMS Harsh Environment Electronics Symposium
    October 5-6, 2009
    The Town & Country Resort and Convention Center, San Diego, CA
    In conjunction with SMTA International


    Specific subject areas include, but are not limited to, those included below:

  • Semiconductor Technology
  • Substrate Advancements
  • Connectors and Interconnect Technology
  • Lead-Free Implementation
  • Tin Whiskers
  • Corrosion
  • Advancements in Materials
  • Next Generation Harsh Environment Automotive Systems
  • Solar Electronics
  • Latest Developments in Thermal Cycle Testing for Extreme Environment Electronics
  • Substrate Surface Finishes for Harsh Environment Applications
  • Chemical, Thermal and Vibration Considerations for Industrial Electronics
  • Reliability (HALT, ESS, HASS)
  • Operating Environments for Military Electronics (land, sea, air and space)


  • Four of the six symposium sessions will require PRESENTATIONS ONLY. Speakers in these sessions will need to submit a powerpoint presentation for inclusion in the program proceedings. The remaining two sessions will require technical papers which will be included in the proceedings.

    DEADLINE FOR ABSTRACTS: March 27, 2009

    Please provide a 200-300 word abstract to the conference coordinator Melissa Serres Marx. Abstracts can be submitted via email as a Word document attachment or uploaded to the Web site from the "Upload Abstract" button above.

    Please include the following contact information with abstract: Name, Company, Mailing Address, Telephone Number, Fax Number, E-Mail Address, and Presentation Title.

    Questions? Please contact:
    Melissa Serres Marx, Conference Coordinator
    Phone: 952-920-7682
    Email: melissa@smta.org


     


    Home | Site Map | Update Your Info | Related Links | Feedback | Contact Us | Privacy Policy | Top

    Copyright © 1999-2008 SMTA, All rights reserved.
    Reproduction in whole or in part without permission is prohibited.
    SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819