Surface Mount Technology Association
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CTP Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region. The purpose is to address the latest information or most recent issues on a specific technology.


Cancellation Policy: Registration fees will be refunded (less a $50 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.


Space Coast Chapter Tutorial Program

"Implementing “Bleeding Edge” SMT Technology"

Instructor: Phil Zarrow, ITM Consulting
Location: MC Assembly
2755 Kirby Cir NE
Palm Bay, FL 32905
Date: Thursday, February 5, 2009
Time: 9:00AM - 5:00PM


Cost: The cost is $200/$275 for SMTA members/non-members, and a one-year individual SMTA membership is included in the non-member price.

If you have questions, please contact SMTA chapter coordinator Sara Brazeau.

Course Objectives:
The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays (or no lead packages) and highdensity CSPs and Flip-chips. Yet, manufacturing PCBAs with these “bleeding edge” components is not insurmountable, (though not for the weak of hear). This advanced course is intended to provide the experienced participant with a thorough yet practical approach towards dealing with the most challenging of component packages. The very latest and best methodologies and philosophies regarding process optimization will be presented and discussed. Optimizing the SMT assembly process, as it pertains to very small and high-density components will thus be covered, step by step including DFM guidelines, solder paste, Screen/Stencil Printing, Component Placement, Reflow, Inspection and Rework. The impact of lead-free and RoHS compliance will, of course, also be discussed. Case studies based upon the instructor’s experience will be presented.

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are experienced in SMT assembly and want to further their expertise in implementing and optimizing the incorporation of Very Small Passives and high-density ICs in their SMT assembly processes.

ABOUT THE INSTRUCTOR
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with VitronicsCorporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. In 1991, Phil began working for GSS/Array Technology, an EMS provider located in San Jose,CA. During his tenure as Director of Technology Development for GSS/Array Technology, Mr.Zarrow was responsible for specifying and setting up medium and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. Since forming ITM in 1993, Phil Zarrow has helped numerous clients in such areas as: SMT Implementation and Assembly facility set-up Lead-free Process Implementation and Optimization Manufacturing yield improvement Equipment Evaluation and Selection No-clean solder paste evaluation and process implementation SMT Manufacturing Process Audits and process improvement On-site training for all levels of personnel Design for Manufacturability (DFM) specification development Reflow of Through-hole feasibility, development and implementation Implementation of BGA, CSP and Flip-Chip SMT process equipment benchmark testing and evaluation SMT product development Technical evaluations related to business acquisitions and mergers Technical assistance in legal disputes Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of "SMT Glossary - Terms and Definitions", an industry reference book. Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders Award(2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and is the author of the award winning "On the Forefront" and "Better Manufacturing" columns.

Cancellation Policy
Registration fees will be refunded if written notice is postmarked TWO WEEKS prior to the class date. "No Shows" WILL NOT be refunded in order to cover expenses incurred. If someone will be going in your place, please advise the SMTA as soon as possible.

Registrations are being taken through the SMTA Online Registration System.


 


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