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Chapter Tutorial Programs (CTP's) are one-day technical events hosted by local chapters that feature a single instructor on a topic that is suited to that particular region.
The purpose is to address the latest information or most recent issues on a specific technology.
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Oregon DFX Chapter Tutorial Program - Beaverton, OR Location
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Instructor: Dale Lee, Plexus
June 12, 2012
8:30 a.m. - 4:00 p.m.
Tektronix
14200 SW Karl Braun Drive
Beaverton, OR 97077 | Price:
Members $200 (US)
Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
Oregon Chapter Officers $100
Student Chapter Members $50
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Introduction:
Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.
As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.
As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.
This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.
What you will learn:
Introduction
Elements of Design Process Establishing a DFX Program
DFA Program Structure, How To Measure Success
DFX Types/Listing - Concurrent vs Serial
Definition of Program Parameters - Volumes, Location, Etc.
DFM Global Impacts - Electronics, Plastics, Metals, Coatings
Assembly Process Definition - PCA, HLA Global Product Design Elements
Manufacturing Environment, Design Documentation, Cultural Component Selection
Package Types, Assembly Process PCB Design Impacts
PCB Fabrication Panel Utilization
PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design Through Hole Solder Design Impacts
Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
Solder Mask, Tooling Design, Copper Dissolution SMT Solder Design Impacts
Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design Process Control Impacts
Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage Cleaning Impacts
Compatibility Issues, Low Stand-off Components
Who should attend:
This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.
About the Instructor:
Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.
Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.
Contact Karen Frericks at 952-920-7682 with questions.
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Oregon DFX Chapter Tutorial Program - Redmond, WA Location
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Instructor: Dale Lee, Plexus
June 14, 2012
8:30 a.m. - 4:00 p.m.
Physio-Control
11811 Willows Road NE
Redmond, WA 98073 | Price:
Members $200 (US)
Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
Oregon Chapter Officers $100
Student Chapter Members $50
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Introduction:
Electronic system designs are increasingly dependent upon capabilities of multiple skilled individuals and electronic software tools for the creation, simulation, design, manufacture and test. In the past, companies were vertically integrated with internal design, manufacturing, inspection, test and in some cases component manufacturing. With these capabilities in a single facility, DFM issues or questions could be resolved with a review of an internal guideline, a few simple phone calls or meetings with the appropriate organization. As design complexity increased, the use of design specialists and specialized EDA and CAD tools increased at the same time when many corporations were beginning to outsource manufacturing, test and physical design of their products to service providers.
As product technology continued to decrease in size (length, width, thickness), interconnection density per unit area increased (thinner PCB's, smaller lines & spaces), functional performance increased (thermal, mechanical, electrical), the complexity of "ability" design increased in importance and specialized.
As a result, traditional DFM programs have transformed into DFX to address this increase in scope to topics and specialization. Depending on the complexity of the product under design, these programs can consist of a few key individuals or organizations working together to formalize complex teams spanning many organizations and companies.
This course will provide an introduction into the major elements for establishing a DFX program, major elements of mechanical and printed circuit board design, assembly process design, inspection/test design and software verification tools including examples of opportunities and demonstrations.
What you will learn:
Introduction
Elements of Design Process Establishing a DFX Program
DFA Program Structure, How To Measure Success
DFX Types/Listing - Concurrent vs Serial
Definition of Program Parameters - Volumes, Location, Etc.
DFM Global Impacts - Electronics, Plastics, Metals, Coatings
Assembly Process Definition - PCA, HLA Global Product Design Elements
Manufacturing Environment, Design Documentation, Cultural Component Selection
Package Types, Assembly Process PCB Design Impacts
PCB Fabrication Panel Utilization
PCB Material Selection, Component/PCB Warpage, SMT Pad Size & Escape Routing, Via/Micro-via, Solder Mask Opening
Location (Via in Pad), PCB/Component Lead Finish Issues, High Density Design Through Hole Solder Design Impacts
Lead Free Solder, Thermal Connections, Pad Shape, Thieving Pad Design, Lead Protrusion,
Solder Mask, Tooling Design, Copper Dissolution SMT Solder Design Impacts
Thermal Balance, Trace Routing, Equipment Limitation/Tolerance, PCB/PCB Array Tolerance, Process Tooling Design Process Control Impacts
Paste Volume, Thermal Shock SMT & PTH, Reflow Process Warpage Cleaning Impacts
Compatibility Issues, Low Stand-off Components
Who should attend:
This event is ideally suited to new and experienced PCB/PCBA designers, manufacturing and process engineers, quality and inspection staff, production operators and any members of staff tasked with looking at yield monitoring and process improvements. Managers and supervisors would also benefit from a fuller understanding of the issues currently being experienced in industry.
About the Instructor:
Dale is a Staff DFX Process Engineer with Plexus Corporation primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over twenty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFX analysis of flex & rigid PCB/PCBA's including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications.
Dale has authored, instructed and spoken frequently on advanced SMT packaging, PCB and SMT design, assembly, DFX and rework. He is a past recipient of the Surface Mount Technology Association's "Excellence in Leadership" award.
Contact Karen Frericks at 952-920-7682 with questions.
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Dallas BGAs & BTCs Chapter Tutorial Program
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Instructor: Ray Prasad, Ray Prasad Consultancy Group
September 19, 2012
9:00 a.m. - 4:30 p.m.
Variosystems
901 S. Kimball Ave.
Southlake, TX 76092 | Price:
Members $200 (US)
Non-Members $275 (US) a one-year individual SMTA membership is included in the non-member price.
Dallas Chapter Officers $100
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Introduction:
There is no doubt that lead free has impacted on almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronics products and equipment including the military and medical industry, especially those who must deal with backward and forward compatibility issues (which means most of us).
Learn how to resolve issues for an effective implementation of BGAs and Bottom Terminations surface mount components such as QFN, DFN and MLF in a lead free world at a lower cost and higher yield.
Designing for BGA and BTC can involve trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies and fast growing use of BGAs and BTCs on the same board with some conflicting process requirements to achieve higher yield.
The objective of this course is to identify the design and process issues in BGAs and BTC and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free.
This is not a theoretical course; it is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients. This course deals with "real-world" problems in lead free implementation. This course also brings up to date information on BGA and BTC based on the recent IPC standards on BGA (IPC 7095) and BTC (IPC-7093) chaired by Ray.
How You Will Benefit - After completing this course you will be able to:
Get an overview of various types of BTCs such as QFN, MLF, LGA etc followed by Technical details on BTC design, assembly and reliability issues Get an Overview of various Types of BGAs and their Pros and Cons Troubleshoot BTC and BGA design and manufacturing problems Get a handle on how to deal with some critical but conflicting process optimization requirement for BGAs and BTCs on the same board. Understand how to deal with some major quality issues such as voids, Head on Pillow, Backward Compatibility and Pad Cratering Determine best way to deal with backward and forward compatibility situations (Lead Free and tin-lead components on the same board) Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment
Topics Covered:
Introduction
Types of BTCs & BGAs Pros and Cons of BTCs & BGAs BTC & BGA Package Manufacturing Process
Major Design Considerations for BTCs & BGAs
Laminates and Surface Finish Considerations Land Pattern and Stencil Design Guidelines Component considerations
Assembly Process Guidelines for BTCs & BGAs
Solder Paste Printing Reflow Process Guidelines BTC & BGA Solder Joint Quality Requirements Major Issues in Answers in BTCs & BGAs • Finding the Fine Balance between Voids and Opens • Head on Pillow • Pad Cratering • Backward and Forward Compatibility BTC and BGA Rework Processes
Key strategies in design and manufacturing processes to prevent field returns
Who should attend?
The target audiences for this course are managers, design, process and quality engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those are using or considering tin/lead or lead-free processes for assembly of BTCs and BGAs.
Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of design and manufacturing issues in BTCs and BGAs for building assemblies in-house or at a subcontractor will benefit from this course.
About the Instructor:
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
Mr. Prasad has helped many clients successfully implement SMT/BGA/BTC (Surface Mount Technology/Ball Grid Arrays/Bottom Termination Components) and improve their manufacturing yield. He has developed extensive on-site training for all organizational levels and has provided technical expertise in legal disputes.
In his consulting practice, Mr. Ray Prasad provides SMT solutions for management action. This includes SMT/RoHS/BGA/BTC assembly vendor selection and qualification, expert witness in legal matters, technical assessment for merger and acquisition and workshops in all aspects of SMT, fine pitch, BTC and BGA. He also helps companies build self-sustaining infrastructure in areas such as in-house engineering and operator training, process improvement and equipment selection and evaluation.
Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a Lead Engineer at that company.
Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA”. He is also the Co-Chairman of IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF. Ray is the past chairman of the Surface Mount Land Pattern (IPC-SM-782, now IPC 7351) and Package Cracking (J-STD-020) committees. He is a columnist for the SMT magazine and also serves on its advisory board.
Contact Karen Frericks at 952-920-7682 with questions.
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